Abstract: A surface-mounted multilayer capacitor and a printed circuit board having such a capacitor. The capacitor comprises a multilayer of electrodes and dielectric layers which are alternately stacked. End contacts of the electrodes consist of a thin sprayed-metal layer and a U-shaped cap which engages the capacitor in a clamping manner. The sprayed-metal layer and the cap can contact each other electrically via a solder layer. Preferably, the sprayed-metal layer is impregnated with a thermocuring synthetic resin and the synthetic resin is removed from a part of the sprayed-metal layer. The capacitor preferably comprises coating layers which are cemented to the multilayer by means of an adhesive layer.