Abstract: A process for manufacturing a cookware article is described comprising the steps of forming, surface hardening, oxidizing and electroforming of very hard silver or silver alloys to coat the interior part of the article. Silver ensures antibacterial and antiviral properties, improved thermal conductivity allowing to cook under the cracking threshold of oils and greases either added to or present in the substances being cooked, inhibits the sticking of food while cooking and facilitates the detachment from the surface of the articles.

Abstract: A process for manufacturing a cookware article is described comprising the steps of forming, surface hardening, oxidizing and electroforming of very hard silver or silver alloys to coat the interior part of the article. Silver ensures antibacterial and antiviral properties, improved thermal conductivity allowing to cook under the cracking threshold of oils and greases either added to or present in the substances being cooked, inhibits the sticking of food while cooking and facilitates the detachment from the surface of the articles.

Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

Abstract: A method and a bath for protecting a Zn or Zn alloy surface against the corrosion and oxidation and for improving the wettability characteristics of a Zn or Zn alloy surface with a Sn solder alloy. The method is particularly useful in the manufacture of electronic components, when the deposition of a thin layer of Zn or Zn alloy is needed before the deposition of the Sn alloy (particularly Pb free) to improve the solderability characteristics of the Cu surface.

Abstract: A method and a bath for autocatalytic chemical deposition of a Sn Zn alloy on a catalytic surface. The method is particularly useful in the manufacture of electronic components, when the deposition of a thin layer of Sn Zn alloy is needed before the deposition of the Sn alloy (particularly Pb free) to improve the solderability characteristics of the Cu surface. The Cu surface must be made catalytic before immersion in the autocatalytic bath, e.g. by depositing a thin film of metallic Sn.

Abstract: An electrodeposition bath for depositing a Sn alloy onto a Cu substrate containing a Zn salt. This bath is particularly useful for Pb free alloy, such as a Sn--Bi alloy. The presence of Zn in the elctrodeposition bath greatly influence the bath behaviour and the characteristics of the deposited alloy, even if no Zn is codeposited on the Cu substrate.

Abstract: A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhances the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn--Bi).