Patents by Inventor Pil-June Kim

Pil-June Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip bonding apparatus
    Patent number: 8042593
    Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: October 25, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheal-Sang Yoon, Yong-Dae Ha, Jae-Ryoung Lee, Jeong-Soon Cho, Bum-Woo Lee, Pil-June Kim
  • SEMICONDUCTOR CHIP BONDING APPARATUS
    Publication number: 20090020229
    Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip a parallel state with a lead frame when applying a bonding load.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 22, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Cheal-Sang YOON, Yong-Dae Ha, Jae-Ryoung Lee, Jeong-Soon Cho, Bum-Woo Lee, Pil-June Kim