Abstract: A method of operating a user device includes: receiving a command from a user to power on the user device, wherein the user device includes information on a restricted zone associated with the user device; detecting, by a monitoring entity of the user device without involvement of any device external to the user device, whether the user device is located within the restricted zone in response to the user device being powered on and before an operating system of the user device is executed; and granting access of the user to the user device by the monitoring entity in response to detecting the user device as being within the restricted zone.

Abstract: A driving route planning method applied to an electronic device is provided. The method includes acquiring an image when a vehicle is driving. Target route information is obtained by inputting the image into a target route planning model. Once a first embedding vector of the target route information is extracted, a driving route corresponding to a driving style is obtained by inputting the first embedding vector into a target driving style model.

Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: The present disclosure provides a movable electric device. The movable electric device includes a movable device body and a contact detection electrode. The movable device body has an electric drive means. The contact detection electrode is mounted on the movable device body. When the contact detection electrode _contacts diffusible dirt, a resistance, capacitance or impedance of the contact detection electrode varies.

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

Abstract: A backlight module includes a light guide plate, a light source, a first prism sheet, and a second prism sheet. The light source is disposed on a light incident surface of the light guide plate. The first prism sheet is disposed on a side of a light exiting surface of the light guide plate and has multiple first prism structures facing the light guide plate. The second prism sheet has multiple second prism structures facing the light guide plate. An included angle between an extending direction of the first prism structures and an extending direction of the second prism structures is greater than or equal to 85 degrees and less than or equal to 95 degrees. An included angle between the extending direction of the second prism structures and the light incident surface is greater than or equal to 85 degrees and less than or equal to 95 degrees.

Abstract: A contact-type detection electrode for detecting dispersible dirt and a movable electric device are provided. The contact-type detection electrode includes a support, and electrical conductors arranged on the support and being flexible.

Abstract: Disclosed is an electronic device having a display region and a peripheral region adjacent to the display region. The electronic device includes a first electrode disposed in the display region, a second electrode disposed in the display region, a circuit module disposed in the peripheral region, a first electrical trace, and a second electrical trace electrically insulated from the first electrical trace. The circuit module is electrically connected to the first electrode through the first electrical trace and provides a first driving voltage to the first electrical trace. The circuit module is electrically connected to the second electrode through the second electrical trace and provides a second driving voltage to the second electrical trace, and the first driving voltage is different from the second driving voltage. In a top view, the first electrical trace at least partially overlaps the second electrical trace.

Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.

Abstract: A semiconductor device includes a substrate; an interconnect structure over the substrate; a first passivation layer over the interconnect structure; a first conductive pad, a second conductive pad, and a conductive line disposed over the first passivation layer and electrically coupled to conductive features of the interconnect structure; a conformal second passivation layer over and extending along upper surfaces and sidewalls of the first conductive pad, the second conductive pad, and the conductive line; a first conductive bump and a second conductive bump over the first conductive pad and the second conductive pad, respectively, where the first conductive bump and the second conductive bump extend through the conformal second passivation layer and are electrically coupled to the first conductive pad and the second conductive pad, respectively; and a dummy bump over the conductive line, where the dummy bump is separated from the conductive line by the conformal second passivation layer.

Abstract: A semiconductor device includes a substrate; an interconnect structure over the substrate; a first passivation layer over the interconnect structure; a first conductive pad, a second conductive pad, and a conductive line disposed over the first passivation layer and electrically coupled to conductive features of the interconnect structure; a conformal second passivation layer over and extending along upper surfaces and sidewalls of the first conductive pad, the second conductive pad, and the conductive line; a first conductive bump and a second conductive bump over the first conductive pad and the second conductive pad, respectively, where the first conductive bump and the second conductive bump extend through the conformal second passivation layer and are electrically coupled to the first conductive pad and the second conductive pad, respectively; and a dummy bump over the conductive line, where the dummy bump is separated from the conductive line by the conformal second passivation layer.

Abstract: A single-axis hinge includes a base, a movable plate, a limiting block, a rotating shaft and a stand set. The base includes a first shaft mounting hole, a stand drive shaft mounting hole and a path. The movable plate is formed with a second shaft mounting hole and a limiting notch. The limiting block is installed in the path. The rotating shaft passes through the first and second shaft mounting holes and includes a driving block and a first cam. An edge of the driving block is formed with a transmission teeth portion not completely surround the edge. The stand set includes a stand drive shaft disposed in the stand drive shaft mounting hole, and a support stand driven by the stand drive shaft. The stand drive shaft includes a gear and a second cam formed with a positioning notch.

Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.

Abstract: A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.

Abstract: A brewing device includes a casing and a water supply mechanism. The water supply mechanism is disposed in the casing. The water supply mechanism includes a ball plate, a rotating base, a driving module, a linkage base, a ball, a linkage rod, a pivot, a water supply nozzle and a fixing rod. The ball plate has a track. The rotating base is disposed at a side of the ball plate. The driving module is connected to the rotating base. The linkage base is disposed on the rotating base. The ball is disposed on the linkage base and abuts against the track. The linkage rod has a first end, a second end and a longitudinal groove. The first end is pivotally connected to the linkage base by the pivot. The water supply nozzle is connected to the second end. An end of the fixing rod is disposed in the longitudinal groove.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the end portion. The first protection cap and the first conductive line are made of different conductive materials, and the first protection cap exposes a peripheral region of a top surface of the end portion. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap.

Abstract: A damp-proof pill box has a container, at least one lid, at least one lock tab, at least one seal ring, and at least one lock part. The container forms at least one storage compartment. The lid is connected to the container and is flippable relative to the container to cover or to open the storage compartment. The lock tab protrudes from an edge of the lid. The seal ring is mounted on an inner surface of the lid. The lock part is pivotally connected to the container. When the lid covers the storage compartment, the seal ring is clamped between the lid and the container, and abuts against a periphery of the opening of the storage compartment to seal the storage compartment. The lock part is capable of engaging with the lock tab to prevent the lid from flipping relative to the container.