Abstract: A method for securing an IT (information technology) system using a set of methods for knowledge extraction, event detection, risk estimation and explanation for ranking cyber-alerts which includes a method to explain the relationship (or an attack pathway) from an entity (user or host) and an event context to another entity (a high-value resource) and an event context (attack or service failure).

Abstract: A fingerprint sensor is provided. The fingerprint sensor includes a multi-layer printed circuit board (PCB), a fingerprint sensing die and a molding compound. The multi-layer PCB includes a bottom dielectric layer, at least one intermediate dielectric layer disposed on the bottom dielectric layer, a top dielectric layer disposed on the intermediate dielectric layer and a trench. The trench is formed by digging out a portion of the intermediate dielectric layer and a portion of the top dielectric layer. The fingerprint sensing die is disposed in the trench of the multi-layer PCB and mounted on an upper surface of the bottom dielectric layer of the multi-layer PCB. The fingerprint sensing die includes a sensing array capable of sensing fingerprint information of a user. The fingerprint sensing die is covered by the molding compound, and the trench of the multi-layer PCB is filled with the molding compound.

Abstract: A fingerprint sensor is provided. The fingerprint sensor includes a multi-layer printed circuit board (PCB), a fingerprint sensing die and a molding compound. The multi-layer PCB includes a bottom dielectric layer, at least one intermediate dielectric layer disposed on the bottom dielectric layer, a top dielectric layer disposed on the intermediate dielectric layer and a trench. The trench is formed by digging out a portion of the intermediate dielectric layer and a portion of the top dielectric layer. The fingerprint sensing die is disposed in the trench of the multi-layer PCB and mounted on an upper surface of the bottom dielectric layer of the multi-layer PCB. The fingerprint sensing die includes a sensing array capable of sensing fingerprint information of a user. The fingerprint sensing die is covered by the molding compound, and the trench of the multi-layer PCB is filled with the molding compound.

Abstract: An electronic device is provided. A first PCB includes a plurality of ground pads. A fingerprint sensor includes a sensing array, an insulating surface disposed on the sensing array, and a second PCB disposed between the sensing array and the first PCB. The sensing array senses fingerprint information of a user. The second PCB includes a substrate having a first surface and a second surface opposite the first surface, a metal trace disposed on the first surface and adjacent to the sensing array, and a plurality of ESD pads disposed on the second surface and coupled to the first ground pads of the first PCB, respectively. When an ESD event occurs, ESD energy is discharged from the metal trace to the first ground pads of the first PCB through a plurality of vias and the ESD pads without passing through the sensing array.

Abstract: An electronic device is provided. A first PCB includes a plurality of ground pads. A fingerprint sensor includes a sensing array, an insulating surface disposed on the sensing array, and a second PCB disposed between the sensing array and the first PCB. The sensing array senses fingerprint information of a user. The second PCB includes a substrate having a first surface and a second surface opposite the first surface, a metal trace disposed on the first surface and adjacent to the sensing array, and a plurality of ESD pads disposed on the second surface and coupled to the first ground pads of the first PCB, respectively. When an ESD event occurs, ESD energy is discharged from the metal trace to the first ground pads of the first PCB through a plurality of vias and the ESD pads without passing through the sensing array.

Abstract: An inductor includes a base device having a parallelepiped chamber formed by two side surfaces and two end surfaces, a parallelepiped conductive device engaged into the parallelepiped chamber of the base device and having a parallelepiped compartment and having two terminals engaged onto an upper surface of the base device, and a core engaged into the parallelepiped compartment of the conductive device. The conductive device is planar and includes a rectangular cross section having a reduced dimension or structure for allowing the inductor to be easily and quickly and attached onto the surfaces of the electric circuit boards with surface mount devices.

Abstract: An inductor includes a base device having a channel, a conductive device having a conductive element engaged into the channel of the base device and having two terminals, and a top device attached onto the base device and engaged with the base device, the top device includes two or more top members engaged with each other. The conductive device includes two side elements extended from the conductive element for engaging onto two end portions of the base device, and the terminals of the conductive device are extended from the side elements of the conductive device respectively. The base device includes a slot for receiving or engaging with the terminals of the side elements.

Abstract: An inductor includes a base member having an upper channel which has a height “H” greater than a width “W” of the upper channel of the base member, a conductive member includes a conductive plate engaged into the upper channel of the base member, and a top member is attached onto the base member and engaged with the base member for solidly retaining the conductive member between the top member and the base member. The conductive member includes one or more side plates extended from the conductive plate for engaging onto the end portion of the base member. The side plate includes an upper panel and a lower panel which has a width “D” greater than a width “d” of the upper panel.