Patents by Inventor Pinche Tsai
Pinche Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11678465Abstract: In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.Type: GrantFiled: November 8, 2018Date of Patent: June 13, 2023Assignee: Hewlett Packard Enterprise Development LPInventors: Kevin Conn, Pinche Tsai, Keith Sauer
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Patent number: 11509079Abstract: Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.Type: GrantFiled: April 6, 2020Date of Patent: November 22, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: Pinche Tsai, Minh Nguyen, David A. Selvidge
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Publication number: 20210352821Abstract: In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.Type: ApplicationFiled: November 8, 2018Publication date: November 11, 2021Inventors: Kevin Conn, Pinche Tsai, Kevin Sauer
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Publication number: 20210313720Abstract: Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.Type: ApplicationFiled: April 6, 2020Publication date: October 7, 2021Inventors: Pinche Tsai, Minh Nguyen, David A. Selvidge
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Patent number: 10925186Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.Type: GrantFiled: May 15, 2019Date of Patent: February 16, 2021Assignee: Hewlett Packard Enterprise Development LPInventors: David A. Selvidge, Pinche Tsai, Minh H. Nguyen
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Patent number: 10866621Abstract: A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.Type: GrantFiled: January 24, 2019Date of Patent: December 15, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: David A. Selvidge, Pinche Tsai, David Scott Chialastri, Minh H. Nguyen
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Publication number: 20200367387Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.Type: ApplicationFiled: May 15, 2019Publication date: November 19, 2020Inventors: David A. Selvidge, Pinche Tsai, Minh H. Nguyen
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Publication number: 20200241609Abstract: A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.Type: ApplicationFiled: January 24, 2019Publication date: July 30, 2020Inventors: David A. Selvidge, Pinche Tsai, David Scott Chialastri, Minh H. Nguyen
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Patent number: 10627877Abstract: Examples described herein include air impeding structures with snap-in tabs. In some examples, an air impeding structure for a processing unit socket cover includes a main body encloses an interior space, a first snap-in tab, and a second snap-in tab. The main body may include a first curved wall at a first end of the main body connected to a second curved wall at a second end of the main body. The first snap-in tab extends below the first end of the main body and is recessed in relation to the first curved wall. The second snap-in tab extends below the second end of the main body and is recessed in relation to the second curved wall.Type: GrantFiled: March 31, 2017Date of Patent: April 21, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: Daniel W. Tower, Pinche Tsai, Kevin F. Labbe, James Jeffery Schulze
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Patent number: 10602640Abstract: In example implementations, a memory cooler is provided. The memory cooler includes a body. The body includes two pieces that are moveable relative to one another. Each piece of the body includes an inlet manifold, an outlet manifold, and a plurality of cold plates extending between the inlet manifold and the outlet manifold. The inlet manifold is to receive liquid coolant from a liquid coolant supply line. The outlet manifold is to return the liquid coolant to the liquid coolant supply line. The liquid coolant flows from the inlet manifold to the outlet manifold through interior channels of the cold plates. The plurality of cold plates of a first piece of the body are interleaved with the plurality of cold plates of a second piece of the body such that slots to receive memory modules are defined between adjacent pairs of cold plates.Type: GrantFiled: November 14, 2018Date of Patent: March 24, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: Pinche Tsai, Minh Nguyen, David A. Selvidge
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Patent number: 10499488Abstract: A liquid-cooled integrated circuit system includes two printed circuit assemblies having removable heat spreaders and cooling pipes coated with a thermal interface material. The two printed circuit assemblies are placed together in opposition such that the top surfaces of the heat spreaders on each printed circuit assembly contacts, and become thermally coupled with, the thermal interface material on the cooling pipes of the other printed circuit assembly. In this arrangement, each printed circuit assembly is cooled by the other.Type: GrantFiled: October 19, 2018Date of Patent: December 3, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Pinche Tsai, Minh H. Nguyen
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Patent number: 10477722Abstract: Examples described herein include socket covers with air impeding structures. In some examples, a processing unit socket cover comprises a base, an air impeding structure, and an engagement latch. The base may have a surface facing away from the socket and a perimeter defined by the surface. The air impeding structure may protrude from the surface and extend from a first side of the perimeter to a second side of the perimeter, diving the surface. The engagement latch may be connected to the air impeding structure to attach to the socket.Type: GrantFiled: September 16, 2016Date of Patent: November 12, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Pinche Tsai, James Jeffery Schulze, Kapil Rao Ganta Papa Rao Bala
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Patent number: 10264696Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member and a lock mechanism. The support member to receive an electronic component. The lock mechanism includes a handle and an engagement member. The handle to connect to the support member and move between a first position and a second position. The engagement member to extend from the support member to engage with a chassis.Type: GrantFiled: November 1, 2013Date of Patent: April 16, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Pinche Tsai, Stephen Spencer, Kevin D. Conn
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Patent number: 10244666Abstract: A blank cartridge includes an impedance portion to control a flow of cooling media through the blank cartridge to a plurality of computing components, and an actuator to change an impedance level of the impedance portion. The actuator receives a control signal to change the impedance level of the impedance portion based on a location of the plurality of computing components relative to the blank cartridge.Type: GrantFiled: February 14, 2014Date of Patent: March 26, 2019Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: Pinche Tsai, Kevin D Conn
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Publication number: 20180283807Abstract: Examples described herein include air impeding structures with snap-in tabs. In some examples, an air impeding structure for a processing unit socket cover includes a main body encloses an interior space, a first snap-in tab, and a second snap-in tab. The main body may include a first curved wall at a first end of the main body connected to a second curved wall at a second end of the main body. The first snap-in tab extends below the first end of the main body and is recessed in relation to the first curved wall. The second snap-in tab extends below the second end of the main body and is recessed in relation to the second curved wall.Type: ApplicationFiled: March 31, 2017Publication date: October 4, 2018Inventors: Daniel W. Tower, Pinche Tsai, Kevin F. Labbe, James Jeffery Schulze
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Publication number: 20180276171Abstract: Examples herein relate to non-volatile memory (NVM) drives. In one example, an NVM drive comprises a housing to support one or more printed circuit assemblies (PCA's), the housing comprising a front portion, a rear portion and a heat sink, a PCA disposed within the housing, the PCA comprising a connector, one or more NVM chips and a controller attached to the one or more NVM chips. The PCA is centered in the housing, the NVM drive is hot-plugged into a fabric attached memory pool or local to a server by the rear portion of the housing, and the NVM drive hot-plugged in the fabric attached memory pool is accessible by the front portion of the housing.Type: ApplicationFiled: March 23, 2017Publication date: September 27, 2018Inventors: John NORTON, Bryan BOLICH, Sarah SILVERTHORN, James Lee ARMES, Matthew NEUMANN, Pinche TSAI, Kevin M. CASH
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Patent number: 9939857Abstract: Examples include a system comprising chassis and hard drive. In some examples, the hard drive has a set of positioning members and the chassis includes a hard drive slot having a guide rail unit to guide the hard drive into the hard drive slot via a positioning member of the set of positioning members on the hard drive. The chassis also includes a latch assembly connected to the hard drive slot to retain and extract the hard drive.Type: GrantFiled: March 20, 2017Date of Patent: April 10, 2018Assignee: Hewlett Packard Enterprise Development LPInventors: Kenny Huy Pham, Ronald Pinche Tsai, Keith A Sauer, Kelly K Smith
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Patent number: 9927834Abstract: Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.Type: GrantFiled: July 30, 2014Date of Patent: March 27, 2018Assignee: Hewlett Packard Enterprise Development LPInventors: Chanh V Hua, Michael Sterns, Kevin D Conn, Pinche Tsai
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Publication number: 20180084669Abstract: Examples described herein include socket covers with air impeding structures. In some examples, a processing unit socket cover comprises a base, an air impeding structure, and an engagement latch. The base may have a surface facing away from the socket and a perimeter defined by the surface. The air impeding structure may protrude from the surface and extend from a first side of the perimeter to a second side of the perimeter, diving the surface. The engagement latch may be connected to the air impeding structure to attach to the socket.Type: ApplicationFiled: September 16, 2016Publication date: March 22, 2018Inventors: Pinche Tsai, James Jeffery Schulze, Kapil Rao Ganta Papa Rao Bala
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Publication number: 20170325363Abstract: A blank cartridge includes an impedance portion to control a flow of cooling media through the blank cartridge to a plurality of computing components, and an actuator to change an impedance level of the impedance portion. The actuator receives a control signal to change the impedance level of the impedance portion based on a location of the plurality of computing components relative to the blank cartridge.Type: ApplicationFiled: February 14, 2014Publication date: November 9, 2017Inventors: Pinche TSAI, Kevin D CONN