Abstract: A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.

Abstract: A liquid crystal display device includes a thin film transistor array disposed on a first region of a panel. An anisotropic conductive film bonds at least one integrated circuit chip and at least one other device, such as a FPC board, a TCP and a COF, to a second region of the panel.

Abstract: A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.

Abstract: A flat display, a flat panel display and a backlight module are disclosed. The flat display module comprises the flat panel display and the backlight module. The flat panel display comprises an upper polarizer and a lower polarizer. The lower polarizer includes a first diffusion layer. The backlight module comprises a light emitting device, a prism sheet and a light guide plate. A light beam is provided by the light emitting device. The prism sheet is one-dimensional prism array structure. The light guide plate includes a second diffusion layer for diffusing the light beam. The first diffusion layer has an optical haze greater than the optical haze of the surface of the upper polarizer. Accordingly, thin thickness and high brightness are achieved for the flat display.

Abstract: A liquid crystal display device includes a thin film transistor array disposed on a first region of a panel. An anisotropic conductive film bonds at least one integrated circuit chip and at least one other device, such as a FPC board, a TCP and a COF, to a second region of the panel.

Abstract: A method for bonding integrated circuit chips and other devices to a liquid crystal display panel. The method involves using a single anisotropic conductive film that is sized to bond at least one integrated circuit chip and at least one other device, such as a flexible printed circuit board, a tape carrier package and a chip-on-film, to the liquid crystal display panel.

Abstract: A conductive line Structure. In one embodiment of the invention, a conductive line includes at least two outer conductive portions, an inner conductive portion between the outer conductive portions, separated from the outer conductive portions by at least two trenches along the conductive line, and at least one connecting portion disposed in each trench connecting the inner conductive portion and the outer conductive portions.

Abstract: A conductive line Structure. In one embodiment of the invention, a conductive line includes at least two outer conductive portions, an inner conductive portion between the outer conductive portions, separated from the outer conductive portions by at least two trenches along the conductive line, and at least one connecting portion disposed in each trench connecting the inner conductive portion and the outer conductive portions.

Abstract: A method for bonding integrated circuit chips and other devices to a liquid crystal display panel. The method involves using a single anisotropic conductive film that is sized to bond at least one integrated circuit chip and at least one other device, such as a flexible printed circuit board, a tape carrier package and a chip-on-film, to the liquid crystal display panel.

Abstract: A semiconductor device, comprising an electrode on a base surface, a bump formed on the electrode, a pad, and a means of connection. The means of connection comprises a plurality of conductive particles, conducting the bump and the pad with conductive particles bonded between. The base surface is further formed with a barrier rib that separates the conductive particles.

Abstract: A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.

Abstract: A semiconductor device, comprising an electrode on a base surface, a bump formed on the electrode, a pad, and a means of connection. The means of connection comprises a plurality of conductive particles, conducting the bump and the pad with conductive particles bonded between. The base surface is further formed with a barrier rib that separates the conductive particles.

Abstract: The present invention is directed to styryl dyes having the formula: wherein D is an electron donating group; Q is an electron acceptor selected from the group consisting of electron acceptors having the formulae: W is an electron accepting group, R3 is selected from the group consisting of substituted or unsubstituted alkyl or substituted or unsubstituted aryl moieties, n is an integer from 0 to 4, A, B, and C are substituents of their rings and are each independently selected from the group consisting of alkyl, alkoxy, hydroxyalkyl, sulfoalkyl, carboxyalkyl, and hydrogen, and Y is a counterion The present invention discloses media and methods for recording data. A three-dimensional matrix including a plurality of dye molecules, such a styryl dye molecule of the present invention, is provided. A first volume element in the matrix is exposed to actinic radiation for a duration and at an intensity effective to alter detectably a fraction between 0.3 and 0.

Abstract: Styryl dyes and compositions which exhibit superior two-photon absorption cross-sections and are useful in two-photon pumped cavity lasing, two-photon pumped upconversion lasing, optical power limiting, optical power stabilization, optical signal reshaping, and infrared beam detection and indication are disclosed. Also disclosed are multiphasic nanostructured composites which include a glass having pores, an optically active coating material on the pore surface, and a polymeric material in the pores. These composites are useful in producing multifunctional optical materials, such as broadly tunable lasers. Methods for killing cells and viruses using a photosensitizer and a two-photon upconverting dye are also described. These methods are especially useful to kill cells and viruses in biological materials, such as in photodynamic therapy of tumors and cancers or blood purification protocols.

Abstract: In the present invention, an iterative process is provided for cone-beam tomography (parallel-beam and fan-beam geometries are considered as its special cases), and applied to metal artifact reduction and local reconstruction from truncated data, as well as image noise reduction. In different embodiments, these iterative processes may be based upon the emission computerized tomography (CT) expectation maximization (EM) formula and/or the algebraic reconstruction technique (ART). In one embodiment, generation of a projection mask and computation of a 3D spatially varying relaxation factor are utilized to compensate for beam divergence, data inconsistence and incompleteness.