Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.

Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.

Abstract: A curved full-array LED light panel, a curved backlight module including the curved full-array LED light panel, and a curved LCD including the backlight module are disclosed. The curved full-array LED light panel includes a flexible reflective sheet and a plurality of LED light bars wherein a plurality of LEDs are disposed. The plurality of LED light bars are attached to a sheet-rear side of the flexible reflective sheet alone a direction parallel to the height direction of the full-array LED light panel, and the plurality of LEDs disposed on the LED light bars are exposed from a plurality of openings of the flexible reflective sheet toward an LCD panel. Along a direction parallel to the width direction of the full-array LED light panel, the flexible reflective sheet is deformed to form a curved reflective surface. Each of the LED light bars further comprises a bar-shaped PCB, and a plurality of LED dimming-zone circuits are disposed on the bar-shaped PCB.

Abstract: A vacuum system for film lamination, including a vacuum chamber module, a film-pressing module, a substrate susceptor module and a hot-plate heating module, is disclosed, wherein the film-pressing module includes a film-pressing platen, and the substrate susceptor module includes a substrate susceptor supported by a spring-loaded mechanism. During a film-lamination process, the film-pressing platen is actuated to move downwards to attach a laminating film onto a substrate, and the substrate susceptor is actuated to move downwards and finally rest on the hot-plate heating module. Therefore an adhesive glue disposed between the laminating film and the substrate can be thermally cured. After completing the film-lamination process, the film-pressing platen is actuated upwards so that the substrate susceptor also is actuated to move upwards to its initial position by a restoring force exerted by the spring-loaded mechanism.

Abstract: A vacuum system for film lamination, including a vacuum chamber module, a film-pressing module, a substrate susceptor module and a hot-plate heating module, is disclosed, wherein the film-pressing module includes a film-pressing platen, and the substrate susceptor module includes a substrate susceptor supported by a spring-loaded mechanism. During a film-lamination process, the film-pressing platen is actuated to move downwards to attach a laminating film onto a substrate, and the substrate susceptor is actuated to move downwards and finally rest on the hot-plate heating module. Therefore an adhesive glue disposed between the laminating film and the substrate can be thermally cured. After completing the film-lamination process, the film-pressing platen is actuated upwards so that the substrate susceptor also is actuated to move upwards to its initial position by a restoring force exerted by the spring-loaded mechanism.

Abstract: A pneumatic driven two-axis motion platform is structurally simple for using two bag-shaped telescopic modules spaced apart and fixed to a foundation base being laid on the ground, and a movable table having a pivotal shaft used for making a pivotal connection with a two-way orthogonal rotator, after completely assembled, the movable table is mounted on the two bag-shaped telescopic modules by such arrangement that the two bag-shaped telescopic modules are symmetrical against the pivotal shaft of the movable table, and the two-way orthogonal rotator is arranged together with the two bag-shaped telescopic modules as an isosceles triangle arrangement; by such structural arrangement, said two-axis motion platform is endowed with two dimensions of rotational freedom when pneumatic inflating or deflating one or both of the two bag-shaped telescopic modules.

Abstract: A pneumatic driven two-axis motion platform is structurally simple for using two bag-shaped telescopic modules spaced apart and fixed to a foundation base being laid on the ground, and a movable table having a pivotal shaft used for making a pivotal connection with a two-way orthogonal rotator, after completely assembled, the movable table is mounted on the two bag-shaped telescopic modules by such arrangement that the two bag-shaped telescopic modules are symmetrical against the pivotal shaft of the movable table, and the two-way orthogonal rotator is arranged together with the two bag-shaped telescopic modules as an isosceles triangle arrangement; by such structural arrangement, said two-axis motion platform is endowed with two dimensions of rotational freedom when pneumatic inflating or deflating one or both of the two bag-shaped telescopic modules.