Abstract: In accordance with an example embodiment, there is disclosed herein an apparatus comprising a top case having a top surface and a side surface and a bottom case having a bottom surface and a side surface. The top case comprises a flange protruding from the side surface, the flange having at least one extended surface. The bottom case has an aperture having portions extending from the bottom surface to the side surface. The portion of the aperture extending along the bottom surface is configured to have sufficient width to allow the entire flange to pass through. The side surface of the bottom case has a vertical post such that the base section of the flange passes through the portion of the aperture on the side surface while vertical post retains the at least one extended surface.

Abstract: In accordance with an example embodiment, there is disclosed herein an apparatus comprising a top case having a top surface and a side surface and a bottom case having a bottom surface and a side surface. The top case comprises a flange protruding from the side surface, the flange having at least one extended surface. The bottom case has an aperture having portions extending from the bottom surface to the side surface. The portion of the aperture extending along the bottom surface is configured to have sufficient width to allow the entire flange to pass through. The side surface of the bottom case has a vertical post such that the base section of the flange passes through the portion of the aperture on the side surface while vertical post retains the at least one extended surface.

Abstract: A method of manufacturing a chip on film (COF) is provided, including: providing a flexible circuit board; and forming a plurality of leads on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um and a cross-section shape is substantially rectangular. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board, is provided. Each lead has a thickness of 8 um˜15 um, and lead widths of the leads are based on pitch widths of a plurality of bumps corresponding to the leads. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um, and a lead width of each of the leads is greater than a bump width minus 4 um.

Abstract: The invention relates to a substrate with slot. The substrate of the invention comprises an active surface and a plurality of metal plates. The metal plates are formed on the active surface. Each metal plate has a first surface and a second surface. The first surface is connected to the active surface. At least one metal plate has at least one slot formed on the second surface. Therefore, according to the substrate with slot of the invention, a resin for connecting a chip and the metal plates can entirely seal sides and corners of the chip so as to prevent water or dust from entering the chip and protect the chip.

Abstract: The invention relates to a substrate with slot. The substrate of the invention comprises an active surface and a plurality of metal plates. The metal plates are formed on the active surface. Each metal plate has a first surface and a second surface. The first surface is connected to the active surface. At least one metal plate has at least one slot formed on the second surface. Therefore, according to the substrate with slot of the invention, a resin for connecting a chip and the metal plates can entirely seal sides and corners of the chip so as to prevent water or dust from entering the chip and protect the chip.