Abstract: A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.

Abstract: An apparatus includes an all-fiber side-pump combiner fabrication system and a control unit coupled to control operations of the all-fiber side-pump combiner fabrication system to produce a (N+1)×1 combiner with N side pump fibers.

Abstract: A method for secure data transmission and a system using the same method are provided. The method includes: coupling a programmable logic device to a server; receiving a first data packet by the server; inputting the first data packet into a machine learning model to predict a protocol type and a command type of the first data packet by the server; verifying whether the protocol type and the command type are correct by the server; adding the first data packet to a data packet information set in response to the protocol type and the command type being correct by the server; generating a filtering rule according to the data packet information set and deploying the filtering rule in the programmable logic device by the server; and performing the secure data transmission according to the filtering rule by the programmable logic device.

Abstract: A method of database replication and a database system using the same method are provided, wherein the method includes: coupling a switch to a first database and a filter, wherein the switch mirrors a data packet of the first database to the filter, wherein the filter adds a header to the data packet; and coupling a master receiver to the filter and a second database, wherein the master receiver receives the data packet from the filter and performs an inspection for the data packet according to the header, wherein the master receiver transmits the data packet to the second database in response to the data packet passing the inspection.

Abstract: A communication system and a communication method for reporting a compromised state in one-way transmission are provided. The communication method includes: receiving a packet by a first port; coupling an error checking circuit to the first port, wherein the error checking circuit checks a header of the packet; coupling a first unidirectional coupler to the first port and the error checking circuit, and coupling a second unidirectional coupler to the first port and the error checking circuit; in response to an error being in the header, disabling the first unidirectional coupler and the data inspection circuit and enabling the second unidirectional coupler by the error checking circuit; receiving the packet from the communication device by a receiving server; and in response to determining the received packet is incomplete by the receiving server, outputting the compromised state by the receiving server.

Abstract: A communication system and a communication method for one-way transmission are provided. The communication method includes: transmitting a filtering rule to a programmable logic device by a server; receiving a signal and obtaining data from the signal by the server; packing the data to generate at least one data packet by the server; transmitting the at least one data packet to the programmable logic device by the server; and determining, according to the filtering rule, whether to output the at least one data packet by the programmable logic device.

Abstract: A switch device is provided. The switch device includes a switch and a one-way link circuit, wherein the switch including a first port, a second port, and a third port. The third port coupled to the second port via a first path and coupled to the first port via a second path. An input terminal of the one-way link circuit is coupled to the first port.

Abstract: A communication system and a communication method for reporting a compromised state in one-way transmission are provided. The communication method includes: receiving a packet by a first port; coupling an error checking circuit to the first port, wherein the error checking circuit checks a header of the packet; coupling a first unidirectional coupler to the first port and the error checking circuit, and coupling a second unidirectional coupler to the first port and the error checking circuit; in response to an error being in the header, disabling the first unidirectional coupler and the data inspection circuit and enabling the second unidirectional coupler by the error checking circuit; receiving the packet from the communication device by a receiving server; and in response to determining the received packet is incomplete by the receiving server, outputting the compromised state by the receiving server.

Abstract: A communication system and a communication method for one-way transmission are provided.

Abstract: A communication method and a switch device for one-way transmission based on VLAN ID are provided. The communication method includes: receiving, by a first port of a switch, a first data packet from a first external device; packing the first data packet with a first VLAN ID corresponding to a first path to generate a second data packet; receiving, by a first PLD, the second data packet from a third port of the switch; filtering, by the first PLD, the second data packet according to a first filtering rule; in response to the second data packet being matched with the first filtering rule, overwriting the first VLAN ID by a second VLAN ID corresponding to a second path to generate a third data packet; and transmitting, by the first PLD, the third data packet to a second port of the switch via the second path.

Abstract: A communication method and a switch device for one-way transmission based on VLAN ID are provided. The communication method includes: receiving, by a first port of a switch, a first data packet from a first external device; packing the first data packet with a first VLAN ID corresponding to a first path to generate a second data packet; receiving, by a first PLD, the second data packet from a third port of the switch; filtering, by the first PLD, the second data packet according to a first filtering rule; in response to the second data packet being matched with the first filtering rule, overwriting the first VLAN ID by a second VLAN ID corresponding to a second path to generate a third data packet; and transmitting, by the first PLD, the third data packet to a second port of the switch via the second path.

Abstract: A communication system and a communication method for one-way transmission are provided. The communication method includes: receiving, by a router, a first synchronization message from a grandmaster clock; generating, by the router, a timestamp according to the first synchronization message; receiving, by the router, at least one data packet; transmitting, by the router, the at least one data packet and the timestamp to a programmable logic device; and outputting, by the programmable logic device, the at least one data packet and the timestamp.

Abstract: A communication system and a communication method for one-way transmission are provided. The communication method includes: transmitting a filtering rule to a programmable logic device by a server; receiving a signal and obtaining data from the signal by the server; packing the data to generate at least one data packet by the server; transmitting the at least one data packet to the programmable logic device by the server; and determining, according to the filtering rule, whether to output the at least one data packet by the programmable logic device.

Abstract: A switch device is provided. The switch device includes a switch and a one-way link circuit, wherein the switch including a first port, a second port, and a third port. The third port coupled to the second port via a first path and coupled to the first port via a second path. An input terminal of the one-way link circuit is coupled to the first port.

Abstract: An image-capturing assembly and a manufacturing method for image-capturing element are provided. The image-capturing assembly includes an image-capturing element, an adhesive layer, and an optical sheet. The image-capturing element has an active area and a non-active area. The non-active area surrounds the active area. The adhesive layer includes a plurality of adhesive sublayers stacked sequentially. The adhesive layer is on the non-active area of the image-capturing element. The optical sheet is on the adhesive layer.

Abstract: A manufacturing method of an image-sensing module includes following steps. A substrate is provided. At least one photosensitive chip is disposed on the substrate, and each of the at least one photosensitive chip has an active area. At least one protection layer covers the at least one active area of the at least one photosensitive chip. A first manufacturing process is performed, and dust is generated during the first manufacturing process. The at least one protection layer is suitable for isolating the dust from the at least one active area. The at least one protection layer is removed to expose the at least one active area.

Abstract: A manufacturing method of an image-sensing module includes following steps. A substrate is provided. At least one photosensitive chip is disposed on the substrate, and each of the at least one photosensitive chip has an active area. At least one protection layer covers the at least one active area of the at least one photosensitive chip. A first manufacturing process is performed, and dust is generated during the first manufacturing process. The at least one protection layer is suitable for isolating the dust from the at least one active area. The at least one protection layer is removed to expose the at least one active area.

Abstract: An image capturing module having a built-in dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a substrate and an image sensing chip disposed on the substrate. The housing frame is disposed on the substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. More precisely, the lens holder has a first surrounding structure disposed on the inner surrounding surface thereof, and the movable lens assembly has a second surrounding structure disposed on the outer perimeter surface thereof and located above the first surrounding structure, and the first surrounding structure of the lens holder and the second surrounding structure of the movable lens assembly are mated with each other to form the built-in dustproof structure.

Abstract: An image capturing module having a built-in dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a substrate and an image sensing chip disposed on the substrate. The housing frame is disposed on the substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. More precisely, the lens holder has a first surrounding structure disposed on the inner surrounding surface thereof, and the movable lens assembly has a second surrounding structure disposed on the outer perimeter surface thereof and located above the first surrounding structure, and the first surrounding structure of the lens holder and the second surrounding structure of the movable lens assembly are mated with each other to form the built-in dustproof structure.

Abstract: An image capturing module having a built-in flexible dustproof structure includes an image sensing unit, a housing frame, an actuator structure and a flexible ring. The image sensing unit includes a carrier substrate and an image sensing chip. The housing frame is disposed on the carrier substrate to surround the image sensing chip. The actuator structure is disposed on the housing frame. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. The flexible ring is disposed around an outer perimeter surface of the movable lens assembly and abutted against an inner surrounding surface of the lens holder. Whereby, the flexible ring is surroundingly disposed between the inner surrounding surface of the lens holder and the outer perimeter surface of the movable lens assembly to form the built-in flexible dustproof structure.