Abstract: A cooling device includes at least one fin laminated body which extends in a first direction and includes fins laminated in a second direction perpendicular to the first direction, and a heat conductor which extends in the second direction and is inside the fin laminated body. A second-direction interval between adjacent ones of the fins on one side of the fin laminated body in the first direction is greater than another second-direction interval between adjacent ones of the fins on another side of the fin laminated body in the first direction.

Abstract: A heat dissipating device used for a PCB having a heat generating component includes a vapor chamber, a fin set, and a fixture. The vapor chamber is attached to the heat generating component. The fin set is connected above to the vapor chamber. The fixture is fixed to the PCB. The vapor chamber and the fin set are clamped between the fixture and the PCB. The fixture has a press plate which is pressed against a top of the fin set. Therefore, the press plate presses the vapor chamber without direct contact. That is, the applied pressure is concentrated on the fin set and then distributed evenly to the vapor chamber, which prevents deformation of the vapor chamber due to uneven pressure and further achieves the effect of the vapor chamber being attached smoothly to the heat generating component.

Abstract: A heat sink structure, having a heat sink and a thermal conductive block. The heat sink has a receiving slot recessed from a central portion of a bottom thereof. The thermal conductive block has a plurality of uneven surfaces thereon and a plurality of conical through holes therein. The thermal conductive block is pressed into the receiving slot while the heat sink is softened by heating, and the heat sink has a thermal expansion coefficient larger than the thermal conductive block, such that a wall of the receiving slot is partly extruded into or through the conical through holes, and the wall outside of the conical through holes is partly contracted into the conical holes in a cooling process after the thermal conductive block is pressed into the receiving slot. The conical through holes also provides the function of expelling gas, such that the thermal conductive block is firmly attached to the heat sink, and the heat dissipation effect is further enhanced.

Abstract: The present invention provides a wind cover locking element structure of heat radiator comprising a locking element, a heat radiator, a wind cover, and a socket. Projective sheet bodies are disposed at both sides of openings on two sideboards of the wind cover. The sheet bodies have abutting and positioning functions. When the locking element and the socket are locked together, the sheet bodies can abut against the locking portions of the locking element so as to be positioned, thereby reducing the shift between the locking element and the heat radiator. The heat radiator can thus be accurately stuck on a CPU.