Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.

Abstract: Aspects of the present disclosure relate to a power trigger mechanism for a power tool, comprising a first locking device and a second locking device, wherein the first locking device and the second locking device can be actuated independently of each other. Further aspects of the present disclosure relate to a power tool comprising said power trigger, and a method of operating said power trigger. The present invention provides a power trigger with intuitive operation, improved safety and improved control and stability of the power tool.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: A dielectric grating apparatus comprises a substrate; a grating layer, disposed above the substrate; a first interference layer, disposed above the substrate; and a second interference layer, adjacent to the first interference layer, wherein a refractive index of a material of the second interference layer is greater than a refractive index of a material of the first interference layer.

Abstract: An apparatus including an optical modulator and an electronic controller. The optical modulator includes a parallel-nested pair of MZIs, each arm of the MZIs including one or more EAMs therein. The electronic controller is electrically connected to drive the MZIs such that the optical modulator outputs an optical carrier modulated according to a quadrature amplitude modulation constellation with at least five different symbols.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: An optoelectronic circuit used with signal light comprises photonic devices disposed on a platform. The photonic devices are configured to condition the signal light and are fabricated with an optical characteristic being electronically tunable. A fabricated performance of the optical characteristic can be varied from a target performance due to a difference (e.g., alteration, change, error, or discrepancy) in the process used to fabricate the device. A ground bus, a power bus, and banks of electronic components are disposed on the platform in electrical communication with the photonic devices. The electronic components in a given bank are selectively configurable to tune the optical characteristic of the associated device so a variance can be diminished between the fabrication and target performances of the device's optical characteristic due to the difference in the fabrication process.

Abstract: An optical circuit for routing a signal includes a coupler and first and second waveguides. The coupler has an input for the signal and has first and second outputs. The first waveguide has a first optical connection to the first output, and the second waveguide has a second optical connection to the second output. Both waveguides have the same propagation length. The first and second waveguides include different widths at the respective optical connections to the respective outputs. This coupler can be used with another input couplers, two additional waveguides, and two 2×2 output couplers to provide a 90-degree hybrid for mixing signal light and local oscillator light in a coherent receiver or the like.

Abstract: An optical circuit is used with continuous wave signals having different wavelengths at a channel spacing from one another. A portion of the optical circuit is implemented in a photonic integrated circuit. Modulators in a modulation stage modulate the continuous wave signals to produce modulated signals. A multiplexing stage, which can have multiplexing filters, power combiners, or power couplers, multiplexes the continuous wave or modulated signals to produce multiplexed signals. The multiplexing stage may be placed either before or after the modulation stage. One or more polarization rotator and combiner (PRC) devices in a final stage combines the multiplexed signals into an output signal. The output signal has a first set of the different wavelengths at a first polarization and has a second separate set of the different wavelengths at a second polarization orthogonal to the first polarization.

Abstract: A photonic integrated circuit (PIC) device has photonic devices arranged in an array with respect to control and common conductors. Each of the photonic devices has a photonic component (e.g., photodiode, thermo-optic phase shifter, etc.) and a switching diode connected in series with one another between a control connection and a common connection. The photonic component has at least one optical port, which can be coupled to a waveguide in the PIC device. The switching diode is configured to switch between reverse and forward bias in response to the electrical signals. In this way, control circuitry for providing control and monitoring signals to the conductors can be greatly simplified, and the PIC device can be more compact.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: An optical circuit for routing a signal includes a coupler and first and second waveguides. The coupler has an input for the signal and has first and second outputs. The first waveguide has a first optical connection to the first output, and the second waveguide has a second optical connection to the second output. Both waveguides have the same propagation length. The first and second waveguides include different widths at the respective optical connections to the respective outputs. This coupler can be used with another input couplers, two additional waveguides, and two 2×2 output couplers to provide a 90-degree hybrid for mixing signal light and local oscillator light in a coherent receiver or the like.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: An optical circuit for routing a signal includes a coupler and first and second waveguides. The coupler has an input for the signal and has first and second outputs. The first waveguide has a first optical connection to the first output, and the second waveguide has a second optical connection to the second output. Both waveguides have the same propagation length. The first and second waveguides include different widths at the respective optical connections to the respective outputs. This coupler can be used with another input couplers, two additional waveguides, and two 2×2 output couplers to provide a 90-degree hybrid for mixing signal light and local oscillator light in a coherent receiver or the like.

Abstract: An optical circuit for routing a signal includes a coupler and first and second waveguides. The coupler has an input for the signal and has first and second outputs. The first waveguide has a first optical connection to the first output, and the second waveguide has a second optical connection to the second output. Both waveguides have the same propagation length. The first and second waveguides include different widths at the respective optical connections to the respective outputs. This coupler can be used with another input couplers, two additional waveguides, and two 2×2 output couplers to provide a 90-degree hybrid for mixing signal light and local oscillator light in a coherent receiver or the like.

Abstract: An optical system having a plurality of ring resonators that can be tuned by regulating their local temperatures in a manner that enables: initial spectral alignment of the optical resonances with the desired carrier wavelengths; fine-tuning of the ring resonators to spectrally align a selected feature of the optical resonances with the carrier wavelengths; and continuous tuning of the ring resonators to counter any detuning thereof during operation. The initial spectral alignment can be performed using intensity/frequency modulation of different carrier wavelengths with different respective frequencies and detection of said frequencies in the photocurrents generated by the individual ring resonators under reverse-bias conditions.

Abstract: An apparatus includes a laser, an optical power combiner, and an electronic controller. The laser has a plurality of modulatable optical reflectors and is operable to emit mutually coherent optical beams from the modulatable optical reflectors. The optical power combiner has a first optical inputs connected to receive light of one of the optical beams emitted from a first of the modulatable optical reflectors and has a second optical input connected to receive light of one of the optical beams emitted from a second of the modulatable optical reflectors. The electronic controller is connected to operate the first and second of the modulatable optical reflectors to modulate the optical beams emitted therefrom to carry respective first and second data streams. The optical power combiner is connected to interfere the light received from the first and second of the modulatable optical reflectors with a relative phase difference.

Abstract: An optical interconnect circuit for transmitting data between two or more electronic chips. In an example embodiment, the optical interconnect circuit comprises two or more photonic chips, each of which is vertically stacked with the corresponding electronic chip such that compact optical modulators and/or photodetectors of the photonic chip are in close proximity to the data sources/sinks of the corresponding electronic chip. Multi-core optical fibers and vertical coupling structures are used to provide multiple optical connections between different photonic chips. Advantageously, the provided capability to place optical modulators close to the data sources and to place photodetectors close to the data sinks can be used to reduce the amount of required electrical wiring. Optical-waveguide connections to the multi-core fibers can be used to allow for high density of optical conduits without spatially constraining the placement of data sources and/or data sinks on the electronic chips.

Abstract: An apparatus includes a laser, an optical power combiner, and an electronic controller. The laser has a plurality of modulatable optical reflectors and is operable to emit mutually coherent optical beams from the modulatable optical reflectors. The optical power combiner has a first optical inputs connected to receive light of one of the optical beams emitted from a first of the modulatable optical reflectors and has a second optical input connected to receive light of one of the optical beams emitted from a second of the modulatable optical reflectors. The electronic controller is connected to operate the first and second of the modulatable optical reflectors to modulate the optical beams emitted therefrom to carry respective first and second data streams. The optical power combiner is connected to interfere the light received from the first and second of the modulatable optical reflectors with a relative phase difference.