Patents by Inventor Po-Han Peng
Po-Han Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11906571Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.Type: GrantFiled: March 21, 2022Date of Patent: February 20, 2024Assignee: MPI CORPORATIONInventors: Chien-Yu Chen, Po-Han Peng
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Publication number: 20230251303Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.Type: ApplicationFiled: February 2, 2023Publication date: August 10, 2023Applicant: MPI CORPORATIONInventors: YI-HSUAN CHENG, HUNG-I LIN, PO-HAN PENG
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Patent number: 11656271Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.Type: GrantFiled: March 21, 2022Date of Patent: May 23, 2023Assignee: MPI CORPORATIONInventors: Yi-Hsuan Cheng, Hung-I Lin, Po-Han Peng
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Patent number: 11457094Abstract: A network system crossing different transmission protocols includes a user device, a first conversion apparatus, a server device and a second conversion apparatus. Data transmission between the first conversion apparatus and the second conversion apparatus is performed in accordance with network addresses of the first conversion apparatus and the second conversion apparatus, and one of transmission control protocol (TCP) and multipath transmission control protocol (MPTCP) is selected for performing the data transmission. A user packet is transmitted between the first conversion apparatus and the user device in accordance with network addresses of the user device and the server device. A server packet is transmitted between the second conversion apparatus and the server device in accordance with the network addresses of the user device and server devices.Type: GrantFiled: December 28, 2020Date of Patent: September 27, 2022Assignee: QNAP SYSTEMS, INC.Inventors: Sin-Yao Huang, Po-Han Peng
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Publication number: 20220299560Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.Type: ApplicationFiled: March 21, 2022Publication date: September 22, 2022Inventors: CHIEN-YU CHEN, PO-HAN PENG
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Publication number: 20220299564Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.Type: ApplicationFiled: March 21, 2022Publication date: September 22, 2022Applicant: MPI CORPORATIONInventors: YI-HSUAN CHENG, HUNG-I LIN, PO-HAN PENG
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Patent number: 11348221Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.Type: GrantFiled: October 23, 2020Date of Patent: May 31, 2022Assignee: MPI CORPORATIONInventors: Chien-Yu Chen, Han-Yu Chuang, Po-Han Peng
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Publication number: 20210203758Abstract: A network system crossing different transmission protocols includes a user device, a first conversion apparatus, a server device and a second conversion apparatus. Data transmission between the first conversion apparatus and the second conversion apparatus is performed in accordance with network addresses of the first conversion apparatus and the second conversion apparatus, and one of transmission control protocol (TCP) and multipath transmission control protocol (MPTCP) is selected for performing the data transmission. A user packet is transmitted between the first conversion apparatus and the user device in accordance with network addresses of the user device and the server device. A server packet is transmitted between the second conversion apparatus and the server device in accordance with the network addresses of the user device and server devices.Type: ApplicationFiled: December 28, 2020Publication date: July 1, 2021Inventors: SIN-YAO HUANG, PO-HAN PENG
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Publication number: 20210133948Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.Type: ApplicationFiled: October 23, 2020Publication date: May 6, 2021Applicant: MPI CorporationInventors: Chien-Yu Chen, Han-Yu Chuang, Po-Han Peng