Abstract: A semiconductor device includes a semiconductor fin. The semiconductor device includes first spacers over the semiconductor fin. The semiconductor device includes second spacers over the semiconductor fin. The second spacers vertically extend farther from the semiconductor fin than the first spacers. The semiconductor device includes a metal gate over the semiconductor fin, the metal gate is sandwiched by the first spacers. The metal gate includes a glue layer that contains tantalum nitride.

Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: An hydraulic ABS system for motorcycle is installed between the wheels and the corresponding braking levers. The system respectively includes two hydraulic circuits respectively comprised of a pressure increasing circuit and a pressure releasing circuit, and an electric control unit where a plurality of control zones are established. The front and rear wheel braking levers respectively provide two braking signals that separately or simultaneously control the respective braking forces of the front and rear wheels. Via calculated slip rates, the operation of pressure increasing and releasing circuits are further timely controlled to achieve an optimal braking.

Abstract: A hydraulic ABS system for motorcycle is installed between the wheels and the corresponding braking levers. The system respectively includes two hydraulic circuits respectively comprised of a pressure increasing circuit and a pressure releasing circuit, and an electric control unit where are established a plurality of control zones. The front and rear wheel braking levers respectively provide two braking signals that separately or simultaneously control the respective braking forces of the front and rear wheels. Via calculated slip rates, the operations pressure increasing and releasing circuits are further timely controlled to achieve an optimal braking.