Patents by Inventor Po-Hsien KE

Po-Hsien KE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and method for manufacturing the same
    Patent number: 11894317
    Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: February 6, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Po-Hsien Ke, Teck-Chong Lee, Chih-Pin Hung
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220068839
    Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.
    Type: Application
    Filed: August 26, 2020
    Publication date: March 3, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-Hsien KE, Teck-Chong LEE, Chih-Pin HUNG