Patents by Inventor Po-Hsien Lee

Po-Hsien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984485
    Abstract: A semiconductor device includes a substrate, a gate structure on the substrate, a source/drain (S/D) region and a contact. The S/D region is located in the substrate and on a side of the gate structure. The contact lands on and connected to the S/D region. The contact wraps around the S/D region.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hsien Cheng, Jr-Hung Li, Tai-Chun Huang, Tze-Liang Lee, Chung-Ting Ko, Jr-Yu Chen, Wan-Chen Hsieh
  • Publication number: 20240113010
    Abstract: A semiconductor device is disclosed herein. The semiconductor device includes a routing structure. The routing structure has an intermediate conductive routing layer. The intermediate conductive routing layer includes a first mesh conductive layer formed in a predetermined second region of the semiconductor device and a second mesh conductive layer formed in a predetermined first region of the semiconductor device. The first mesh conductive layer and the second mesh conductive layer are electrically isolated from each other. The intermediate conductive routing layer further includes multiple first conductive islands formed in the predetermined first region and multiple second conductive islands formed in the predetermined second region.
    Type: Application
    Filed: September 20, 2023
    Publication date: April 4, 2024
    Inventors: Po-Hsien Huang, Yu-Huei Lee, Hsin-Hung Lin, Chun-Yuan Shih, Lien-Chieh Yu
  • Publication number: 20240093416
    Abstract: A sewing machine includes a main body and a quick release needle plate module. The main body includes a base seat having an inner frame, and an outer case that is mounted to the inner frame and that defines an accommodating compartment. The quick release needle plate module includes a catch member, and a needle plate that covers the accommodating compartment, that is detachably pivoted to a rear section of the inner frame, and that engages the catch member. The quick release needle plate module further includes a press member inserted through the outer case and the inner frame, and operable to push the catch member to disengage the catch member. The needle plate has a plate body that covers the accommodating compartment, and a resilient member mounted between the inner frame and the plate body for driving pivot action of the plate body away from the inner frame.
    Type: Application
    Filed: January 20, 2023
    Publication date: March 21, 2024
    Applicant: ZENG HSING INDUSTRIAL CO., LTD.
    Inventors: Kun-Lung HSU, Ming-Ta LEE, Wei-Chen CHEN, Po-Hsien TSENG
  • Patent number: 7390109
    Abstract: A light-emitting diode (LED) component includes a circuit board, an LED chip installed on the circuit board for emitting light, and a light direction-changing unit. The LED chip is composed of a plurality of light-emitting points. The unit has a covering surface covering the LED chip, and a reflecting surface having a plurality of reflecting points. A smallest included angle of a plurality of included angles between a normal line of at least one of the reflecting points and a plurality of connection lines passing through the reflecting point and the light-emitting points is larger than sin?1(1/n), where n is the reflection index of the light direction-changing unit.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: June 24, 2008
    Assignee: Lite-On Technology Corp.
    Inventors: Zhi-Feng Li, Yung-Fu Wu, Po-Hsien Lee
  • Publication number: 20060262538
    Abstract: A light-emitting diode (LED) component includes a circuit board, an LED chip installed on the circuit board for emitting light, and a light direction-changing unit. The LED chip is composed of a plurality of light-emitting points. The unit has a covering surface covering the LED chip, and a reflecting surface having a plurality of reflecting points. A smallest included angle of a plurality of included angles between a normal line of at least one of the reflecting points and a plurality of connection lines passing through the reflecting point and the light-emitting points is larger than sin?1(1/n), where n is the reflection index of the light direction-changing unit.
    Type: Application
    Filed: September 12, 2005
    Publication date: November 23, 2006
    Inventors: Zhi-Feng Li, Yung-Fu Wu, Po-Hsien Lee
  • Patent number: 6713956
    Abstract: A display module comprises a plurality of light emitting elements, a metal plate, a circuit board and a display panel. The light emitting elements and the circuit board are arranged on the metal plate, and the light emitting elements are wire bonded to the circuit board. A lens is formed atop the light emitting element. The metal plate is arranged with the light emitting elements and the circuit board is positioned on lateral side or around the display panel. The metal plate provides excellent heat-dissipation effect and the light emitting elements can emit more uniform light.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: March 30, 2004
    Assignee: Lite-On Technology Corporation
    Inventors: Chen-Lun Hsing Chen, Po-Hsien Lee, I-Hsiang Li
  • Publication number: 20030043594
    Abstract: A traffic light comprises a lampshade having a base, a copper plate placed on an inner side of the base and a plurality of LEDs. The copper plate is aligned with 5-45° angle with respect to the base of the lampshade. The LEDs are arranged on the copper plate. The traffic light uses less number of LEDs and has enhanced security.
    Type: Application
    Filed: August 28, 2001
    Publication date: March 6, 2003
    Inventors: Chen-Lun Hsing Chen, Po-Hsien Lee, I-Hsiang Li
  • Publication number: 20030020400
    Abstract: A display module comprises a plurality of light emitting elements, a metal plate, a circuit board and a display panel. The light emitting elements and the circuit board are arranged on the metal plate, and the light emitting elements are wire bonded to the circuit board. A lens is formed atop the light emitting element. The metal plate is arranged with the light emitting elements and the circuit board is positioned on lateral side or around the display panel. The metal plate provides excellent heat-dissipation effect and the light emitting elements can emit more uniform light.
    Type: Application
    Filed: July 24, 2001
    Publication date: January 30, 2003
    Inventors: Chen-Lun Hsing Chen, Po-Hsien Lee, I-Hsiang Li
  • Patent number: 6501103
    Abstract: A light emitting diode assembly with low thermal resistance comprises an LED, a circuit board and a heat-dissipating substrate. The LED has a die mounted on a heat-dissipating plate and pads connected to a printed circuit board. The LED is mounted on a circuit board and a heat-dissipating substrate, whereby the thermal resistance of the LED assembly can be advantageously reduced to enhance the performance of the LED assembly.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: December 31, 2002
    Assignee: Lite-On Electronics, Inc.
    Inventors: Tom Jory, Po-Hsien Lee, Chen-Lun Hsing Chen