Patents by Inventor Po-Hsun Sung

Po-Hsun Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10916257
    Abstract: A method and a device for equalizing audio signals, where the method includes: obtaining an audio signal (S401); acquiring an echo estimate that is caused by a sound reflection off one or more objects (S403); acquiring correction data based on the audio signal and the echo estimate (S405); and equalizing the audio signal based on the correction data (S407). Accordingly, by virtue of the method and the device for equalizing audio signals, equalization can be performed automatically in real time to match an audio signal to a desired reference frequency response with consideration of spatial acoustics, such as indirect echoes.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: February 9, 2021
    Assignee: Harman International Industries, Incorporated
    Inventors: Alan Dean Michel, Jason Chen, Simon Liu, Po-Hsun Sung
  • Publication number: 20200082839
    Abstract: A method and a device for equalizing audio signals, where the method includes: obtaining an audio signal (S401); acquiring an echo estimate that is caused by a sound reflection off one or more objects (S403); acquiring correction data based on the audio signal and the echo estimate (S405); and equalizing the audio signal based on the correction data (S407). Accordingly, by virtue of the method and the device for equalizing audio signals, equalization can be performed automatically in real time to match an audio signal to a desired reference frequency response with consideration of spatial acoustics, such as indirect echoes.
    Type: Application
    Filed: December 6, 2016
    Publication date: March 12, 2020
    Applicant: Haman International Industries, Incorporated
    Inventors: Alan Dean Michel, Jason Chen, Simon Liu, Po-Hsun Sung
  • Patent number: 8718295
    Abstract: A headset assembly with a recording function for communication includes a left earphone, a right earphone, a call module, and a recording module. The left and the right earphones respectively have a speaker and a microphone. The call module is electrically connected to the left or the right earphone. The recording module is electrically connected to the left and the right earphones. In a first operation mode, the call module communicates with an external communication device through the microphone and the speaker of the left or the right earphone. In a second operation mode, the recording module receives an ambient sound signal through the microphones simultaneously, and records and stores the ambient sound signal. As the microphones are placed in a left auricle and a right auricle, recorded sound may have an effect of a head-related transfer function (HRTF), thus achieving an effect of a stereo sound field during playback.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: May 6, 2014
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Po-Hsun Sung, Chia-Chung Lin
  • Publication number: 20130142375
    Abstract: A headphone having a headband and two acoustic transducers disposed at two ends of the headband is disclosed. Each acoustic transducer includes a baffle plate installed with a speaker, a spacer, a vent and an acoustic modulator. The baffle plate and speaker divide the acoustic transducer into a front and a back chamber. The front chamber is configured for communicating with a user's ear. The spacer is disposed behind the speaker to divide the back chamber into a first back chamber and a second back communicated with each other. The vent is disposed in a back wall of the acoustic transducer to communicate the first back chamber with outside. The first acoustic modulator is disposed between the front and second back chambers. The headphone modulates resonance frequency at low frequency bands through the acoustic modulator.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 6, 2013
    Applicant: Merry Electronics Co., Ltd.
    Inventors: Po-Hsun Sung, Chun-Fu Wang, Hung-Wen Tsao
  • Patent number: 8447058
    Abstract: A headphone having a headband and two acoustic transducers disposed at two ends of the headband is disclosed. Each acoustic transducer includes a baffle plate installed with a speaker, a spacer, a vent and an acoustic modulator. The baffle plate and speaker divide the acoustic transducer into a front and a back chamber. The front chamber is configured for communicating with a user's ear. The spacer is disposed behind the speaker to divide the back chamber into a first back chamber and a second back communicated with each other. The vent is disposed in a back wall of the acoustic transducer to communicate the first back chamber with outside. The first acoustic modulator is disposed between the front and second back chambers. The headphone modulates resonance frequency at low frequency bands through the acoustic modulator.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: May 21, 2013
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Po-Hsun Sung, Chun-Fu Wang, Hung-Wen Tsao
  • Patent number: 8295503
    Abstract: A noise reduction device include at east a cavity; a plurality of ducts noise reduction, at least one of the ducts being connected to the cavity for transmitting an acoustic signal including a noise signal into/out of the cavity; a noise reduction circuit, for receiving the acoustic signal including the noise signal and generating an electrical signal; a microphone for receiving the acoustic signal inside the cavity, converting the received acoustic signal into another electrical signal and transmitting the electrical signal to the noise reduction circuit; and a speaker for receiving the electrical signal generated by the noise reduction circuit, using the received electrical signal to generate an out of phase acoustic signal accordingly, and feeding the out of phase acoustic signal into the cavity to interfere with the noise signal inside the cavity. With the noise reduction circuit and cavity structure designed in the noise reduction device, the full range of noise is attenuated.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: October 23, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Po-Hsun Sung, Chun-Hsun Chu
  • Publication number: 20120257764
    Abstract: A headset assembly with a recording function for communication includes a left earphone, a right earphone, a call module, and a recording module. The left and the right earphones respectively have a speaker and a microphone. The call module is electrically connected to the left or the right earphone. The recording module is electrically connected to the left and the right earphones. In a first operation mode, the call module communicates with an external communication device through the microphone and the speaker of the left or the right earphone. In a second operation mode, the recording module receives an ambient sound signal through the microphones simultaneously, and records and stores the ambient sound signal. As the microphones are placed in a left auricle and a right auricle, recorded sound may have an effect of a head-related transfer function (HRTF), thus achieving an effect of a stereo sound field during playback.
    Type: Application
    Filed: April 11, 2011
    Publication date: October 11, 2012
    Inventors: Po-Hsun SUNG, Chia-Chung LIN
  • Publication number: 20120207308
    Abstract: An interactive sound playback device includes two speakers, two microphones, a motion sensor, and an audio processing unit. The speakers and the microphones are disposed at two sides of the interactive sound playback device respectively. The audio processing unit is electrically connected to the speakers, the microphones, and the motion sensor, and has a recording mode and a playing mode. In the recording mode, the audio processing unit receives a motion sensing signal from the motion sensor and a first audio signal from the microphones, stores the first audio signal, and stores the motion sensing signal as position information. In the playing mode, the audio processing unit outputs the first audio signal to the speakers through a first path, or adjusts a second audio signal by referring to the motion sensing signal and the position information, and outputs the adjusted second audio signal to the two speakers through a second path.
    Type: Application
    Filed: February 15, 2011
    Publication date: August 16, 2012
    Inventor: Po-Hsun SUNG
  • Patent number: 8184821
    Abstract: A noise attenuation device comprising a first tube for receiving an acoustic signal, a first housing defining a first cavity between a first surface and a second surface, the first tube being coupled to the first housing at the first surface for conducting the acoustic signal into the first cavity, wherein one end of the first tube contacts the first surface at a first region with a first area, a second housing defining a second cavity between a first surface and a second surface, and a second tube coupled between the second surface of the first housing and the first surface of the second housing for conducting the acoustic signal between the first cavity and the second cavity, wherein one end of the second tube contacts the second surface of the first housing at a second region with a second area, wherein the first tube, the first housing and the second tube form a filter structure and the area of the first surface of the first housing is greater than the first area and the area of the second surface of the
    Type: Grant
    Filed: January 28, 2008
    Date of Patent: May 22, 2012
    Assignee: Industrial Technology Research Institute
    Inventor: Po-Hsun Sung
  • Patent number: 8103013
    Abstract: An acoustic transducer device is provided. The device includes a body, a speaker, a microphone, and a processor. The body has a cavity, a sound exit, and a sound entrance. The cavity interflows with the sound exit and accommodates the speaker. The microphone is disposed within the body beside the speaker. The microphone interflows selectively with the cavity or the sound entrance. The processor is electrically connected to the speaker and the microphone. When the microphone interflows with the cavity, the microphone receives a sound signal generated from the cavity and transmits the sound signal to the processor for cancelling noise in the cavity. When the microphone interflows with the sound exit, the microphone receives an external sound signal and transmits the external sound signal to the processor for cancelling noise from the external.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: January 24, 2012
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Po-Hsun Sung, Hong-Ching Her
  • Patent number: 8094844
    Abstract: A micro acoustic transducer and manufacturing method are provided. Firstly, a substrate having one first and second cavities is provided. Then, a backplate with a plurality of acoustic holes is formed on the substrate, and a diaphragm is formed on the backplate. An air gap is formed between the backplate and the diaphragm. The air gap, second cavity, and first cavity are communicated with each other through the acoustic holes. A plurality of rings is formed around the diaphragm. These rings are used to hitch pillars formed on the substrate or fasteners can be formed on the substrate for fastening the diaphragm on fastener holes. Through the arrangement of the rings or fasteners used as the boundary structure of the diaphragm, the mechanical sensitivity of the diaphragm is improved. Moreover, the backplate is supported by a single crystal structure formed by etching the substrate such that the stability is promoted.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: January 10, 2012
    Assignee: Industrial Technology Research Institute
    Inventor: Po-Hsun Sung
  • Patent number: 8039910
    Abstract: An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transuding and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: October 18, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Kai-Hsiang Yen, Jen-Yi Chen, Po-Hsun Sung
  • Patent number: 8035402
    Abstract: A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: October 11, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Jen Fang, Jen-Yi Chen, Kai-Hsiang Yen, Po-Hsun Sung
  • Publication number: 20110121843
    Abstract: A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.
    Type: Application
    Filed: January 31, 2011
    Publication date: May 26, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Jen Fang, Jen-Yi Chen, Kai-Hsiang Yen, Po-Hsun Sung
  • Patent number: 7902843
    Abstract: A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: March 8, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Jen Fang, Jen-Yi Chen, Kai-Hsiang Yen, Po-Hsun Sung
  • Publication number: 20110034218
    Abstract: An in-ear earphone includes a housing, a transducer, a sound tube and an earplug. The transducer is disposed in the housing. The sound tube is extended outward from the housing. The sound tube has a first channel connected with the housing for receiving the acoustic wave generated by the transducer, and a second channel connected with first channel and having a cross-section area different from the first channel. The earplug is disposed on the sound tube to be inserted into the ear channel of a user so as to reduce the frequency response of the acoustic wave which is delivered to the ear cannel of the user.
    Type: Application
    Filed: December 17, 2009
    Publication date: February 10, 2011
    Inventors: Po-Hsun Sung, Yu-Chang Y. Fan, Chien-Chang Yang
  • Publication number: 20100208909
    Abstract: An acoustic transducer device is provided. The device includes a body, a speaker, a microphone, and a processor. The body has a cavity, a sound exit, and a sound entrance. The cavity interflows with the sound exit and accommodates the speaker. The microphone is disposed within the body beside the speaker. The microphone interflows selectively with the cavity or the sound entrance. The processor is electrically connected to the speaker and the microphone. When the microphone interflows with the cavity, the microphone receives a sound signal generated from the cavity and transmits the sound signal to the processor for cancelling noise in the cavity. When the microphone interflows with the sound exit, the microphone receives an external sound signal and transmits the external sound signal to the processor for cancelling noise from the external.
    Type: Application
    Filed: February 19, 2009
    Publication date: August 19, 2010
    Inventors: Po-Hsun Sung, Hong-Ching Her
  • Publication number: 20100177904
    Abstract: A noise reducing earphone includes a body, a speaker, a microphone and a signal processor. The body includes a cavity and a sound tunnel. The speaker and the microphone are both disposed in the cavity. The speaker is configured for outputting audio signals through the sound tunnel. The microphone is disposed besides the speaker and configured for receiving the audio signals in the cavity. The signal processer is electrically connected to the speaker and the microphone and configured for providing an electrical signal to the speaker so that the electrical signal is converted to an audio signal by the speaker. The microphone is configured for converting the received audio signals to an electrical signal, and sending the electrical signal to the signal processor. The signal processor is configured for outputting to the speaker an anti-phase signal with respect to the noise component defined by the signal processor in the audio signal.
    Type: Application
    Filed: January 13, 2009
    Publication date: July 15, 2010
    Inventors: Po-Hsun Sung, Cheng-Ho Tsai, Chiung-Wen Yeh, Hong-Ching Her
  • Patent number: 7716986
    Abstract: An acoustic wave sensing device integrated with micro-channels and a method for the same are described. The present invention uses a piezoelectric substrate with a thinner portion serving as a sensing area and formed via a micromaching or chemical process. An inter-digital transducer (IDT) is located on the thinner portion to produce flexural plate waves (FPW). The micro-channels can be formed together with the thinner portion via the same manufacturing process, or integrated into the piezoelectric substrate via linkage. In the present invention, a novel manufacturing process and design are proposed for fabrication of the acoustic wave sensing devices with a good piezoelectric characteristic, a stable temperature compensation property, and a robust structure. Thereby, the techniques of flexural plate waves can be applied for liquid sensors. In this way, the drawbacks of the conventional acoustic wave sensing devices, such as poor piezoelectric properties and fragile film structures, are removed.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: May 18, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Po-Hsun Sung, Wen-Wang Ke, Nai-Hao Kuo, Yu-Sheng Hsieh
  • Publication number: 20090190771
    Abstract: A noise attenuation device comprising a first tube for receiving an acoustic signal, a first housing defining a first cavity between a first surface and a second surface, the first tube being coupled to the first housing at the first surface for conducting the acoustic signal into the first cavity, wherein one end of the first tube contacts the first surface at a first region with a first area, a second housing defining a second cavity between a first surface and a second surface, and a second tube coupled between the second surface of the first housing and the first surface of the second housing for conducting the acoustic signal between the first cavity and the second cavity, wherein one end of the second tube contacts the second surface of the first housing at a second region with a second area, wherein the first tube, the first housing and the second tube form a filter structure and the area of the first surface of the first housing is greater than the first area and the area of the second surface of the
    Type: Application
    Filed: January 28, 2008
    Publication date: July 30, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Po-Hsun SUNG