Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: A method includes forming a first dielectric layer, forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes forming a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, with a first center of conductive pad being offsetting from a second center of the conductive bump. The second via is further offset from the second center of the conductive bump.

Abstract: The invention is related to an optical lens, a light-emitting diode optical component and a light-emitting diode road lamp. The optical lens formed as a semi-spherical shape includes an uplifting spherical surface and a bottom surface corresponding to the spherical surface. The bottom surface includes an elongate recess concave to the spherical surface and formed with an inner surface corresponding to the spherical surface and two vertical side surfaces adjacent to the inner surface. The inner surface of the elongate recess includes a similar Gaussian distribution curve provided on a section parallel to the vertical side surfaces. A focus is contained in a center of the bottom surface. A light-emitting diode is disposed below the focus of the optical lens. The special outline structure of the optical lens can provide a uniform luminance distribution on an illuminating area.

Abstract: The invention is related to an optical lens, a light-emitting diode optical component and a light-emitting diode road lamp. The optical lens formed as a semi-spherical shape includes an uplifting spherical surface and a bottom surface corresponding to the spherical surface. The bottom surface includes an elongate recess concave to the spherical surface and formed with an inner surface corresponding to the spherical surface and two vertical side surfaces adjacent to the inner surface. The inner surface of the elongate recess includes a similar Gaussian distribution curve provided on a section parallel to the vertical side surfaces. A focus is contained in a center of the bottom surface. A light-emitting diode is disposed below the focus of the optical lens. The special outline structure of the optical lens can provide a uniform luminance distribution on an illuminating area.

Abstract: The invention is related to an optical lens, a light-emitting diode optical component and a light-emitting diode illumination lamp. The optical lens formed as a semi-spherical shape includes an uplifting spherical surface and a bottom surface corresponding to the spherical surface, and the bottom surface includes an inward space concave to the spherical surface and formed with a free surface corresponding to the spherical surface. The free surface is axially-symmetrical formed as rotational molding with respect to an axis connected from the focus to a center point of the spherical surface, to form the free surface with a similar Gaussian distribution curve provided on a section vertically cut from the spherical surface to the bottom surface. A light-emitting diode is disposed below the focus of the optical lens. The special outline structure of the optical lens can provide a uniform luminance distribution on an illuminating area.

Abstract: A diffusion plate having microstructures with two lengthy and slant faces and its relevant backlight module as well as optical device includes an optical base and a diffusion plate with pluralities of microstructures; wherein, the microstructures on the optical base are located by different allocation, and an angle is defined by the cooperation of two longitude and slant faces of each microstructure. The above arrangements substantially impinge on controlling the light return and transmission of the backlight module or the optical device including a brightness enhancement film, a light source, and a reflecting plate disposed thereon, thereby increasing the uniformity of backlight through the optical reflection and refraction.

Abstract: A micro-structural film manufacturing process operating on a principle of static absorption by having multiple optical particles adhered to an adhesive layer containing adhesion on a surface of a base material, followed with solidification and static removing processes for the optical particles to form a film of micro-lens diffusion layer to deliver scattering results when light is permeated for achieving the purpose of having uniform luminance while reducing production cost and allowing control the surface of the base material to develop a micro-structural film under different diffusion conditions.