Abstract: A semiconductor package includes a redistribution structure and an encapsulated die electrically connected to the redistribution structure. The redistribution structure includes a first conductive pad, first and second conductive vias, and a first dielectric layer. The first conductive pad includes opposing first and second sides, the first conductive via lands on the first side of the first conductive pad and is tapered in a direction from the first side toward the second side. The second conductive via lands on the second side of the first conductive pad and is tapered in a direction from the second side toward the first side. The first dielectric layer laterally covers the first conductive pad and the first conductive via, and the first dielectric layer includes opposing first and second surfaces. The encapsulated die is disposed below the first side of the first conductive via.

Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.

Abstract: A method for forming a package structure is provided. The method includes forming first conductive structures and a first semiconductor die on a same side of a redistribution structure. The method includes forming an interposer substrate over the redistribution structure, wherein the first semiconductor die is between the interposer substrate and the redistribution structure, and edges of the interposer substrate extend beyond edges of the first semiconductor die. The method includes forming a second semiconductor die on the redistribution structure, wherein the first semiconductor die and the second semiconductor die are disposed on opposite sides of the redistribution structure.

Abstract: Structures and methods of forming fan-out packages are provided. The packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. Embodiments include a cavity preformed in a cavity substrate. Various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. Redistribution structures may also be formed.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first diffusion barrier layer made of a dielectric material including a metal element, nitrogen, and oxygen and a first protection layer made of a dielectric material including silicon and oxygen and in direct contact with the top surface of the first diffusion barrier layer. The semiconductor device structure also includes a first thickening layer made of a dielectric material including the metal element and oxygen and in direct contact with the top surface of the first protection layer. A maximum metal content in the first thickening layer is greater than that in the first diffusion barrier layer. The semiconductor device structure further includes a conductive feature surrounded by and in direct contact with the first diffusion barrier layer, the first protection layer, and the first thickening layer.

Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.

Abstract: An electric fuel pump includes a housing having an oil inlet and an oil outlet, an impeller, a stator unit mounted in the housing and including a stator and a starter terminal set connected to the stator, a packaging adhesive encapsulating the stator and the starter terminal set to create an oil guide passage in communication between the oil inlet and the oil outlet, and a rotor unit mounted in the housing and including a rotor rotatably mounted in the stator and a rotating shaft mounted in the rotor and connected with the impeller. When the stator unit is electrically conducted, the rotor unit drives the impeller to draw a fuel oil into the oil guide passage. When the fuel oil goes through the oil guide passage, the stator and the starter terminal set are well protected by the packaging adhesive and prohibited from contacting the fuel oil.

Abstract: An electric fuel pump includes a housing having an oil inlet and an oil outlet, an impeller, a stator unit mounted in the housing and including a stator and a starter terminal set connected to the stator, a packaging adhesive encapsulating the stator and the starter terminal set to create an oil guide passage in communication between the oil inlet and the oil outlet, and a rotor unit mounted in the housing and including a rotor rotatably mounted in the stator and a rotating shaft mounted in the rotor and connected with the impeller. When the stator unit is electrically conducted, the rotor unit drives the impeller to draw a fuel oil into the oil guide passage. When the fuel oil goes through the oil guide passage, the stator and the starter terminal set are well protected by the packaging adhesive and prohibited from contacting the fuel oil.

Abstract: A testing system selects one of testing paths based on a control unit and a test switching unit for randomly executing tests upon a plurality of products based on the testing requirements of each of examining units, so as to decrease the costs of equipment, interference between the tests on several products, the idle time of a testing devise and the testing period for tested products.