Abstract: A semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.

Abstract: A semiconductor device includes a first to sixth regions, a first gate, a first metal contact and a second metal contact. The second region is disposed opposite to the first region with respect to the first gate. The first metal contact couples the first region to the second region. The fourth region is disposed opposite to the third region with respect to the first gate. The second metal contact is coupling the third region to the fourth region. The fifth region is disposed between the first gate and the second region, and is disconnected from the first metal contact and the second metal contact. The sixth region is disposed between the first gate and the first region, and is disconnected from the first metal contact and the second metal contact.

Abstract: An outlier IC detection method includes acquiring first measured data of a first IC set, training the first measured data for establishing a training model, acquiring second measured data of a second IC set, generating predicted data of the second IC set by using the training model according to the second measured data, generating a bivariate dataset distribution of the second IC set according to the predicted data and the second measured data, acquiring a predetermined Mahalanobis distance on the bivariate dataset distribution of the second IC set, and identifying at least one outlier IC from the second IC set when at least one position of the at least one outlier IC on the bivariate dataset distribution is outside a range of the predetermined Mahalanobis distance.

Abstract: A semiconductor device includes a first diode, a second diode, a clamp circuit and a third diode. The first diode is coupled between an input/output (I/O) pad and a first voltage terminal. The second diode is coupled with the first diode, the I/O pad and a second voltage terminal. The clamp circuit is coupled between the first voltage terminal and the second voltage terminal. The second diode and the clamp circuit are configured to direct a first part of an electrostatic discharge (ESD) current flowing between the I/O pad and the first voltage terminal. The third diode, coupled to the first voltage terminal, and the second diode include a first semiconductor structure configured to direct a second part of the ESD current flowing between the I/O pad and the first voltage terminal.

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: In some embodiments, a semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.

Abstract: A method includes the following operations: disconnecting at least one of drain regions that are formed on a first active area, of first transistors, from a first voltage; and disconnecting at least one of drain regions that are formed on a second active area, of second transistors coupled to the first transistors from a second voltage. The at least one of drain regions of the second transistors corresponds to the at least one of drain regions of the first transistors.

Abstract: Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include a set of interface circuits to operate the circuit array. A side of the first region may face a first side of the second region along a first direction. The third region may include a set of header circuits to provide power to the set of interface circuits through metal rails extending along a second direction. A side of the third region may face a second side of the second region along the second direction. In one aspect, the first side extending along the second direction is shorter than the second side extending along the first direction, and the metal rails are shorter than the first side.

Abstract: A device and a method for detecting states of a linear guideway including a sliding block and a slide rail are provided. The device includes a sensor located at a position corresponding to a side surface of the slide rail, and an analysis processer communicated with the sensor. The sensor detects the vibrating of the slide rail to generate a sensing signal. The analysis processer compares the sensing signal with at least one threshold, to determines occurrence of abnormalities. Therefore, the sensitivity for detection may be increased.

Abstract: A method and a system for building digital twin models allow the setting of a shape and dimensions of a simplified geometric solid corresponding to a component of a feeding system; after sampling the solid to obtain second position data, calculates a set of model eigenvalues and a set of model eigenvectors by a modal analysis method according to a material data of the component, the second position data and second size data of the solid; and defines the solid as a digital twin model of the component when it is determined by a modal verification method that a set of actual eigenvectors of the component is similar to the set of model eigenvectors. Data amounts of the second position and size data are far less than data amounts of first position and size data of an image of the component.

Abstract: A device and a method for detecting states of a linear guideway including a sliding block and a slide rail are provided. The device includes a sensor located at a position corresponding to a side surface of the slide rail, and an analysis processer communicated with the sensor. The sensor detects the vibrating of the slide rail to generate a sensing signal. The analysis processer compares the sensing signal with at least one threshold, to determines occurrence of abnormalities. Therefore, the sensitivity for detection may be increased.

Abstract: A method of detecting a preload of a linear guide includes: applying an external force to the linear guide with an external force applying device, wherein the external force applying device sends an impact signal while applying the external force; sensing with a sensor a vibration signal sent from the linear guide because of vibration thereof which occurs under the external force; and receiving the impact signal of the external force applying device and the vibration signal of the sensor and calculating the preload of the linear guide according to a received result, with a signal analyzer. Therefore, with the method of the present invention, the preload of the linear guide is precisely tested regardless of environmental factors.

Abstract: A method of detecting a preload of a linear guide includes: applying an external force to the linear guide with an external force applying device, wherein the external force applying device sends an impact signal while applying the external force; sensing with a sensor a vibration signal sent from the linear guide because of vibration thereof which occurs under the external force; and receiving the impact signal of the external force applying device and the vibration signal of the sensor and calculating the preload of the linear guide according to a received result, with a signal analyzer. Therefore, with the method of the present invention, the preload of the linear guide is precisely tested regardless of environmental factors.

Abstract: A motion guide device includes a movable member attached onto an elongated member for forming a ball guiding passage and for receiving ball bearing members between the elongated member and the movable member, a detecting device includes a magnetic member and an insulated tube engaged into a hole of the movable member, and a warning device is coupled between the movable member and the magnetic member for generating a warning signal when the movable member and the magnetic member are electrically connected together with worn particles and for allowing the user to examine and to repair the motion guide device or the ball screw device when required.

Abstract: A motion guide device includes a movable member attached onto an elongated member for forming a ball guiding passage and for receiving ball bearing members between the elongated member and the movable member, a detecting device includes a magnetic member and an insulated tube engaged into a hole of the movable member, and a warning device is coupled between the movable member and the magnetic member for generating a warning signal when the movable member and the magnetic member are electrically connected together with worn particles and for allowing the user to examine and to repair the motion guide device or the ball screw device when required.