Abstract: A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.

Abstract: A music box having a water pump structure, especially to a music box in combination with a water pump, includes a music box, a water pump, and a regulating valve wherein the music box is provided with a linking member by which the water pump is connected with the music box. The linking member is associated with a water pressure plate of the water pump and the movement of the linking member triggered off by the music box will activate the water pressure plate to move back and forth. The to-and-fro movement of the water pressure plate will in turn generate a pressure, forcing water to circulate in and out of two main bodies of the water pump. In addition, the regulating valve having one-dimensional water influx and discharging valves is adapted to regulate the water circulation in one direction.