Abstract: Methods to form vertically conducting and laterally conducting low-cost resistor structures utilizing dual-resistivity conductive materials are provided. The dual-resistivity conductive materials are deposited in openings in a dielectric layer using a single deposition process step. A high-resistivity ?-phase of tungsten is stabilized by pre-treating portions of the dielectric material with impurities. The portions of the dielectric material in which impurities are incorporated encompass regions laterally adjacent to where high-resistivity ?-W is desired. During a subsequent tungsten deposition step the impurities may out-diffuse and get incorporated in the tungsten, thereby stabilizing the metal in the high-resistivity ?-W phase. The ?-W converts to a low-resistivity ?-phase of tungsten in the regions not pre-treated with impurities.

Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

Abstract: Vertical interconnect structures and methods of forming are provided. The vertical interconnect structures may be formed by partially filling a first opening through one or more dielectric layers with layers of conductive materials. A second opening is formed in a dielectric layer such that a depth of the first opening after partially filling with the layers of conductive materials is close to a depth of the second opening. The remaining portion of the first opening and the second opening may then be simultaneously filled.

Abstract: A method and structure for forming semiconductor device includes forming a contact via opening in a first dielectric layer, where the contact via opening exposes a first portion of a contact etch stop layer (CESL). The method further includes etching both the first portion of the CESL exposed by the contact via opening and adjacent lateral portions of the CESL to expose a source/drain contact and form an enlarged contact via opening having cavities disposed on either side of a bottom portion of the enlarged contact via opening. The method further includes forming a passivation layer on sidewall surfaces of the enlarged contact via opening including on sidewall surfaces of the cavities. The method further includes depositing a first metal layer within the enlarged contact via opening and within the cavities to provide a contact via in contact with the exposed source/drain contact.

Abstract: A method and structure for forming semiconductor device includes forming a contact via opening in a first dielectric layer, where the contact via opening exposes a first portion of a contact etch stop layer (CESL). The method further includes etching both the first portion of the CESL exposed by the contact via opening and adjacent lateral portions of the CESL to expose a source/drain contact and form an enlarged contact via opening having cavities disposed on either side of a bottom portion of the enlarged contact via opening. The method further includes forming a passivation layer on sidewall surfaces of the enlarged contact via opening including on sidewall surfaces of the cavities. The method further includes depositing a first metal layer within the enlarged contact via opening and within the cavities to provide a contact via in contact with the exposed source/drain contact.

Abstract: Vertical interconnect structures and methods of forming are provided. The vertical interconnect structures may be formed by partially filling a first opening through one or more dielectric layers with layers of conductive materials. A second opening is formed in a dielectric layer such that a depth of the first opening after partially filling with the layers of conductive materials is close to a depth of the second opening. The remaining portion of the first opening and the second opening may then be simultaneously filled.

Abstract: A system and method for predicting remaining lifetime of a component of equipment is provided. The prediction system includes a data module, a feature module, a current data-based prediction module, a historical data-based prediction module, and a confidence module. The data module obtains a test sensor data of the component of equipment. The feature module obtains a historical health indicator and the current-health indicator. The current data-based prediction module obtains a first predicted remaining lifetime and a first prediction confidence according to the current-health indicator. The historical data-based prediction module obtains a second predicted remaining lifetime and a second prediction confidence according to the historical health indicator.

Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.

Abstract: An optimum sampling search system and method with risk assessment, and a graphical user interface are provided. The optimum sampling search system includes a data acquisition unit, an objective satisfaction score calculation unit, a constraint satisfaction probability calculation unit, a sampling risk evaluation unit, and an adjusting unit. If the constraint satisfaction probability of a recommended sampling parameter is between a first predetermined value and a second predetermined value, the recommended sampling parameter is adjusted, by the adjusting unit, to optimize a constraint satisfaction probability model.

Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.

Abstract: Vias, along with methods for fabricating vias, are disclosed that exhibit reduced capacitance and resistance. An exemplary interconnect structure includes a first source/drain contact and a second source/drain contact disposed in a dielectric layer. The first source/drain contact physically contacts a first source/drain feature and the second source/drain contact physically contacts a second source/drain feature. A first via having a first via layer configuration, a second via having a second via layer configuration, and a third via having a third via layer configuration are disposed in the dielectric layer. The first via and the second via extend into and physically contact the first source/drain contact and the second source/drain contact, respectively. A first thickness of the first via and a second thickness of the second via are the same. The third via physically contacts a gate structure, which is disposed between the first source/drain contact and the second source/drain contact.

Abstract: A source/drain is disposed over a substrate. A source/drain contact is disposed over the source/drain. A first via is disposed over the source/drain contact. The first via has a laterally-protruding bottom portion and a top portion that is disposed over the laterally-protruding bottom portion.

Abstract: The present disclosure relates to a polyimide precursor composition comprising an antic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.

Abstract: A parameter optimization method includes: a parameter search is performed on an input parameter, an output response value and a target value through a plurality of optimization schemes to search for a plurality of candidate recommended parameters. Each optimization scheme is assigned to a weight value according to user historical decision information. At least one recommended parameter is selected from the candidate recommended parameters according to the weight values. An user interface is provided for a user to input a decision instruction. A new input parameter is selected from the at least one recommended parameter according to the decision instruction; the new input parameter is inputted into the target system; and a new output response value is evaluated whether meets a specification condition. The user historical decision information is updated based on the decision instruction to adjust the weight values.

Abstract: A method and an apparatus for establishing a coordinate system and a data structure product are provided. The method includes following steps: obtaining at least one layer related to an arrangement of an indoor space to generate a layout pattern in a 2D or 3D model; obtaining locations of positioning devices located within the indoor space and labelling the locations in the layout pattern; dividing the layout pattern into multiple view tiles according to a unit area or a unit volume for displaying the layout pattern; dividing a portion of the layout pattern around the labelled positioning devices into multiple positioning tiles according to the labelled locations of the positioning devices; and selecting at least one representative point of the view tiles and the positioning tiles as a reference point to define a reference frame and establishing the coordinate system based on the reference frame.

Abstract: A ticket authentication method and a ticket authentication device are provided. The ticket authentication method includes the following steps. A first electronic device outputs an e-ticket. A second electronic device acquires the e-ticket. The second electronic device outputs a visible light verification code. The first electronic device acquires the visible light verification code and generates a composite code according to a certification data and the verification code. The second electronic device acquires the visible light composite code, and determines whether the composite code matches the certification data and the verification code. When the composite code matches the certification data and the verification code, the second electronic determines that the authentication of the e-ticket is successful.

Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

Abstract: The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.

Abstract: A dynamic prediction model establishment method, an electric device and a user interface are provided. The dynamic prediction model establishment method includes the following steps. An integration model is established by a processing device according to at least one auxiliary data set. The integration model is modified as a dynamic prediction model by the processing device according to a target data set. A sampling point recommendation information is provided by the processing device according to an error degree or an uncertainty degree between the at least one auxiliary data set and the target data set.

Abstract: A prognostic method and a prognostic apparatus for a processing apparatus are provided. In the steps of the prognostic method, multiple sensor data of a component of the processing apparatus and a heterogeneous data are obtained, multiple health indicators of the component are obtained by the multiple sensor data, a regressive characteristic function and an adjustment function are obtained according to the health indicators, the adjustment function corresponds to the heterogeneous data, a prediction function of health indicator is obtained according to the regressive characteristic function and the adjustment function, and a predictive value of health indicator is obtained according to the prediction function of health indicator to estimate a usage status of the component.