Abstract: A method for using a moisture-protective container to protect an integrated circuit is disclosed herein. The integrated circuit is placed into a container having a first surface and a second surface that is opposite the first surface, and then the container is closed with a seal. Next, the seal is broken to remove the integrated circuit for evaluation. After evaluation without subjecting the integrated circuit to burn-in, the integrated circuit is restored to the container and the container is resealed with the seal. Lastly, the seal of the container is broken to connect the integrated circuit to a substrate without elevating the temperature surrounding the integrated circuit above the temperature at which evaluation occurred.