Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass article having a first glass layer, a second glass layer disposed adjacent to the first glass layer, and an interface slidably coupling the first glass layer to the second glass layer. The interface has a thickness of from 2 nm to 500 nm. The glass article is characterized by: (a) an absence of failure when the article is held at a parallel plate separation distance of 10 mm for 60 minutes at 25° C. and 50% relative humidity; (b) a puncture resistance of greater than about 6 kgf when the second glass layer is supported by (i) a 50 ?m thick pressure-sensitive adhesive having an elastic modulus of less than 1 GPa and (ii) an approximately 100 ?m thick polyethylene terephthalate layer having an elastic modulus of less than 10 GPa, and the first glass layer is loaded with a tungsten carbide ball having a 1 mm diameter.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass roof shingle includes a shingle cover layer made of a glass. A shingle base layer is disposed underneath the shingle cover layer. The shingle base layer and shingle cover layer define a cavity. A seal area formed between the shingle base layer and shingle cover layer and around the cavity controls ingress of moisture into the cavity. A photovoltaic module may be disposed within the cavity.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A glass roof shingle includes a shingle cover layer made of a glass. A shingle base layer is disposed underneath the shingle cover layer. The shingle base layer and shingle cover layer define a cavity. A seal area formed between the shingle base layer and shingle cover layer and around the cavity controls ingress of moisture into the cavity. A photovoltaic module may be disposed within the cavity.

Abstract: A glass roof shingle includes a shingle cover layer made of a glass. A shingle base layer is disposed underneath the shingle cover layer. The shingle base layer and shingle cover layer define a cavity. A seal area formed between the shingle base layer and shingle cover layer and around the cavity controls ingress of moisture into the cavity. A photovoltaic module may be disposed within the cavity.

Abstract: A glass article having a first glass layer, a second glass layer disposed adjacent to the first glass layer, and an interface slidably coupling the first glass layer to the second glass layer. The interface has a thickness of from 2 nm to 500 nm. The glass article is characterized by: (a) an absence of failure when the article is held at a parallel plate separation distance of 10 mm for 60 minutes at 25° C. and 50% relative humidity; (b) a puncture resistance of greater than about 6 kgf when the second glass layer is supported by (i) a 50 ?m thick pressure-sensitive adhesive having an elastic modulus of less than 1 GPa and (ii) an approximately 100 ?m thick polyethylene terephthalate layer having an elastic modulus of less than 10 GPa, and the first glass layer is loaded with a tungsten carbide ball having a 1 mm diameter.

Abstract: A stack assembly including a glass element having a thickness of less than or equal to 200 microns, and a first layer supporting the glass element. The glass element having a first pen drop height value when directly adjacent on a solid aluminum stage. The first layer having a stiffness of from 9×105 N/m to 2.0×106 N/m. When the glass element is supported by the first layer on the aluminum stage, the glass element comprises a second pen drop height value, wherein the second pen drop height value is greater than the first pen drop height value.

Abstract: A glass roof shingle includes a shingle cover layer made of a glass. A shingle base layer is disposed underneath the shingle cover layer. The shingle base layer and shingle cover layer define a cavity. A seal area formed between the shingle base layer and shingle cover layer and around the cavity controls ingress of moisture into the cavity. A photovoltaic module may be disposed within the cavity.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.