Patents by Inventor Porter Chen

Porter Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacture
    Patent number: 11056471
    Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: July 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng Lin, Po-Hao Tsai, Li-Hui Cheng, Porter Chen
  • Semiconductor Device and Method of Manufacture
    Publication number: 20200126959
    Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 23, 2020
    Inventors: Jing-Cheng Lin, Po-Hao Tsai, Li-Hui Cheng, Porter Chen
  • Semiconductor device and method of manufacture
    Patent number: 10515937
    Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng Lin, Po-Hao Tsai, Li-Hui Cheng, Porter Chen
  • Semiconductor Device and Method of Manufacture
    Publication number: 20180308828
    Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.
    Type: Application
    Filed: June 25, 2018
    Publication date: October 25, 2018
    Inventors: Jing-Cheng Lin, Po-Hao Tsai, Li-Hui Cheng, Porter Chen
  • Semiconductor device and method of manufacture
    Patent number: 10008485
    Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: June 26, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng Lin, Po-Hao Tsai, Li-Hui Cheng, Porter Chen
  • Semiconductor Device and Method of Manufacture
    Publication number: 20170229434
    Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.
    Type: Application
    Filed: April 24, 2017
    Publication date: August 10, 2017
    Inventors: Jing-Cheng Lin, Po-Hao Tsai, Li-Hui Cheng, Porter Chen
  • Semicondutor device and method of manufacture
    Patent number: 9633934
    Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: April 25, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng Lin, Po-Hao Tsai, Li-Hui Cheng, Porter Chen
  • Semicondutor Device and Method of Manufacture
    Publication number: 20160148857
    Abstract: A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package configuration is presented. In an embodiment a metal layer is formed on a backside of the semiconductor die, and the semiconductor die along and through vias are encapsulated. Portions of the metal layer are exposed and a thermal die is connected to remove heat from the semiconductor die.
    Type: Application
    Filed: November 26, 2014
    Publication date: May 26, 2016
    Inventors: Jing-Cheng Lin, Po-Hao Tsai, Li-Hui Cheng, Porter Chen