Abstract: A variable payload robot is disclosed. In various embodiments, a robot includes two or more joints, each actuated by an associated joint motor and each joint motor having a different capacity, the robot comprising an end effector configured to grasp an object. A processor coupled to the robot is configured to determine based at least in part on the respective capacities of at least a subset of the joint motors and a payload related attribute of the object a plan and trajectory to move the object from a source location to a destination location.

Abstract: A robotic sorting system, method, and device is disclosed. The robotic sorting system includes a communication interface, and one or more processors coupled to the communication interface. The one or more processors are configured to (a) obtain item data via the communication interface, the item data including an indication of one or more items to be routed across a plurality of outbound stations, (b) obtain capability data for the plurality of outbound stations, the capability data indicating one or more capabilities for at least one outbound station, (c) determine a plan to route a selected item to a destination outbound station selected from among the plurality of outbound station, the plan being determined based at least in part on the item data and the capability data for the destination outbound station, and (d) cause the plan to be implemented to route the item to a particular handling path associated with the destination outbound station.

Abstract: The present invention pertains to methods for removing unwanted material from a work piece. More specifically, the invention pertains to stripping photo-resist material and removing etch-related residues from a semiconductor wafer during semiconductor manufacturing. Methods involve implementing a hydrogen plasma operation with downstream mixing with an inert gas. The invention is effective at stripping photo-resist and removing residues from low-k dielectric material used in Damascene devices.

Abstract: The present invention pertains to methods for removing unwanted material from a work piece. More specifically, the invention pertains to stripping photo-resist material and removing etch-related residues from a semiconductor wafer during semiconductor manufacturing. Methods involve implementing a hydrogen plasma operation with downstream mixing with an inert gas. The invention is effective at stripping photo-resist and removing residues from low-k dielectric material used in Damascene devices.