Abstract: Aspects of the present disclosure relate to methods, systems, and apparatus for conducting a radical treatment operation on a substrate prior to conducting an annealing operation on the substrate. In one implementation, a method of processing semiconductor substrates includes pre-heating a substrate, and exposing the substrate to species radicals. The exposing of the substrate to the species radicals includes a treatment temperature that is less than 300 degrees Celsius, a treatment pressure that is less than 1.0 Torr, and a treatment time that is within a range of 8.0 minutes to 12.0 minutes. The method includes annealing the substrate after the exposing of the substrate to the species radicals. The annealing includes exposing the substrate to molecules, an anneal temperature that is 300 degrees Celsius or greater, an anneal pressure that is within a range of 500 Torr to 550 Torr, and an anneal time that is less than 4.0 minutes.

Abstract: A method includes obtaining position information describing a first location and a second location of an asset; obtaining heading samples for the asset; determining a reference path for the asset from the first location to the second location based on the heading samples; identifying candidate paths from the first location to the second location using map information; and determining a predicted path for the asset by matching the reference path to one of the candidate paths.

Abstract: A telematics system includes a telematics input unit that has a first housing and an electrical barrier located in the telematics input unit. The telematics input unit is connectable to a power supply through the electrical barrier and provides safe electrical power. A telematics transmitter unit has a second housing and is remote from the telematics input unit. The telematics transmitter unit receives the safe electrical power from the telematics input unit. A communications device is disposed within the telematics transmitter unit.