Patents by Inventor Prajwal Shah

Prajwal Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11845243
    Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: December 19, 2023
    Assignee: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Prajwal Shah
  • Patent number: 11312120
    Abstract: A multilayer shrink film comprising at least one core layer positioned between a first skin layer and a second skin layer, wherein the multilayer shrink film comprising an ethylene/alpha-olefin interpolymer composition and a low density polyethylene.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: April 26, 2022
    Assignees: Dow Global Technologies LLC, PBBPolisur S.R.L.
    Inventors: Kaustubh Gupte, Edward L. Lee, Marlos Giuntini De Oliveira, Rajen M. Patel, Guillermo A. Raimondi, Prajwal Shah, Maximiliano Zanetti
  • Publication number: 20220072835
    Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Applicant: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Prajwal Shah
  • Patent number: 11179919
    Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: November 23, 2021
    Assignee: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Prajwal Shah
  • Publication number: 20200171809
    Abstract: A multilayer shrink film comprising at least one core layer positioned between a first skin layer and a second skin layer, wherein the multilayer shrink film comprising an ethylene/alpha-olefin interpolymer composition and a low density polyethylene.
    Type: Application
    Filed: June 29, 2018
    Publication date: June 4, 2020
    Inventors: Kaustubh Gupte, Edward L. Lee, Marlos Giuntini De Oliveira, Rajen M. Patel, Guillermo A. Raimondi, Prajwal Shah, Maximiliano Zanetti
  • Patent number: 10150275
    Abstract: A multi-layer structure comprising: (a) a skin layer comprising at least 50% by weight of an ethylene/?-olefin interpolymer composition (LLDPE) having a Comonomer Distribution Constant (CDC) in the range of from 45 to 400, and wherein the skin layer does not contain any migratory additive; (b) a metal layer disposed on the skin layer to form a metalized film; and (c) at least one substrate layer laminated onto the metallized film; wherein the ethylene/?-olefin interpolymer composition comprises (i) less than or equal to 100 percent by weight of the units derived from ethylene; and (ii) less than 30 percent by weight of units derived from one or more ?-olefin comonomers is provided.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: December 11, 2018
    Assignees: Dow Global Technologies LLC, Dow Chemical (Malaysia) Sdn. Bhd., Dow Chemical IMEA GmbH
    Inventors: Prajwal Shah, Shashibhushan S. Mishra, Tamanna Duggal, Prashant Mogre, Eng Kian Ma
  • Publication number: 20170326847
    Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, 12, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
    Type: Application
    Filed: December 14, 2015
    Publication date: November 16, 2017
    Applicant: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Prajwal Shah
  • Publication number: 20160144603
    Abstract: A multi-layer structure comprising: (a) a skin layer comprising at least 50% by weight of an ethylene/?-olefin interpolymer composition (LLDPE) having a Comonomer Distribution Constant (CDC) in the range of from 45 to 400, and wherein the skin layer does not contain any migratory additive; (b) a metal layer disposed on the skin layer to form a metalized film; and (c) at least one substrate layer laminated onto the metallized film; wherein the ethylene/?-olefin interpolymer composition comprises (i) less than or equal to 100 percent by weight of the units derived from ethylene; and (ii) less than 30 percent by weight of units derived from one or more ?-olefin comonomers is provided.
    Type: Application
    Filed: July 2, 2013
    Publication date: May 26, 2016
    Inventors: Prajwal Shah, Shashibhushan S. Mishra, Tamanna Duggal, Prashant Mogre, Eng Kian MA