Abstract: Systems and methods for temperature measurement. In an example embodiment, two or more arrays of multi-spot temperature elements can be implemented, wherein at least one array among the two or more arrays constitutes a primary temperature measurement array and at least one other array among the two or more arrays constitutes a redundant temperature measurement array. The redundant temperature measurement array includes redundant spot temperature elements equivalent to spot temperature elements associated with the primary temperature measurement array. A transmitter assembly can also be provided, which communicates electronically with the aforementioned two or more arrays, and which processes and controls such arrays of the multi-spot temperature elements. The secondary (redundant) elements can be configured from the same material as that of the primary spot element(s) or can be composed of a different material depending on the sensor type (e.g., thermcouple, thermistor, etc.).

Abstract: Systems and methods for temperature measurement. In an example embodiment, two or more arrays of multi-spot temperature elements can be implemented, wherein at least one array among the two or more arrays constitutes a primary temperature measurement array and at least one other array among the two or more arrays constitutes a redundant temperature measurement array. The redundant temperature measurement array includes redundant spot temperature elements equivalent to spot temperature elements associated with the primary temperature measurement array. A transmitter assembly can also be provided, which communicates electronically with the aforementioned two or more arrays, and which processes and controls such arrays of the multi-spot temperature elements. The secondary (redundant) elements can be configured from the same material as that of the primary spot element(s) or can be composed of a different material depending on the sensor type (e.g., thermcouple, thermistor, etc.).