Patents by Inventor Praveen Yadev

Praveen Yadev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package element with internal meniscus for bubble free lens placement
    Patent number: 7804147
    Abstract: A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: September 28, 2010
    Assignee: Cree, Inc.
    Inventors: Eric Tarsa, Thomas C. Yuan, Maryanne Becerra, Praveen Yadev
  • Light emitting diode package element with internal meniscus for bubble free lens placement
    Publication number: 20080026498
    Abstract: A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature.
    Type: Application
    Filed: July 31, 2006
    Publication date: January 31, 2008
    Inventors: Eric Tarsa, Thomas C. Yuan, Maryanne Becerra, Praveen Yadev