Abstract: An invention providing improvement in integrity testing of wire bonds between an IC die and a BGA substrate. The invention includes a BGA integrated circuit package comprising: 1) a BGA substrate having conducting bond fingers and a grounded feature on a first side thereof; 2) an IC die electrically connected to the conducting bond fingers with wire bonds; the BGA substrate configured to be formed into a singulated unit with the IC die; wherein the BGA substrate does not have direct electrical connection on the first side thereof between the bond fingers and the grounded feature; 4) the BGA substrate including an indirect electrical connection pathway from each wire bond to the grounded feature that enables electrical integrity testing for the wire bonds; the indirect electrical connection pathway configured so that at least a portion of each indirect electrical connection pathway is not present on the singulated unit.