Abstract: In accordance with this invention, hermetically sealed transition joint for use with a microwave package which has a receptacle including a side wall made of a first weldable material with a feed-through opening therein. The transition joint includes a first layer of a first material sized to extend across the feed-through opening and weldable to the side wall to form a hermetic seal. A second layer of a second material is explosively bonded to the first layer and sized to match and be received within the feed-through opening. A connector opening extends through the first and second layers. A pin connector unit made of the second material and having electrical pins extending therethrough is sized to fit within the connector opening and is welded to the second layer to form a hermetic seal. The first layer may be aluminum or aluminum alloy and the second layer can be any one of Kovar, cold rolled steel, stainless steel or iron-nickel alloy. Conveniently, the welding is done by laser welding.

Abstract: In accordance with this invention, a hermetically sealed transition joint for use with a microwave package which has a receptacle including a side wall made of a first weldable material with a feed-through opening therein. The transition joint includes a first layer of a first material sized to extend across the feed-through opening and weldable to the side wall to form a hermetic seal. A second layer of a second material is explosively bonded to the first layer and sized to match and be received within the feed-through opening. A connector opening extends through the first and second layers. A pin connector unit made of the second material and having electrical pins extending therethrough is sized to fit within the connector opening and is welded to the second layer to form a hermetic seal. The first layer may be aluminum or aluminum alloy and the second layer can be any one of Kovar, cold rolled steel, stainless steel or iron-nickel alloy. Conveniently, the welding is done by laser welding.

Abstract: The present invention is a package for housing microcircuit components and the method of manufacturing the same, the latter of which includes the steps of explosively bonding first and second dissimilar metals to produce a base member, machining that base member to produce a flat bottom portion with upstanding side walls defining an interior volume in the first metal, the side walls of which are surmounted by a ring formed of the second metal, whereby the said ring can be low temperature welded to a cover piece without adversely thermally affecting the metallurgical properties of the first metal.

Abstract: In one embodiment, a microwave package is constructed from a block of aluminum having layers of material clad to opposite sides thereof having a lower coefficient of thermal expansion than the aluminum block. A receptacle is formed by milling away a portion of one of the layers and a large portion of the aluminum while maintaining an aluminum base or floor within the receptacle. Ceramic substrates can be attached to the floor and connected to wires which extend through feedthrough openings either in the aluminum side walls of the receptacle or through the clad material. A cover can be hermetically attached, as by welding, to the layer of clad material to complete the microwave package assembly. An alternative form of the invention, a metal matrix material can be used which has a layer of copper or aluminum clad to the top surface. The microwave package is formed by milling away a portion of this top surface to form the container.