Abstract: A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.

Abstract: Methods and devices for active control for two-phase cooling include a cooling volume that has cavities and active coolant flow controls in the cavities configured to adjust coolant flow through the cavities. A reservoir in fluid communication with the cavities and there is a two-phase coolant in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A coolant sensor is configured to determine a coolant phase condition in the cavities. A control module is configured to adjust the active coolant flow controls in response to the determined coolant phase condition.

Abstract: A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

Abstract: Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.

Abstract: A computing system includes a first pool of collocated high heat density computing components; a second pool of collocated low heat density computing components; and a reconfigurable switching fabric electrically interconnecting the pools. A first cooling structure is in thermal communication with the first pool; a second cooling structure is in thermal communication with the second pool; and at least one heat rejection unit is in thermal communication with the first cooling structure, the second cooling structure, and at least one heat sink. A controller is configured to obtain a specification of a computing workload; electrically configure at least a portion of the first pool and at least a portion of the second pool to handle the computing workload, by reconfiguring the switching fabric; and select operating parameters for the first and second cooling structures and the at least one heat rejection unit to handle the computing workload.

Abstract: A computing system includes a first pool of collocated high heat density computing components; a second pool of collocated low heat density computing components; and a reconfigurable switching fabric electrically interconnecting the pools. A first cooling structure is in thermal communication with the first pool; a second cooling structure is in thermal communication with the second pool; and at least one heat rejection unit is in thermal communication with the first cooling structure, the second cooling structure, and at least one heat sink. A controller is configured to obtain a specification of a computing workload; electrically configure at least a portion of the first pool and at least a portion of the second pool to handle the computing workload, by reconfiguring the switching fabric; and select operating parameters for the first and second cooling structures and the at least one heat rejection unit to handle the computing workload.

Abstract: An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.

Abstract: An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.

Abstract: A method of minimizing the volume of coolant leaked in a liquid cooled electronic system. The method includes detecting a coolant leak in a closed liquid cooling loop from a plurality of closed liquid cooling loops in the server rack. The closed liquid cooling loop may be coupled to at least one server in the server rack. The method may further include identifying the location of the coolant leak in the closed liquid cooling loop of an affected server in the server rack, and powering off a pump, from a plurality of pumps in the server rack, pumping coolant in the closed liquid cooling loop having the coolant leak.

Abstract: An apparatus for minimizing the volume of coolant leaked in liquid cooled electronic equipment, the apparatus including a server rack, a plurality of closed liquid cooling loops, a plurality of liquid to liquid heat exchangers, and a plurality of pumps. The closed liquid cooling loops are coupled to at least one of the servers in the server rack. Each of the closed liquid cooling loops restricts coolant flow entirely within the server rack. The closed liquid cooling loops may provide the entire volume of coolant provided to each server in the server rack.

Abstract: Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.

Abstract: Methods and devices for active control for two-phase cooling include a cooling volume that has cavities and active coolant flow controls in the cavities configured to adjust coolant flow through the cavities. A reservoir in fluid communication with the cavities and there is a two-phase coolant in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A coolant sensor is configured to determine a coolant phase condition in the cavities. A control module is configured to adjust the active coolant flow controls in response to the determined coolant phase condition.

Abstract: A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.

Abstract: A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.

Abstract: A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.

Abstract: Cooling control methods include measuring a temperature of at least one component of each of multiple nodes and finding a maximum component temperature across all such nodes, comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold, and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the nodes based on the comparisons.

Abstract: An integrated circuit (IC) can be cooled by using a structure that includes two elements, such as integrated circuits (ICs) or electronic packages, in a stacked arrangement, with the elements having surfaces that face each other. The structure also includes a pair of fluidic channel boundaries, between the facing surfaces, where each fluidic channel boundary is formed by an arrangement of adjacent discrete connecting structures. The primary and secondary fluidic channel boundaries and the facing surfaces define a fluidic channel that is useful for promoting boiling of and directing the flow of a refrigerant between the two surfaces.

Abstract: Cooling apparatuses are provided to facilitate active control of thermal and fluid dynamic performance of a coolant-cooled cold plate. The cooling apparatus includes the cold plate and a controller. The cold plate couples to one or more electronic components to be cooled, and includes an adjustable physical configuration. The controller dynamically varies the adjustable physical configuration of the cold plate based on a monitored variable associated with the cold plate or the electronic component(s) being cooled by the cold plate. By dynamically varying the physical configuration, the thermal and fluid dynamic performance of the cold plate are adjusted to, for example, optimally cool the electronic component(s), and at the same time, reduce cooling power consumption used in cooling the electronic component(s). The physical configuration can be adjusted by providing one or more adjustable plates within the cold plate, the positioning of which may be adjusted based on the monitored variable.

Abstract: A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

Abstract: A manifold for cooling electronic equipment, the manifold including a facility side coolant supply line, a facility side coolant return line, liquid-to-liquid heat exchangers, and pumps. The liquid-to-liquid heat exchangers are connected in parallel to the facility side coolant supply line. Each of the pumps is coupled to a liquid-to-liquid heat exchanger and regulates coolant flow through the coupled liquid-to-liquid heat exchangers.