Patents by Inventor Prosenjit Ghosh

Prosenjit Ghosh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10219409
    Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in display devices are disclosed. An example embodiment includes: a display device layer fabricated from a substrate, the display device layer including a plurality of in-built channels integrated therein; and a plurality of wickless capillary driven constrained vapor bubble heat pipes being embedded into the plurality of in-built channels, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: February 26, 2019
    Assignee: Intel Corporation
    Inventors: Sumita Basu, Shantanu D. Kulkarni, Prosenjit Ghosh, Konstantin I. Kouliachev
  • Publication number: 20190041918
    Abstract: Embodiments include apparatuses, methods, and systems for computing. A computing apparatus may include a first computing part and a second computing part. The first computing part and the second computing part may be attached to a spine assembly. The first computing part may include a first electronic interface and a first mechanical attachment coupler to be coupled to the spine assembly, while the second computing part may include a second electronic interface and a second mechanical attachment coupler to be coupled to the spine assembly. The first computing part or the second computing part may rotate around a rotation hinge of the spine assembly from a first position to a second position. Other embodiments may also be described and claimed.
    Type: Application
    Filed: June 27, 2018
    Publication date: February 7, 2019
    Inventors: Denica N. Larsen, Prosenjit Ghosh, Murali Veeramoney, Praveen Vishakantaiah
  • Publication number: 20190025949
    Abstract: Systems and methods for the use of a brush stylus are provided herein. In one example, a system includes a brush stylus, wherein the brush stylus includes a plurality of active bristles. The active bristles provide data to the brush stylus, a computing device the other brush stylus, or both, when the brush stylus is in contact with a touchscreen on the computing device.
    Type: Application
    Filed: July 18, 2017
    Publication date: January 24, 2019
    Applicant: INTEL CORPORATION
    Inventors: Kunjal Parikh, Arvind Kumar, Jordan E. Maslov, Shantanu Kulkarni, Prosenjit Ghosh
  • Publication number: 20180329462
    Abstract: An apparatus including a hinge assembly is described herein. The hinge assembly including a plurality of substantially parallel hinges, each said hinge of the plurality being attached to at least one adjacent said hinge, wherein a first outermost hinge is coupled to a first housing and a second outermost hinge is coupled to a second housing, each said hinge of the plurality to provide a respective range of rotation to the hinge assembly such that the first and second housings may be rotated relative to each other about the hinge assembly within a range of approximately between 0 degrees and 360 degrees.
    Type: Application
    Filed: December 26, 2015
    Publication date: November 15, 2018
    Applicant: INTEL CORPORATION
    Inventors: Denica N. Larsen, Chunlin Bai, Prosenjit Ghosh
  • Publication number: 20180246546
    Abstract: Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.
    Type: Application
    Filed: September 25, 2015
    Publication date: August 30, 2018
    Applicant: Intel Corporation
    Inventors: Prosenjit Ghosh, Denica N. Larsen, James M. Okuley, Hong W. Wong
  • Publication number: 20180004339
    Abstract: Embodiments are generally directed to a touch sensitive screen with dynamically modifiable writing surface. An embodiment of a display includes a dynamically modifiable writing surface, the writing surface including one or more configuration mechanisms; a touch sensitive element coupled with the writing surface; and a display element coupled with the touch sensitive layer, wherein the one or more configuration mechanisms are configurable to modify one or more characteristics of the writing in response to an activation received by the display.
    Type: Application
    Filed: July 2, 2016
    Publication date: January 4, 2018
    Inventors: Shantanu D. KULKARNI, Prosenjit Ghosh, Denica L. Larsen, Jordan E. Maslov
  • Publication number: 20170314874
    Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.
    Type: Application
    Filed: December 29, 2016
    Publication date: November 2, 2017
    Applicant: Intel Corporation
    Inventors: Sumita Basu, Shantanu D. Kulkarni, Prosenjit Ghosh, Konstantin I. Kouliachev
  • Publication number: 20170318687
    Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in display devices are disclosed. An example embodiment includes: a display device layer fabricated from a substrate, the display device layer including a plurality of in-built channels integrated therein; and a plurality of wickless capillary driven constrained vapor bubble heat pipes being embedded into the plurality of in-built channels, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
    Type: Application
    Filed: December 29, 2016
    Publication date: November 2, 2017
    Applicant: Intel Corporation
    Inventors: Sumita Basu, Shantanu D. Kulkarni, Prosenjit Ghosh, Konstantin I. Kouliachev
  • Publication number: 20170318702
    Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
    Type: Application
    Filed: December 28, 2016
    Publication date: November 2, 2017
    Inventors: Sumita Basu, Shantanu D. Kulkarni, Prosenjit Ghosh, Konstantin I. Kouliachev
  • Publication number: 20170314871
    Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in heat sinks are disclosed. An example embodiment includes: a base; and a plurality of fins in thermal coupling with the base, each fin of the plurality of fins having a wickless capillary driven constrained vapor bubble heat pipe embedded in the fin, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
    Type: Application
    Filed: December 29, 2016
    Publication date: November 2, 2017
    Applicant: Intel Corporation
    Inventors: Sumita Basu, Shantanu D. Kulkarni, Prosenjit Ghosh, Konstantin I. Kouliachev
  • Publication number: 20170205858
    Abstract: In one example an electronic device comprises at least heat generating component, a heat spreader positioned proximate the at least one heat generating component and a passive radiator cooling device, comprising an enclosure, an active speaker positioned at least partially within the enclosure, and a passive audio radiator positioned at least partially within the enclosure. Other examples may be described.
    Type: Application
    Filed: September 28, 2014
    Publication date: July 20, 2017
    Applicant: Intel Corporation
    Inventors: Hong W. Wong, Yanbing Sun, Shaorong Zhou, Xiaoguo Liang, Wah Yiu Kwong, Cheong W. Wong, Jiancheng Tao, Prosenjit Ghosh
  • Patent number: 9635782
    Abstract: Thermally actuated vents for electronic devices. An embodiment of an apparatus includes a vent having a first position and a second position, wherein the first position is an open position and the second position is a closed position; a muscle wire, a first end of the muscle wire being coupled with a connection to the vent and a second end of the muscle wire being coupled with an anchor point; and a tension element, a first end of the tension element being coupled with the vent at a connection point. The muscle wire is to apply a force to the vent to move the vent to the open position upon the muscle wire entering a contracted state, and the tension element pulling the vent to the closed position upon the muscle wire entering a relaxed state.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: April 25, 2017
    Assignee: Intel Corporation
    Inventors: Denica N. Larsen, Prosenjit Ghosh
  • Patent number: 9450363
    Abstract: An adaptor may include a base modular unit that includes a plurality of surface connectors, a first port and circuitry. At least one surface connector may couple to an expansion modular unit. Circuitry or logic may provide information from the first port to the at least one surface connector.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: September 20, 2016
    Assignee: Intel Corporation
    Inventors: Prosenjit Ghosh, John J. Valavi, Ajay V. Bhatt
  • Publication number: 20160165753
    Abstract: Thermally actuated vents for electronic devices. An embodiment of an apparatus includes a vent having a first position and a second position, wherein the first position is an open position and the second position is a closed position; a muscle wire, a first end of the muscle wire being coupled with a connection to the vent and a second end of the muscle wire being coupled with an anchor point; and a tension element, a first end of the tension element being coupled with the vent at a connection point. The muscle wire is to apply a force to the vent to move the vent to the open position upon the muscle wire entering a contracted state, and the tension element pulling the vent to the closed position upon the muscle wire entering a relaxed state.
    Type: Application
    Filed: February 12, 2016
    Publication date: June 9, 2016
    Inventors: Denica N. Larsen, Prosenjit Ghosh
  • Patent number: 9261926
    Abstract: Thermally actuated vents for electronic devices. An embodiment of an apparatus includes a vent having a first position and a second position, wherein the first position is an open position and the second position is a closed position; a muscle wire, a first end of the muscle wire being coupled with a connection to the vent and a second end of the muscle wire being coupled with an anchor point; and a tension element, a first end of the tension element being coupled with the vent at a connection point. The muscle wire is to apply a force to the vent to move the vent to the open position upon the muscle wire entering a contracted state, and the tension element pulling the vent to the closed position upon the muscle wire entering a relaxed state.
    Type: Grant
    Filed: June 29, 2013
    Date of Patent: February 16, 2016
    Assignee: Intel Corporation
    Inventors: Denica N. Larsen, Prosenjit Ghosh
  • Publication number: 20150169009
    Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section, the second section coupled to the first section by a hinge assembly comprising a shaft, a bracket to be rotatably mounted on the shaft, a first resistance element to provide a first rotational resistance between the bracket and the shaft in a first angular range from a closed position, and a second resistance element to provide a second rotational resistance between the bracket and the shaft, greater than the first rotational resistance, in a second angular range, greater than the first angular range. Other embodiments may be described.
    Type: Application
    Filed: June 28, 2013
    Publication date: June 18, 2015
    Inventors: Prosenjit Ghosh, Denica N. Larsen
  • Publication number: 20150093937
    Abstract: An adaptor may include a base modular unit that includes a plurality of surface connectors, a first port and circuitry. At least one surface connector may couple to an expansion modular unit. Circuitry or logic may provide information from the first port to the at least one surface connector.
    Type: Application
    Filed: September 27, 2013
    Publication date: April 2, 2015
    Inventors: Prosenjit GHOSH, John J. VALAVI, Ajay V. SHAn
  • Patent number: D762639
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: August 2, 2016
    Assignee: Intel Corporation
    Inventors: Tommy S. Montoya, Prosenjit Ghosh
  • Patent number: D822658
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: July 10, 2018
    Assignee: Intel Corporation
    Inventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
  • Patent number: D846545
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: April 23, 2019
    Assignee: Intel Corporation
    Inventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar