Patents by Inventor Purushothaman Balamuralidhar

Purushothaman Balamuralidhar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10567310
    Abstract: System(s) and method(s) for real-time data communication over an Internet of Things (IoT) network are described. According to the present subject matter, the system(s) implement the described method(s) for real-time data communication over the IoT network. The method includes encoding, at a source communication device, data to be exchanged between peer sub-layers of IoT entities based on a Forward Error Correction (FEC) context to generate encoded data packets, the IoT entities comprising the source communication device and a destination communication device. The method further includes identifying time delay to be maintained for transmission of the encoded data packets from the source communication device to the destination communication device to have minimal data packet drop due to queue overflow at the source communication device. The method further includes transmitting the encoded data packets over the IoT network.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: February 18, 2020
    Assignee: Tata Consultancy Services Limited
    Inventors: Hrishikesh Sharma, Aditya Sood, Purushothaman Balamuralidhar
  • Patent number: 9112260
    Abstract: The subject matter described herein relates a microstrip antenna. In one implementation, the microstrip antenna comprises a dielectric substrate, a first metallic layer on a first side of the dielectric substrate and a second metallic layer on a second side, opposite to the first side, of the dielectric substrate. The first metallic layer on the dielectric substrate comprises one or more end-to-end slots to divide the first metallic layer into a plurality of microstrip patches. The microstrip antenna also comprises a feed circuit which is electromagnetically coupled to the plurality of microstrip patches and the second metallic layer.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: August 18, 2015
    Assignee: Tata Consultancy Services Limited
    Inventors: Tapas Chakravarty, Purushothaman Balamuralidhar
  • Publication number: 20150063368
    Abstract: System(s) and method(s) for real-time data communication over an Internet of Things (IoT) network are described. According to the present subject matter, the system(s) implement the described method(s) for real-time data communication over the IoT network. The method includes encoding, at a source communication device, data to be exchanged between peer sub-layers of IoT entities based on a Forward Error Correction (FEC) context to generate encoded data packets, the IoT entities comprising the source communication device and a destination communication device. The method further includes identifying time delay to be maintained for transmission of the encoded data packets from the source communication device to the destination communication device to have minimal data packet drop due to queue overflow at the source communication device. The method further includes transmitting the encoded data packets over the IoT network.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 5, 2015
    Inventors: Hrishikesh Sharma, Aditya Sood, Purushothaman Balamuralidhar
  • Publication number: 20130241794
    Abstract: The subject matter described herein relates a microstrip antenna. In one implementation, the microstrip antenna comprises a dielectric substrate, a first metallic layer on a first side of the dielectric substrate and a second metallic layer on a second side, opposite to the first side, of the dielectric substrate. The first metallic layer on the dielectric substrate comprises one or more end-to-end slots to divide the first metallic layer into a plurality of microstrip patches. The microstrip antenna also comprises a feed circuit which is electromagnetically coupled to the plurality of microstrip patches and the second metallic layer.
    Type: Application
    Filed: February 22, 2013
    Publication date: September 19, 2013
    Inventors: Tapas CHAKRAVARTY, Purushothaman Balamuralidhar