Patents by Inventor QIAN PANG

QIAN PANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11765528
    Abstract: A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 19, 2023
    Assignee: LITE-ON SINGAPORE PTE. LTD.
    Inventors: Guang-Li Song, Suresh Basoor Nijaguna, Qian Pang
  • Publication number: 20230092867
    Abstract: Provided is a method for improving impurities removal in the protein purification by affinity chromatography, comprising 1) loading a protein sample onto an affinity chromatography column, 2) washing the column with a wash buffer solution comprising Histidine or Imidazole, and a pH-adjusting agent.
    Type: Application
    Filed: January 19, 2021
    Publication date: March 23, 2023
    Inventors: Haikuan LIU, Qian PANG, Jing WU
  • Publication number: 20230026571
    Abstract: A thermal sensor package is provided. The thermal sensor package includes a carrier, an integrated circuit chip (IC), an adhesive, a thermal sensor, and a cover that are stacked form bottom to top. The carrier defines a space. The IC and thermal sensor are arranged in the space. At least one part of the adhesive is disposed between the thermal sensor and the IC. The cover closes the space defined by the carrier.
    Type: Application
    Filed: January 4, 2022
    Publication date: January 26, 2023
    Inventors: YU-HSIEN LIU, Suresh Basoor Nijaguna, QIAN PANG, I-CHEN CHIEN
  • Patent number: 11444219
    Abstract: A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: September 13, 2022
    Assignee: LITE-ON SINGAPORE PTE. LTD.
    Inventors: Guang-Li Song, Wei-Chee Lee, Qian Pang
  • Publication number: 20220102575
    Abstract: A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.
    Type: Application
    Filed: September 30, 2020
    Publication date: March 31, 2022
    Inventors: GUANG-LI SONG, WEI-CHEE LEE, QIAN PANG
  • Publication number: 20220103954
    Abstract: A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.
    Type: Application
    Filed: September 28, 2020
    Publication date: March 31, 2022
    Inventors: GUANG-LI SONG, Suresh Basoor Nijaguna, QIAN PANG