Patents by Inventor Qian Ying
Qian Ying has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11985619Abstract: In a wireless communication environment, there may arise a timing misalignment for SRS-RSRP measurement. In order to address this issue, a UE may receive an uplink transmission from second UE containing the uplink transmission timing for the first UE. The UE may then set its measurement timing to be the same as the uplink transmission timing. The UE then carries out SRS-RSRP measurement according to the newly-set measurement timing.Type: GrantFiled: February 17, 2020Date of Patent: May 14, 2024Assignee: APPLE INC.Inventors: Dawei Ying, Hassan Ghozlan, Qian Li, Geng Wu
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Patent number: 11979764Abstract: Embodiments of the present disclosure describe methods and apparatuses for measurements and reports in integrated access and backhaul networks. An integrated access and backhaul (IAB) node is configured to: receive radio resource control (RRC) signaling from a IAB donor node, the RRC signaling to include configuration information with respect to reference signals of the IAB donor node or one or more neighboring IAB nodes; perform one or more measurements based on the reference signals of the donor node or the one or more neighboring IAB nodes; and transmit measurement report to the IAB donor node, the measurement report to include an indication of results of the one or more measurements.Type: GrantFiled: August 8, 2019Date of Patent: May 7, 2024Assignee: Apple Inc.Inventors: Lili Wei, Qian Li, Dawei Ying, Geng Wu
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Publication number: 20240137288Abstract: A data-centric network and non-Real-Time (RT) RAN Intelligence Controller (RIC) architecture are described. The data-centric network architecture provides data plane functions (DPFs) that serve as a shared database for control functions, user functions and management functions for data plane resources in a network. The DPFs interact with control plane functions, user plane functions, management plane functions, compute plane functions, network exposure functions, and application functions of the NR network via a service interface. The non-RT RIC provides functions via rApps, manages the rApps, performs conflict mitigation and security functions, monitors machine learning (ML) performance, provides a ML model catalog that contains ML model information, provides interface terminations and stores ML data and Near-RT RIC related information in a database. An ML training host trains and evaluates ML models in the catalog, obtains training and testing data from the database, and retrains and updates the ML models.Type: ApplicationFiled: December 28, 2023Publication date: April 25, 2024Inventors: Geng Wu, Leifeng Ruan, Qian Li, Dawei Ying
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Patent number: 11963040Abstract: Some embodiments of this disclosure include apparatuses and methods for supporting integrated access and backhaul (IAB) networks. IAB nodes may be configured to broadcast in-raster and off-raster synchronization signal blocks (SSBs) for establishing communications with mobile devices and/or user equipment (UE). The SSBs may provide control resource set (CORESET) data used for establishing a communication channel between a UE and an IAB node. The CORESET data may be configured to support the broadcast of off-raster SSBs in wireless communication systems. In some embodiments, the in-raster SSB and the off-raster SSB may share the same CORESET. In this case, the IAB may modify a bit pattern of configuration table corresponding to the shared CORESET and broadcast the in-raster SSB and the off-raster SSB while including the modified bit pattern.Type: GrantFiled: January 10, 2020Date of Patent: April 16, 2024Assignee: Apple Inc.Inventors: Lili Wei, Dawei Ying, Qian Li, Daewon Lee, Geng Wu
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Patent number: 11610367Abstract: A three-dimensional model processing method, an electronic device, and a storage medium are provided, which are related to fields of deep learning, augmented reality, and the like. The specific implementation includes: generating a target virtual three-dimensional model based on a target model template; generating a target picture based on graphic and textual information and a preset network; and determining a superposition processing result of the target virtual three-dimensional model based on the target virtual three-dimensional model and the target picture.Type: GrantFiled: October 20, 2021Date of Patent: March 21, 2023Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTDInventors: Qian Ying, Chen Zhao, Li Xu
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Publication number: 20220044476Abstract: A three-dimensional model processing method, an electronic device, and a storage medium are provided, which are related to fields of deep learning, augmented reality, and the like. The specific implementation includes: generating a target virtual three-dimensional model based on a target model template; generating a target picture based on graphic and textual information and a preset network; and determining a superposition processing result of the target virtual three-dimensional model based on the target virtual three-dimensional model and the target picture.Type: ApplicationFiled: October 20, 2021Publication date: February 10, 2022Inventors: Qian YING, Chen ZHAO, Li XU
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Patent number: 11160173Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.Type: GrantFiled: January 11, 2018Date of Patent: October 26, 2021Assignees: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (Chengdu) Ltd., TE Connectivity Services GmbHInventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Lin Ye, Yong Yan, Roberto Francisco-Yi Lu, Qinglong Zeng
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Patent number: 11141807Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.Type: GrantFiled: November 15, 2019Date of Patent: October 12, 2021Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Servies GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co, Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto-Francisco Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Patent number: 11064614Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.Type: GrantFiled: September 16, 2019Date of Patent: July 13, 2021Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Patent number: 11051408Abstract: A fixing device adapted to fix at least one needle-shaped member comprises a fixing base and a fixing mechanism. The fixing base has at least one positioning groove disposed at a front end of the fixing base. The needle-shaped member is adapted to be positioned in the positioning groove. The fixing mechanism has at least one pressing protrusion at a front end of the fixing mechanism. The pressing protrusion is adapted to press and hold the needle-shaped member in the positioning groove.Type: GrantFiled: January 11, 2018Date of Patent: June 29, 2021Assignees: Tyco Electronics (Shanghai) Co. Ltd. TE, Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
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Patent number: 11000912Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.Type: GrantFiled: August 6, 2019Date of Patent: May 11, 2021Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co. Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Patent number: 10957084Abstract: The present disclosure provides an image processing method. The method includes: detecting at least one first feature object of an image to be processed, to obtain a name and position of each first feature object in the image; according to the name and position of the first feature object, and a preset strategy for loading a dynamic effect, selecting, from the at least one first feature object, a feature object to which a dynamic effect is to be loaded, as a second feature object; and according to the preset strategy for loading a dynamic effect, rendering the second feature object with an Augmented Reality (AR) dynamic effect, and obtaining an image with the AR dynamic effect. The present disclosure further provides an image processing apparatus, a device and a computer readable storage medium.Type: GrantFiled: August 23, 2018Date of Patent: March 23, 2021Assignee: Baidu Online Network Technology (Beijing) Co., Ltd.Inventors: Zhongqin Wu, Yingchao Li, Chen Zhao, Nan Wei, Qian Ying
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Patent number: 10933460Abstract: A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.Type: GrantFiled: July 3, 2018Date of Patent: March 2, 2021Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd, Shenzhen AMI Technology Co., Ltd.Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
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Patent number: 10807178Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device has at least one first positioning groove adapted to position at least one first elongated member and fixes the at least one first elongated member. The second fixing device has at least one second positioning groove adapted to position at least one second elongated member and fixes the at least one second elongated member. Each first positioning groove is aligned with a corresponding second positioning groove so that the first elongated member fixed in the first positioning groove is axially aligned with the second elongated member fixed in the corresponding second positioning groove.Type: GrantFiled: January 11, 2018Date of Patent: October 20, 2020Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Lin Ye, Yong Yan, Roberto Francisco-Yi Lu, Qinglong Zeng
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Patent number: 10773341Abstract: A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.Type: GrantFiled: June 1, 2017Date of Patent: September 15, 2020Assignees: Tyco Electronics (Shanghai) Co., Ltd., Measurement Specialities (Chengdai) Ltd, TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
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Publication number: 20200094339Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.Type: ApplicationFiled: November 15, 2019Publication date: March 26, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto-Francisco Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Publication number: 20200091692Abstract: An assembly system includes a feeding mechanism configured to feed a heat shrinkable tube, a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube, a robot adapted to grip the segment of heat shrinkable tube, and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product.Type: ApplicationFiled: November 18, 2019Publication date: March 19, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Publication number: 20200009783Abstract: An assembly system includes a feeding mechanism adapted to feed a heat shrinkable tube, a cutting mechanism, a clamping mechanism, a robot, and a vision system. The cutting mechanism is adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism. The clamping mechanism is adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube with the cutting mechanism. The robot is adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube. The vision system is adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire of an electrical device.Type: ApplicationFiled: September 23, 2019Publication date: January 9, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd., Measurement Specialities (Chengdu) Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying
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Publication number: 20200015359Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.Type: ApplicationFiled: September 16, 2019Publication date: January 9, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Patent number: 10497276Abstract: The present disclosure discloses a display method and apparatus. A specific implementation of the method comprises: acquiring an experimental environment image; presenting, on the experimental instrument image using an augmented reality approach, a status image indicating an experimental status of an experimental instrument when performing the target experiment; in response to detecting a gesture operation of a user, determining experiment effect information of an experiment operation based on a corresponding relation between the gesture operation and the experiment operation of the target experiment, wherein the experiment effect information comprises an experiment effect image; and displaying, using the augmented reality approach, the experiment effect image in the experimental environment image having presented the status image. This implementation may superpose a virtual status image and an experiment effect image on a reality environment image, thereby enhancing the display fidelity.Type: GrantFiled: June 9, 2017Date of Patent: December 3, 2019Assignee: BAIDU ONLINE NETWORK TECHNOLOGY (BEIJING) CO., LTD.Inventors: Zhongqin Wu, Hui Qiao, Yingchao Li, Qian Ying, Chen Zhao