Abstract: Waveguide interconnects for semiconductor packages are disclosed. An example semiconductor package includes a first semiconductor die, a second semiconductor die, and a substrate positioned between the first and second dies. The substrate includes a waveguide interconnect to provide a communication channel to carry an electromagnetic signal. The waveguide interconnect is defined by a plurality of through substrate vias (TSVs). The TSVs in a pattern around the at least the portion of the substrate to define a boundary of the communication channel.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a die-level interposer having a first surface and an opposing second surface; a first die coupled to the first surface of the die-level interposer by a first hybrid bonding region having a first pitch; a second die coupled to the second surface of the die-level interposer by a second hybrid bonding region having a second pitch different from the first pitch; and a third die coupled to the second surface of the die-level interposer by a third hybrid bonding region having a third pitch different from the first and second pitches.

Abstract: An integrated circuit (IC) package may be fabricated having an interposer, one or more microfluidic channels through the interposer, a first IC chip attached to a first side of the interposer, and a second IC chip attached to a second side of the interposer, where the first side of the interposer includes first bond pads coupled to first bond pads of the first IC chip, and the second side of the interposer includes second bond pads coupled to first bond pads of the second IC chip. In an embodiment of the present description, a liquid cooled three-dimensional IC (3DIC) package may be formed with the IC package, where at least two IC devices may be stacked with a liquid cooled interposer. In a further embodiment, the liquid cooled 3DIC package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.

Abstract: Disclosed herein are field-effect transistors with asymmetric gate stacks. An example transistor includes a channel material and an asymmetric gate stack, provided over a portion of the channel material between source and drain (S/D) regions. The gate stack is asymmetric in that a thickness of a gate dielectric of a portion of the gate stack closer to one of the S/D regions is different from that of a portion of the gate stack closer to the other S/D region, and in that a work function (WF) material of a portion of the gate stack closer to one of the S/D regions is different from a WF material of a portion of the gate stack closer to the other S/D region. Transistors as described herein exploit asymmetry in the gate stacks to improve the transistor performance in terms of high breakdown voltage, high gain, and/or high output resistance.

Abstract: A system and method to translate source code in a source language executable in a source computing system to a target language executable in a target computing system. Source code in the source language is parsed to generate a corresponding parse tree containing at least one tree node and at least one leaf. During traversal of the parse tree, at least one mutation script is applied. The mutation script directs at least one of: generating a stream expression comprising at least one token corresponding to values of the at least one node and the at least one leaf of the parse tree; and formulating at least one text output containing a text pattern specified in the mutation script and/or values of the at least one token. Source code in the target language is outputted based on the at least one text output.

Abstract: A connector housing includes an accommodation space defined by four walls and formed with an insertion port. The four walls include a first wall extending in a first plane and a second wall extending in a second plane perpendicular to the first plane, the first wall is connected with the second wall at a corner of the connector housing. A first positioning groove is disposed in an edge of the first wall proximate to the insertion port and a first positioning tooth is disposed on an edge of the second wall. The first positioning tooth extends in the first plane by vertically bending and engaging within the first positioning groove. The first positioning tooth and the first positioning groove have a first locking feature preventing the first positioning tooth from being disengaged from the first positioning groove in a direction perpendicular to the second plane.

Abstract: The present disclosure relates to a C-arm. The C-arm may include a connection component, a driving component, a first support component, and a second support component. The first support component may be configured to support a radiation generator. The second support component may be configured to support a radiation detector. The first support component and the second support may be movably connected to the connection component. The driving component may be configured to drive a movement of the first support component relative to the connection component.

Abstract: The present disclosure provides a gantry for an X-ray system. The gantry may include a base section, a lifting section, and a swing section. The base section may be configured to move. A first end of the lifting section may be connected to the base section. A first end of the swing section may be rotatably connected to a second end of the lifting section. A radiation assembly may be disposed on a second end of the swing section.

Abstract: This invention provides gypsum wallboards with a unique microstructure where the walls between voids are enhanced in thickness and strength to substantially improve the strength and handling properties of the wallboards. A method of making lightweight gypsum wallboards is also provided.

Abstract: A self-locking plug includes a main body, a plug bush seat arranged in the main body for positioning a plug bush, at least one locking tab, and a linkage. The self-locking plug further includes a key mechanism arranged in the main body. The key mechanism includes a pressing portion and a driving portion which are respectively arranged at two ends of the key mechanism. The driving portion is associated with one end of the linkage, and is configured to drive the linkage to reciprocate in an axial direction of the main body to switch the locking tab between a releasing state and a locking state.

Abstract: This invention provides gypsum wallboards with a unique microstructure where the walls between voids are enhanced in thickness and strength to substantially improve the strength and handling properties of the wallboards. A method of making lightweight gypsum wallboards is also provided.

Abstract: This invention provides low dust low density gypsum wallboard products having high total core void volumes, corresponding to low densities in the range of about 10 to 30 pcf. The wallboards have a set gypsum core formed between two substantially parallel cover sheets, the set gypsum core preferably having a total void volume from about 80% to about 92%, and made from a slurry including stucco, pregelatinized starch, and a naphthalenesulfonate dispersant. The combination of the pregelatinized starch and the naphthalenesulfonate dispersant also provides a glue-like effect in binding the set gypsum crystals together. The wallboard formulation, along with small air bubble voids (and water voids) provides dust control during cutting, sawing, routing, snapping, nailing or screwing down, or drilling of the gypsum-containing products.

Abstract: A solid-liquid separation device includes a kettle body, a piston, a stirrer, a separation plate having filtration pores, and a filtration mesh. The kettle body is hollow along an axial direction to form a chamber body. The separation plate is fitly installed in the chamber body, and divides the chamber body into a washing chamber and a draining chamber. The piston and the stirrer are fitly disposed in the washing chamber. The filtration mesh is attached on a side of the separation plate to cover the filtration pores. The kettle body is further provided with a feed inlet, a water inlet, a material outlet, and a liquid outlet. The feed inlet and material outlet are communicated with the washing chamber, and the water inlet and the liquid outlet are communicated with the draining chamber. The method includes the following steps: feeding, solid-liquid separation, washing, and material discharge.

Abstract: The disclosure belongs to the field of integrated circuits, and is used for reducing an area overhead and a power consumption of a pipelined analog-to-digital converter. Each stage of the pipelined analog-to-digital converter according to the disclosure comprises an analogue-to-digital converter, a digital-to-analog converter, a subtractor and an amplifier. According to the disclosure, an amplification time of the pipelined ADC is used for extra quantization, and a number of bits of each ADC is reduced on the premise of not increasing a number of stages of the pipelined ADC, so that a scale of each circuit is greatly reduced, and the power consumption and the area overhead are reduced.

Abstract: The disclosure belongs to the field of integrated circuits, and is used for reducing an area overhead and a power consumption of a pipelined analog-to-digital converter. Each stage of the pipelined analog-to-digital converter according to the disclosure comprises an analogue-to-digital converter, a digital-to-analog converter, a subtractor and an amplifier. According to the disclosure, an amplification time of the pipelined ADC is used for extra quantization, and a number of bits of each ADC is reduced on the premise of not increasing a number of stages of the pipelined ADC, so that a scale of each circuit is greatly reduced, and the power consumption and the area overhead are reduced.