Abstract: A metal product includes a metal substrate, at least one first hole, at least one second hole, and at least one third hole. The first hole is formed in a surface of the metal substrate. The second hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and an inner surface defining the first hole. The third hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and without the second hole, a portion of the inner surface defining the first hole without the second hole, and an inner surface defining the second hole. The first, second, and third holes enhance a bonding strength between the metal product and a material product. The disclosure also provides a metal composite and a method for manufacturing the metal product.

Abstract: One aspect of the invention relates to a composite member for a resonator having an active piezoelectric element and a passive piezoelectric element. The active piezoelectric element causes the resonator to vibrate and detects the frequency of the vibration. The passive piezoelectric element changes the frequency of the vibration. Another aspect of the invention relates to a method for controlling a resonator with composite member having a substrate carrying a composite piezoelectric element. The composite piezoelectric element includes an actuator element, a sensor element and a passive element. The method comprises inducing a resonance within the composite member with the actuator element, detecting the resonance with the sensor element, and altering the resonance by altering the electromechanical coupling of the passive element. Additional aspects and benefits of the invention are also given.

Abstract: The invention provides a method for making piezoelectric printheads for ink jet The method includes applying an insulating layer to a first surface of a silicon wafer having a thickness ranging from about 200 to about 800 microns. A first conducting layer is applied to the insulating layer on the first surface and a piezoelectric layer is applied to the first conducting layer. The piezoelectric layer is patterned to provide piezoelectric elements on the first surface of the silicon wafer. A second conducting layer is applied to the piezoelectric layer and is patterned to provide conductors for applying an electric field across each of the piezoelectric elements. A photoresist layer is applied to a second surface of the silicon wafer, and the photoresist layer is imaged and developed to provide pressurizing chamber locations. The silicon wafer is then dry etched through the thickness of the wafer up to the insulating layer on the first surface of the wafer.

Abstract: The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device.

Abstract: One aspect of the invention relates to a composite member for a resonator having an active piezoelectric element and a passive piezoelectric element. The active piezoelectric element causes the resonator to vibrate and detects the frequency of the vibration. The passive piezoelectric element changes the frequency of the vibration. Another aspect of the invention relates to a method for controlling a resonator with composite member having a substrate carrying a composite piezoelectric element. The composite piezoelectric element includes an actuator element, a sensor element and a passive element. The method comprises inducing a resonance within the composite member with the actuator element, detecting the resonance with the sensor element, and altering the resonance by altering the electromechanical coupling of the passive element. Additional aspects and benefits of the invention are also given.

Abstract: The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device.

Abstract: The invention provides a method for making piezoelectric printheads for ink jet The method includes applying an insulating layer to a first surface of a silicon wafer having a thickness ranging from about 200 to about 800 microns. A first conducting layer is applied to the insulating layer on the first surface and a piezoelectric layer is applied to the first conducting layer. The piezoelectric layer is patterned to provide piezoelectric elements on the first surface of the silicon wafer. A second conducting layer is applied to the piezoelectric layer and is patterned to provide conductors for applying an electric field across each of the piezoelectric elements. A photoresist layer is applied to a second surface of the silicon wafer, and the photoresist layer is imaged and developed to provide pressurizing chamber locations. The silicon wafer is then dry etched through the thickness of the wafer up to the insulating layer on the first surface of the wafer.

Abstract: The present invention is a new type of high-strain, pseudo-shear mode piezoelectric ceramic actuator. The pseudo-shear mode actuator employs a stack of pre-poled rectangular ceramic sheets. The stacked sheets form a composite structure assembled from thin sheet soft PZT or PLZT which is poled in the usual direction normal to the major face of the sheet and driven by electrodes upon the major faces. The sheets are conductivity bonded at alternate ends and driven in such a way that alternate sheets expand and contract along the length dimension. Examples of uses would include actuators for linear and rotary motors; step and repeat (inchworm) type actuators; flow sensing and flow control; valving and pumping systems; active noise and vibration control; and large thin panel loudspeakers.