Abstract: An enhanced Flash chip of SPI interface and a method for packaging chip, to solve the problems of high design complexity, long design period and high design cost. The chip comprises SPI FLASH and RPMC which are packaged integrally; the SPI FLASH and the RPMC comprise an independent controller, respectively; the same IO pins in SPI FLASH and RPMC are mutually connected and are connected to the same external sharing pin of the chip. The SPI FLASH and the RPMC further comprise an internal IO pin, respectively, in which the internal IO pin of SPI FLASH is connected with the internal IO pin of RPMC, and the internal mutual communication between the SPI FLASH and the RPMC is achieved through the mutually connected internal IO pins. Thus, it is possible to reduce the package size, decrease the cost of design, shorten design period and improve chip performance.

Abstract: An enhanced Flash chip and a method for packaging chip are provided to solve the problems of high design complexity. The enhanced Flash chip comprises: a FLASH and a RPMC packaged integrally, wherein the same IO pins in the FLASH and in the RPMC are mutually connected and are connected to the same external sharing pin of the chip; an external instruction is transmitted to the FLASH and the RPMC through the external sharing pin of the chip, and the controller of the FLASH and the controller of the RPMC respectively judge whether to execute the external instruction; and the FLASH and the RPMC further comprise internal IO pins, respectively, the internal IO pins of the FLASH and the internal IO pins of the RPMC are mutually connected, and internal mutual communication between the FLASH and the RPMC is performed through the pair of mutually connected internal IO pins.

Abstract: An enhanced Flash chip and a method for packaging chip, wherein the enhanced Flash chip comprising: a FLASH and a RPMC, packaged integrally; the FLASH and the RPMC each comprising: a first internal IO pin and a second internal IO pin; the FLASH and the RPMC being further provided with a jumper window, one end of which is mutually connected to the first internal IO pin of the FLASH or the RPMC and the other end of which is mutually connected to the first internal IO pin of the RPMC or the FLASH; the second internal IO pin of the FLASH and the second internal IO pin of the RPMC being mutually connected. The enhanced Flash chip provided in the present application may effectively reduce design complexity and chip manufacturing cost, avoid the crossing of the metal lead wires in the chip package, and increase the yield of chip packages.

Abstract: An enhanced Flash chip and a method for packaging chip are provided to solve the problems of high design complexity. The enhanced Flash chip comprises: a FLASH and a RPMC packaged integrally, wherein the same IO pins in the FLASH and in the RPMC are mutually connected and are connected to the same external sharing pin of the chip; an external instruction is transmitted to the FLASH and the RPMC through the external sharing pin of the chip, and the controller of the FLASH and the controller of the RPMC respectively judge whether to execute the external instruction; and the FLASH and the RPMC further comprise internal IO pins, respectively, the internal IO pins of the FLASH and the internal IO pins of the RPMC are mutually connected, and internal mutual communication between the FLASH and the RPMC is performed through the pair of mutually connected internal IO pins.

Abstract: An enhanced Flash chip and a method for packaging chip, wherein the enhanced Flash chip comprising: a FLASH and a RPMC, packaged integrally; the FLASH and the RPMC each comprising: a first internal IO pin and a second internal IO pin; the FLASH and the RPMC being further provided with a jumper window, one end of which is mutually connected to the first internal IO pin of the FLASH or the RPMC and the other end of which is mutually connected to the first internal IO pin of the RPMC or the FLASH; the second internal IO pin of the FLASH and the second internal IO pin of the RPMC being mutually connected. The enhanced Flash chip provided in the present application may effectively reduce design complexity and chip manufacturing cost, avoid the crossing of the metal lead wires in the chip package, and increase the yield of chip packages.

Abstract: Disclosed are an enhanced Flash chip of SPI interface and a method for packaging chip, to solve the problems of high design complexity, long design period and high design cost. The chip comprises SPI FLASH and RPMC which are packaged integrally; the SPI FLASH and the RPMC comprise an independent controller, respectively; the same IO pins in SPI FLASH and RPMC are mutually connected and are connected to the same external sharing pin of the chip. The SPI FLASH and the RPMC further comprise an internal IO pin, respectively, in which the internal IO pin of SPI FLASH is connected with the internal IO pin of RPMC, and the internal mutual communication between the SPI FLASH and the RPMC is achieved through the mutually connected internal IO pins. Thus, it is possible to reduce the package size, decrease the cost of design, shorten design period and improve performance of the chip.

Abstract: Memory methods and apparatuses providing for refresh and bandwidth enhancements for a dual-port memory array (e.g. a DRAM memory array) with balanced read and write timing specifications are disclosed. A port allocation for dual-port memory cell is adopted such that one port is assigned and shared for both read and refresh and the other port is assigned for write only. Double bandwidth is achieved by overlapping simultaneous read or refresh and write port access during the same cycle. No external refresh command is required and external accesses (reads and writes) are not interrupted or delayed under any circumstance. A high-speed SRAM compatible device can be fabricated from a dual-port DRAM or 3-Transistor cells or 2-Transistors and 1 capacitor cells. The preferred embodiments include a multi-bank dual-port memory array and a look-up-table logic which records the accessed word address and generates hit logic and idle cycles when a refresh stall is asserted by a refresh-jammed bank.

Abstract: An adaptive block-matching motion estimator for used in a video coding system wherein the adaptive block-matching motion estimator is less in hardware complexity and latency time and is therefore more cost-effective to implement and higher in performance.

Abstract: A process for obtaining a motion vector for motion estimation used in a video image analysis, utilizing a block matching algorithm, which has the effect of reducing the computational load that is placed on the hardware logic used for implementation of the process. In a process of obtaining the absolute error value for the compared image block, a preliminary comparison is performed for every processed pixel in the image block to determine if the set minimum value of the absolute error function represented by a motionless tolerance constant is achieved. It is not necessary to obtain every actual value of the absolute error function. The block matching scheme of providing motion estimation enables hardware implementing the process to discontinue processing if the desired motion vector is selected prior to all image blocks being compared.

Abstract: An apparatus for implementing motion estimation block matching for video image processing. The apparatus receives pixel data of original and compared image blocks for comparison, to obtain an image motion vector. The apparatus has a multi-stage pipelined tree-architecture that includes a computation stage, a summation section, an accumulation stage, and a minimum value evaluation stage. The computation stage includes 2.sup.n computation members for producing a difference error value and a sign bit of the compared image blocks. The summation section coupled at the pipelined stage next to the computation stage, includes a series of summation stages for producing an absolute error value of the compared image blocks. A following accumulation stage adds an output of the single adder means of the last summation stage and a last un-added sign bit, for producing a sum.