Abstract: An audio capturing device comprises: a housing and a silicon-based microphone device arranged within the housing. The silicon-based microphone device comprises a circuit board and an even number of silicon-based microphone chips provided at one side of the circuit board. The circuit board is provided with at least one sound inlet. The at least one sound inlet is in communication in a one-to-one correspondence to rear cavities of some of the silicon-based microphone chips of the even number of silicon-based microphone chips. Sound channels in communication in a one-to-one correspondence to sound inlets are provided in the housing. The corresponding rear cavities, sound inlets, and sound channels form first acoustic cavities. The rear cavities form second acoustic cavities. The first acoustic cavities are different from the second acoustic cavities in terms of volume and/or shape.

Abstract: A sound collection device comprises a housing and a silicon-based microphone device located in the housing. The silicon-based microphone device comprises a circuit board and an even number of silicon-based microphone chips provided on one side of the circuit board; the circuit board is provided with an even number of sound inlet holes, and the even number of sound inlet holes have one-to-one correspondence to back cavities of the even number of silicon-based microphone chips; the housing is provided with sound channels in communication with the sound inlet holes in one-to-one correspondence; the correspondingly communicated back cavities and the sound inlet holes form acoustic cavities; or, the correspondingly communicated back cavities, sound inlet holes, and sound channels form acoustic cavities; and at least two acoustic cavities have different volumes and/or shapes.