Abstract: The present invention relates to a process of a package-then-etch three-dimensional package structure electrically connected by plated copper pillars. The process comprises the following steps: taking a metal carrier; preplating a surface of the metal carrier with a copper layer; forming an outer metal pin by means of electroplating; performing plastic packaging with epoxy resin; forming a metal circuit layer by means of electroplating; forming a conductive metal pillar by means of electroplating; surface-mounting a chip; performing plastic packaging; surface-mounting a passive device; performing plastic packaging; etching and windowing the carrier; forming an anti-oxidant metal layer by means of electroplating; and performing cutting to obtain a finished product. The integration level and the reliability can be improved.

Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes a lower package and an upper package; wherein the lower package includes a prefabricated interconnected silicon core stack structure which includes a silicon interconnection layer, and the silicon interconnection layer includes a first surface and a second surface; a back-end redistribution stack layer and a first prefabricated redistribution stack layer are stacked on the first surface and in electrical connection; a passivation layer is disposed on the second surface; the silicon interconnection layer includes a silicon substrate and several first prefabricated conductive pillars, each first prefabricated conductive pillar includes a first end and a second end, the first end is exposed from the first surface, and the second end is exposed from a side of the passivation layer; and the upper package is disposed above the first prefabricated redistribution stack layer.

Abstract: The present invention relates to a process of a package-then-etch three-dimensional package structure electrically connected by plated copper pillars. The process comprises the following steps: taking a metal carrier; preplating a surface of the metal carrier with a copper layer; forming an outer metal pin by means of electroplating; performing plastic packaging with epoxy resin; forming a metal circuit layer by means of electroplating; forming a conductive metal pillar by means of electroplating; surface-mounting a chip; performing plastic packaging; surface-mounting a passive device; performing plastic packaging; etching and windowing the carrier; forming an anti-oxidant metal layer by means of electroplating; and performing cutting to obtain a finished product. The integration level and the reliability can be improved.

Abstract: The present invention relates to a package-before-etch three-dimensional package structure electrically connected by plated copper pillars and a process thereof. The process comprises the following steps: taking a metal carrier; preplating a surface of the metal carrier with a copper layer; forming an outer metal pin by means of electroplating; performing plastic packaging with epoxy resin; forming a metal circuit layer by means of electroplating; forming a conductive metal pillar by means of electroplating; surface-mounting a chip; performing plastic packaging; surface-mounting a passive device; performing plastic packaging; etching and windowing the carrier; forming an anti-oxidant metal layer by means of electroplating; and performing cutting to obtain a finished product. The integration level and the reliability can be improved.

Abstract: The present invention relates to a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal, comprising: taking a metal sheet; punching or etching the metal sheet; packaging a conductive metal-pillar frame; performing windowing and slotting; taking a substrate on which a chip is surface-mounted; fitting the conductive metal-pillar frame; performing packaging and grinding; surface-mounting a passive device; performing plastic packaging and ball-mounting; and performing cutting. The process of the present invention can improve the integration level and the reliability.

Abstract: The present invention relates to a package-before-etch three-dimensional package structure electrically connected by plated copper pillars and a process thereof. The process comprises the following steps: taking a metal carrier; preplating a surface of the metal carrier with a copper layer; forming an outer metal pin by means of electroplating; performing plastic packaging with epoxy resin; forming a metal circuit layer by means of electroplating; forming a conductive metal pillar by means of electroplating; surface-mounting a chip; performing plastic packaging; surface-mounting a passive device; performing plastic packaging; etching and windowing the carrier; forming an anti-oxidant metal layer by means of electroplating; and performing cutting to obtain a finished product. The integration level and the reliability can be improved.

Abstract: The present invention relates to a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal, comprising: taking a metal sheet; punching or etching the metal sheet; packaging a conductive metal-pillar frame; performing windowing and slotting; taking a substrate on which a chip is surface-mounted; fitting the conductive metal-pillar frame; performing packaging and grinding; surface-mounting a passive device; performing plastic packaging and ball-mounting; and performing cutting. The process of the present invention can improve the integration level and the reliability.