Abstract: A cylindrical battery includes a housing having an accommodating space; and a negative electrode sheet, a first separator, a positive electrode sheet, and a second separator that are wound multiple turns forming an electrode core. The housing is co-axial with the electrode core that is disposed in the accommodating space. The positive electrode sheet includes a positive electrode material layer and a positive electrode foil layer. The negative electrode sheet includes a negative electrode material layer and a negative electrode foil layer. Some of the wound turns of the positive electrode foil layer extends toward an end of the housing to form a positive electrode tab. Some of the wound turns of the negative electrode foil layer extends toward another end of the housing to form the negative electrode tab.

Abstract: A compact exit sign includes a main body having an open frontal portion, an annular side wall portion and a rear panel portion including a central opening extending across greater than half of the rear panel, and a front plate including a face portion provided with exit indicia. The exit sign can be selectively converted between single and double face exit signs by snap-connecting a first, solid and non-transparent insert to the main body across the central opening of the rear panel to establish a single face exit sign and snap-connecting a second, exit indicia containing insert to the main body across the central opening of the rear panel to establish a double face exit sign. A lighting system is housed within the main body for illuminating the exit indicia for either of the single or double face configurations.

Abstract: A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.

Abstract: A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.