Patents by Inventor QIUXIA LIN
QIUXIA LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12002908Abstract: A light-emitting packaging device includes a substrate, a light-emitting diode (LED) chip, an optical element, and a covering member. The LED chip is disposed on the substrate. The optical element is spacedly disposed on the LED chip opposite to the substrate, and has an upper surface and a lower surface that are respectively distal from and proximal to the LED chip. The covering member is made from a fluorine-containing resin, and is configured to cover the LED chip and at least a portion of the upper surface of the optical element.Type: GrantFiled: May 13, 2021Date of Patent: June 4, 2024Assignee: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.Inventors: Junpeng Shi, Qiuxia Lin, Weng-Tack Wong, Changchin Yu
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Publication number: 20230207754Abstract: A light-emitting diode (LED) device includes a substrate, an LED chip, a light-transmissive element, and a bonding layer. The substrate has a first surface and a second surface opposite to the first surface in a thickness direction. The first surface has a functional region. The LED chip is disposed on the functional region of the first surface of the substrate. The light-transmissive element is disposed on the first surface of the substrate, and covers the LED chip. The bonding layer connects the substrate with the light-transmissive element, and is disposed on the substrate outside the functional region. The LED device has a surrounding surface. Cross sections of the surrounding surface in the thickness direction are straight lines that extend in the thickness direction.Type: ApplicationFiled: February 13, 2023Publication date: June 29, 2023Inventors: Qiuxia LIN, Dacheng LI, Senpeng HUANG, Changchin YU, Chen-ke HSU
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Publication number: 20230207766Abstract: A light emitting device includes a package substrate, a patterned conductive layer, an LED chip, and an encapsulation layer. The patterned conductive layer is located on top of the package substrate, and has an isolation region that separates the patterned conductive layer into a first region and a second region. The LED chip is located on top of the patterned conductive layer. The encapsulation layer covers the LED chip and the patterned conductive layer. The encapsulation layer forms an optical structure that corresponds to the LED chip in position and that has a lateral curved surface covering a side wall of the LED chip. When light emitted from the LED chip radiates through the optical structure, the light emitting device has a viewing angle exceeding 120°.Type: ApplicationFiled: February 22, 2023Publication date: June 29, 2023Applicant: Quanzhou Sanan Semiconductor Technology Co., Ltd.Inventors: Qiuxia LIN, Senpeng HUANG, Jian LIU, Changchin Yu, Chen-ke HSU
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Patent number: 11626547Abstract: A UV LED device includes a base, a lens disposed on the base, an adhesive unit, an LED chip unit, and an encapsulating member. The adhesive unit has multiple layers and is connected between the base and the lens such that the base, the lens and the adhesive unit cooperatively define an enclosed space. The LED chip unit is disposed in the enclosed space. The encapsulating member is disposed in the enclosed space, and encapsulates the LED chip unit. The encapsulating member is made of a material the same as a material of at least one layer of the adhesive unit.Type: GrantFiled: December 3, 2020Date of Patent: April 11, 2023Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY, CO., LTD.Inventors: Junpeng Shi, Weng-Tack Wong, Qiuxia Lin, Xinglong Li
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Publication number: 20210305471Abstract: A light-emitting packaging device includes a substrate, a light-emitting diode (LED) chip, an optical element, and a covering member. The LED chip is disposed on the substrate. The optical element is spacedly disposed on the LED chip opposite to the substrate, and has an upper surface and a lower surface that are respectively distal from and proximal to the LED chip. The covering member is made from a fluorine-containing resin, and is configured to cover the LED chip and at least a portion of the upper surface of the optical element.Type: ApplicationFiled: May 13, 2021Publication date: September 30, 2021Applicant: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.Inventors: Junpeng SHI, Qiuxia LIN, Weng-Tack WONG, Changchin YU
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Publication number: 20210217936Abstract: A UV LED device includes a base, a lens disposed on the base, an adhesive unit, an LED chip unit, and an encapsulating member. The adhesive unit has multiple layers and is connected between the base and the lens such that the base, the lens and the adhesive unit cooperatively define an enclosed space. The LED chip unit is disposed in the enclosed space. The encapsulating member is disposed in the enclosed space, and encapsulates the LED chip unit. The encapsulating member is made of a material the same as a material of at least one layer of the adhesive unit.Type: ApplicationFiled: May 6, 2020Publication date: July 15, 2021Inventors: Junpeng SHI, Weng-Tack WONG, Qiuxia LIN, Xinglong LI
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Publication number: 20210091277Abstract: A UV LED device includes a base, a lens disposed on the base, an adhesive unit, an LED chip unit, and an encapsulating member. The adhesive unit has multiple layers and is connected between the base and the lens such that the base, the lens and the adhesive unit cooperatively define an enclosed space The LED chip unit is disposed in the enclosed space. The encapsulating member is disposed in the enclosed space, and encapsulates the LED chip unit. The encapsulating member is made of a material the same as a material of at least one layer of the adhesive unit.Type: ApplicationFiled: December 3, 2020Publication date: March 25, 2021Inventors: Junpeng SHI, Weng-Tack WONG, Qiuxia LIN, Xinglong LI
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Patent number: 10658550Abstract: A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.Type: GrantFiled: November 10, 2018Date of Patent: May 19, 2020Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.Inventors: Junpeng Shi, Qiuxia Lin, Zhenduan Lin, Chen-Ke Hsu, Chih-Wei Chao
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Publication number: 20190081216Abstract: A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.Type: ApplicationFiled: November 10, 2018Publication date: March 14, 2019Applicant: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.Inventors: Junpeng SHI, Qiuxia LIN, Zhenduan LIN, Chen-Ke HSU, Chih-Wei CHAO
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Patent number: 9966514Abstract: A light emitting diode package structure allows for an improved light-emitting efficiency by including a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; and a second reflecting material layer surrounding the first transparent material layer. An interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip. A wavelength conversion material layer is over the first reflecting material layer, the flip chip, and the second reflecting material layer.Type: GrantFiled: June 24, 2016Date of Patent: May 8, 2018Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Chen-Ke Hsu, Junpeng Shi, Pei-Song Cai, Zhenduan Lin, Hao Huang, Chenjie Liao, Chih-Wei Chao, Qiuxia Lin
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Publication number: 20170005245Abstract: A light emitting diode package structure includes: a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; a second reflecting material layer surrounding the first transparent material layer, the interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip; and a wavelength conversion material layer covered over the above structure.Type: ApplicationFiled: June 24, 2016Publication date: January 5, 2017Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: CHEN-KE HSU, JUNPENG SHI, PEI-SONG CAI, ZHENDUAN LIN, HAO HUANG, CHENJIE LIAO, CHIH-WEI CHAO, QIUXIA LIN
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Patent number: D1009814Type: GrantFiled: September 18, 2020Date of Patent: January 2, 2024Assignee: XIAMEN SAN'AN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Senpeng Huang, Qiuxia Lin, Jian Liu
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Patent number: D1022930Type: GrantFiled: September 18, 2020Date of Patent: April 16, 2024Assignee: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD.Inventors: Senpeng Huang, Qiuxia Lin, Jian Liu