Patents by Inventor Qizhao Hu

Qizhao Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insulated gate bipolar transistor module and manufacturing method thereof
    Patent number: 11107744
    Abstract: An IGBT module includes a heat dissipation base plate. A first ceramic heat dissipation element is embedded in the heat dissipation base plate. A first wiring layer is provided on the surface of the heat dissipation base plate. The first side of an IGBT chip is mounted onto the first wiring layer. The second side of the IGBT chip is provided with a heat conductive metal plate. A first heat dissipation plate having a first through hole is provided on a side of the first wiring layer. The IGBT chip and the heat conductive metal plate are located in the first through hole. A second wiring layer is provided on a side of the first heat dissipation plate away from the IGBT chip. The second wiring layer is provided on a side of the heat conductive metal plate.
    Type: Grant
    Filed: January 22, 2017
    Date of Patent: August 31, 2021
    Assignee: RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
    Inventors: Shan Zhong, Weidong Gao, Qizhao Hu, Wai Kin Raymond Lam
  • Insulated Gate Bipolar Transistor Module and Manufacturing Method Thereof
    Publication number: 20190355644
    Abstract: An IGBT module includes a heat dissipation base plate. A first ceramic heat dissipation element is embedded in the heat dissipation base plate. A first wiring layer is provided on the surface of the heat dissipation base plate. The first side of an IGBT chip is mounted onto the first wiring layer. The second side of the IGBT chip is provided with a heat conductive metal plate. A first heat dissipation plate having a first through hole is provided on a side of the first wiring layer. The IGBT chip and the heat conductive metal plate are located in the first through hole. A second wiring layer is provided on a side of the first heat dissipation plate away from the IGBT chip. The second wiring layer is provided on a side of the heat conductive metal plate.
    Type: Application
    Filed: January 22, 2017
    Publication date: November 21, 2019
    Applicant: RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
    Inventors: Shan ZHONG, Weidong GAO, Qizhao HU, Wai Kin Raymond LAM
  • Retractable sunshade
    Patent number: D852098
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 25, 2019
    Inventor: Qizhao Hu