Abstract: A bulk bag includes a bulk bag body that is configured to have a varying circumference with a reduced circumference between the top and bottom of the bulk bag body to reduce bulging when the bulk bag body is filled with content.

Abstract: A bulk bag includes a bulk bag body that is configured to have a varying circumference with a reduced circumference between the top and bottom of the bulk bag body to reduce bulging when the bulk bag body is filled with content.

Abstract: A bulk bag and method of making the bulk bag uses lift hoops that are securely linked to eyelets of lift straps that are attached to a bulk bag body so that the bulk bag can be lifted by the lift hoops. The bulk bag body includes a top portion, a bottom portion and a side portion. The lift straps may be attached to the bulk bag body such that at least portions of the lift straps extend along the side portion of the bulk bag body at an angle from the top portion of the bulk bag body to the bottom portion of the bulk bag body.

Abstract: A bare liner bulk bag and method of making the bare liner bulk bag uses a liner that is supported by a lifting system. The liner is configured to have an interior space to hold material. The lifting system includes at least one vertical strap, at least one horizontal strap and at least one bottom strap, which are connected to each other to define a volume into which the liner can be positioned without a woven fabric shell.

Abstract: A bulk bag and method of making the bulk bag uses stevedores and lift straps that attached to a bulk bag body so that the bulk bag has multiple lifting mechanisms.

Abstract: A cavity-down ball grid includes a flexible circuit tape including a flexible tape laminated to a conductor layer. The flexible circuit tape has an aperture therein. A thermally conductive heat spreader is fixed to a first surface of the flexible circuit tape and the heat spreader has a cavity aligned with the aperture of the flexible circuit tape. A semiconductor die is mounted to the heat spreader in a die-down configuration in the cavity. A thermally conductive die adapter is fixed to the semiconductor die such that a portion of the die adapter protrudes from the cavity. A plurality of wire bonds connect the semiconductor die to bond sites on the second surface of the flexible circuit tape. An encapsulating material encapsulates the semiconductor die and the wire bonds and a plurality of solder balls are disposed on a second surface of the flexible circuit tape, in the form of a ball grid array.

Abstract: A cavity-down ball grid includes a flexible circuit tape including a flexible tape laminated to a conductor layer. The flexible circuit tape has an aperture therein. A thermally conductive heat spreader is fixed to a first surface of the flexible circuit tape and the heat spreader has a cavity aligned with the aperture of the flexible circuit tape. A semiconductor die is mounted to the heat spreader in a die-down configuration in the cavity. A thermally conductive die adapter is fixed to the semiconductor die such that a portion of the die adapter protrudes from the cavity. A plurality of wire bonds connect the semiconductor die to bond sites on the second surface of the flexible circuit tape. An encapsulating material encapsulates the semiconductor die and the wire bonds and a plurality of solder balls are disposed on a second surface of the flexible circuit tape, in the form of a ball grid array.

Abstract: Stucco tower and method for applying ceramic particulates to a ceramic slurry coated pattern involves positioning the ceramic slurry coated pattern in a chamber, discharging ceramic particulates downwardly onto the ceramic slurry coated pattern, and circulating air through air circulation plenums from a lower region of the chamber to an upper region thereof as the ceramic particulates are discharged. An air curtain is provided at an access opening to the chamber.

Abstract: Stucco tower and method for applying ceramic particulates to a ceramic slurry coated pattern involves positioning the ceramic slurry coated pattern in a chamber, discharging ceramic particulates downwardly onto the ceramic slurry coated pattern, and circulating air through air circulation plenums from a lower region of the chamber to an upper region thereof as the ceramic particulates are discharged. An air curtain is provided at an access opening to the chamber.