Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Abstract: Provided in the present application are a data processing method and apparatus based on data coding, and a device. The method comprises: performing N-channel error correction coding on data to be processed that is in information to be processed, so as to obtain N pieces of coded data to be processed; by using coded meta-channel data obtained by means of error correction coding, performing redundancy processing on the coded data to be processed, so as to obtain N pieces of response data; and then performing error correction decoding on the N pieces of response data, so as to obtain processing result information of the information to be processed.

Abstract: Disclosed is a display panel including: first spacer on the array substrate, an orthographic projection of the first spacer on the array substrate being a first pattern extending along a first direction; a second spacer on the counter substrate, an orthographic projection of the second spacer on the array substrate being a second pattern extending along a second direction; at least two third spacers, orthographic projections of which on the array substrate being respectively on two sides of the first pattern along the first direction; at least two fourth spacers, orthographic projections of which on the array substrate being respectively on two sides of the second pattern along the second direction; one of the third spacer and the fourth spacer is on the array substrate, and the other is on the counter substrate.

Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Abstract: An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath. The plating cup includes a contact ring. The contact ring includes contacts. The contacts are immersed in the plating bath. The controller is configured to apply a voltage signal across the contact ring and the electrode to remove residual from the contacts. The voltage signal includes a plating-de-plating waveform. The plating-de-plating waveform includes multiple cycles. Each of the cycles includes a pair of pulses with different polarity.

Abstract: A cloud server including a communication interface; and at least one processor configured to: detect a plurality of IoT devices connected to the cloud server from the communication interface, based on detecting the plurality of IoT devices connected to the cloud server, determine that the plurality of IoT devices are equipped with a corresponding plurality of intelligence engines, read and store a plurality of intelligence engine types of the plurality of intelligence engines, obtain a plurality of online states of the plurality of IoT devices, receive a search instruction sent from a receiving IoT device of the plurality of IoT devices, identify an instruction type of the search instruction, and store a correspondence between the instruction type and a preferred intelligence engine type, and select an IoT device based on the correspondence.

Abstract: In one embodiment, the disclosed apparatus is an in-situ, closed-loop bubble and foam detection and reduction system that includes a liquid-level sensor to determine a volume of a liquid in a fluid reservoir, a mass-detection device to determine a mass of the fluid reservoir and any liquid contained within the fluid reservoir, a processor electrically coupled to the liquid-level sensor and the mass-detection device to determine an actual volume of the liquid within the fluid reservoir, and a showerhead coupled to the processor and positioned above the fluid reservoir. The showerhead is activated by the processor when a volume of the liquid determined by the liquid-level sensor exceeds the actual volume of the liquid by a predetermined amount. Other apparatuses and methods are disclosed.

Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Abstract: A cloud server including a communication interface; and at least one processor configured to: detect a plurality of IoT devices connected to the cloud server from the communication interface, based on detecting the plurality of IoT devices connected to the cloud server, determine that the plurality of IoT devices are equipped with a corresponding plurality of intelligence engines, read and store a plurality of intelligence engine types of the plurality of intelligence engines, obtain a plurality of online states of the plurality of IoT devices, receive a search instruction sent from a receiving IoT device of the plurality of IoT devices, identify an instruction type of the search instruction, and store a correspondence between the instruction type and a preferred intelligence engine type, and select an IoT device based on the correspondence.

Abstract: A method and an apparatus for sharing an application are provided. The method includes determining whether a target device is located in a communication range of a source device, and in response to the determining that the target device is located in the communication range of the source device, establishing a wireless connection to the target device. The method further includes transmitting, to the target device, a list of shareable applications providable by the source device, receiving, from the target device, a request to access an application among the shareable applications, executing the application, generating a window instance of the executed application for the target device, and transmitting the window instance to the target device.

Abstract: Various embodiments herein relate to methods and apparatus for electroplating metal on a substrate. In many cases, an electroplating process may be monitored to ensure that it is operating within a pre-defined processing window. This monitoring may involve application of a controlled potential between the substrate and a reference electrode after the electroplating process is substantially complete (e.g., after recessed features on the substrate are substantially filled). The current delivered to the substrate during application of the controlled potential is monitored, and a peak current is determined. This peak current, often referred to herein as the potential-controlled exit peak current, can be compared against an expected range to determine whether the electroplating process is operating as desired.

Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Abstract: Various embodiments herein relate to methods and apparatus for electroplating metal on a substrate. In many cases, an electroplating process may be monitored to ensure that it is operating within a pre-defined processing window. This monitoring may involve application of a controlled potential between the substrate and a reference electrode after the electroplating process is substantially complete (e.g., after recessed features on the substrate are substantially filled). The current delivered to the substrate during application of the controlled potential is monitored, and a peak current is determined. This peak current, often referred to herein as the potential-controlled exit peak current, can be compared against an expected range to determine whether the electroplating process is operating as desired.

Abstract: A method of controlling an application of a smart device, by the smart device, is provided. The method includes generating a composition window by compositing windows of applications of the smart device, and transmitting the composition window to a smart terminal on which the composition window is displayed. The method further includes receiving, from the smart terminal, information of a user input in the smart terminal with respect to the displayed composition window, and controlling and displaying at least one among the applications based on the received information of the user input.

Abstract: A method and an apparatus for sharing an application are provided. The method includes determining whether a target device is located in a communication range of a source device, and in response to the determining that the target device is located in the communication range of the source device, establishing a wireless connection to the target device. The method further includes transmitting, to the target device, a list of shareable applications providable by the source device, receiving, from the target device, a request to access an application among the shareable applications, executing the application, generating a window instance of the executed application for the target device, and transmitting the window instance to the target device.

Abstract: A method of controlling an application of a smart device, by the smart device, is provided. The method includes generating a composition window by compositing windows of applications of the smart device, and transmitting the composition window to a smart terminal on which the composition window is displayed. The method further includes receiving, from the smart terminal, information of a user input in the smart terminal with respect to the displayed composition window, and controlling and displaying at least one among the applications based on the received information of the user input.

Abstract: Disclosed is an embedded network proxy system, including a receiving module, a processing module and a storage module. By configuring information of a preferred website, a wireless network is connected using the Third Generation (3G) protocol, the Fourth Generation (4G) protocol and even Wireless Fidelity (WiFi) in advance, and related contents of the preferred website are downloaded in a local storage module. Thus, even the network signal is poor or a user is in an offline state, the user can browse website information by visiting the locally stored related contents of the preferred website as well. Also disclosed is an operating method for an embedded network proxy system, and disclosed is a terminal device including the embedded proxy system.