Patents by Inventor Quan Qi
Quan Qi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11502010Abstract: Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.Type: GrantFiled: October 1, 2016Date of Patent: November 15, 2022Assignee: Intel CorporationInventors: Quan Qi, Carlton E. Hanna
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Publication number: 20220104346Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.Type: ApplicationFiled: April 21, 2021Publication date: March 31, 2022Inventors: Mark J. Beesley, Meng Chi Lee, Nima Shahidi, Hao Shi, Quan Qi
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Patent number: 11119048Abstract: A highly integrated, fully automatic chemiluminescence detection equipment and its operation method are disclosed. The chemiluminescence detection equipment comprises a control module, a first electrical machine, a reagent wheel disc tank, a sampling module, a washing module, a second electrical machine and a detection module. Compared with the traditional large-scale chemiluminescence detection equipment, the chemiluminescence detection equipment of the present invention has the advantage of high integration, and greatly reduces the overall volume and weight of the chemiluminescence detection equipment.Type: GrantFiled: December 7, 2018Date of Patent: September 14, 2021Assignee: SHAOXING PUSHKANG BIOTECHNOLOGY CO., LTD.Inventors: Lin Cheng, Chun-Yan Liu, Ya-Xiong Zhang, Xi-Jiang Qian, Quan-Qi Yang, Xian-Hua Wang, Hui Xu, Bo Yu, Ye-Qi Jin
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Publication number: 20210133817Abstract: An information recommendation method and apparatus are provided. The method includes: acquiring, by using an open interface of a first network platform, relational data information of a user associated with a user of a second network platform; dividing, according to the relational data information of the user, each friendship circle obtained by dividing according to a preset division policy, so as to divide one friendship circle into a plurality of different social circles; and recommending, by using a preset recommendation policy, information in each of the social circles according to an acquired behavior record of each user on the second network platform. The embodiments of the present invention further provide an information recommendation apparatus. In the embodiments, information can be recommended by using an interface and user data that are open on a social website to increase accuracy of information recommendation.Type: ApplicationFiled: December 2, 2020Publication date: May 6, 2021Inventors: Zhihong Qiu, Quan Qi
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Publication number: 20200349175Abstract: An address search method and device, includes acquiring address search request information, determining to-be-found destination address information included in the address search request information, splitting the destination address information into at least one piece of sub-address information, where the destination address information is formed by multiple pieces of sub-address information, and the multiple pieces of sub-address information respectively correspond to different address types, matching the at least one piece of sub-address information or the at least one piece of sub-address information and the destination address information with different address information included in an address database, where each piece of address information stored in the address database includes different sub-address information that forms the address information, and setting address information that is obtained by matching and whose match degree is greater than a set threshold as found destination address informatiType: ApplicationFiled: July 15, 2020Publication date: November 5, 2020Inventors: Quan Qi, Jiulong Zhang, Hang Li
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Patent number: 10783171Abstract: An address search method and device, includes acquiring address search request information, determining to-be-found destination address information included in the address search request information, splitting the destination address information into at least one piece of sub-address information, where the destination address information is formed by multiple pieces of sub-address information, and the multiple pieces of sub-address information respectively correspond to different address types, matching the at least one piece of sub-address information or the at least one piece of sub-address information and the destination address information with different address information included in an address database, where each piece of address information stored in the address database includes different sub-address information that forms the address information, and setting address information that is obtained by matching and whose match degree is greater than a set threshold as found destination address informatiType: GrantFiled: January 4, 2017Date of Patent: September 22, 2020Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Quan Qi, Jiulong Zhang, Hang Li
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Publication number: 20200096449Abstract: A highly integrated, fully automatic chemiluminescence detection equipment and its operation method are disclosed. The chemiluminescence detection equipment comprises a control module, a first electrical machine, a reagent wheel disc tank, a sampling module, a washing module, a second electrical machine and a detection module. Compared with the traditional large-scale chemiluminescence detection equipment, the chemiluminescence detection equipment of the present invention has the advantage of high integration, and greatly reduces the overall volume and weight of the chemiluminescence detection equipment.Type: ApplicationFiled: December 7, 2018Publication date: March 26, 2020Inventors: LIN CHENG, CHUN-YAN LIU, YA-XIONG ZHANG, XI-JIANG QIAN, QUAN-QI YANG, XIAN-HUA WANG, HUI XU, BO YU, YE-QI JIN
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Publication number: 20190221488Abstract: Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.Type: ApplicationFiled: October 1, 2016Publication date: July 18, 2019Inventors: Quan QI, Carlton E. HANNA
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Patent number: 10332821Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.Type: GrantFiled: August 13, 2018Date of Patent: June 25, 2019Assignee: Intel IP CorporationInventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
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Publication number: 20190067163Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.Type: ApplicationFiled: August 13, 2018Publication date: February 28, 2019Applicant: Intel IP CorporationInventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
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Patent number: 10103088Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a die disposed on a first substrate, at least one component adjacent the die on the first substrate, a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding material, a second substrate, wherein the first substrate is disposed on a top surface of the second substrate, and at least one communication structure disposed on a surface of the second substrate.Type: GrantFiled: March 29, 2017Date of Patent: October 16, 2018Assignee: Intel IP CorporationInventors: Quan Qi, Brian R. Butcher, Carlton E. Hanna, Hong Wei Hu
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Publication number: 20180286780Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a die disposed on a first substrate, at least one component adjacent the die on the first substrate, a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding material, a second substrate, wherein the first substrate is disposed on a top surface of the second substrate, and at least one communication structure disposed on a surface of the second substrate.Type: ApplicationFiled: March 29, 2017Publication date: October 4, 2018Applicant: Intel IP CorporationInventors: Quan Qi, Brian R. Butcher, Carlton E. Hanna, Hong Wei Hu
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Publication number: 20180286815Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a shielding structure disposed on a surface of a package structure, wherein the shielding structure comprises a film; a conductive material disposed on a surface of the film; and a plurality of conductive bars, wherein each individual conductive bar of the plurality of conductive bars is disposed through the film, and at least a portion of the plurality of conductive bars is physically coupled with grounding traces disposed on the surface of the package structure.Type: ApplicationFiled: March 30, 2017Publication date: October 4, 2018Applicant: Intel IP CorporationInventors: Quan Qi, Carlton E. Hanna
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Patent number: 10049961Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.Type: GrantFiled: March 30, 2017Date of Patent: August 14, 2018Assignee: Intel IP CorporationInventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
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Publication number: 20170116224Abstract: An address search method and device, includes acquiring address search request information, determining to-be-found destination address information included in the address search request information, splitting the destination address information into at least one piece of sub-address information, where the destination address information is formed by multiple pieces of sub-address information, and the multiple pieces of sub-address information respectively correspond to different address types, matching the at least one piece of sub-address information or the at least one piece of sub-address information and the destination address information with different address information included in an address database, where each piece of address information stored in the address database includes different sub-address information that forms the address information, and setting address information that is obtained by matching and whose match degree is greater than a set threshold as found destination address informatiType: ApplicationFiled: January 4, 2017Publication date: April 27, 2017Inventors: Quan Qi, Jiulong Zhang, Hang Li
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Publication number: 20150324448Abstract: An information recommendation processing method and apparatus, where the method includes: acquiring an information set, where the information set includes multiple pieces of to-be-recommended information, and the to-be-recommended information includes a time stamp that is used to identify generation time of the to-be-recommended information; dividing, according to information about an information recommendation time range and the time stamps corresponding to the multiple pieces of to-be-recommended information, the multiple pieces of to-be-recommended information in the information set into to-be-recommended information within the range and to-be-recommended information out of the range; and determining, among the to-be-recommended information within the range, to-be-recommended information used for recommendation. In this case, a time stamp of the information is taken into consideration for information recommended to the user, thereby achieving high timeliness of the information recommended to the user.Type: ApplicationFiled: July 9, 2015Publication date: November 12, 2015Inventors: Zhihong Qiu, Quan Qi
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Patent number: 9006877Abstract: A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.Type: GrantFiled: October 31, 2008Date of Patent: April 14, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Don Michael, Mari J. Rossman, Bradley Bower, Charles Craig Haluzak, John R. Sterner, Quan Qi, John Kane
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Publication number: 20140330653Abstract: An information recommendation method and apparatus are provided. The method includes: acquiring, by using an open interface of a first network platform, relational data information of a user associated with a user of a second network platform; dividing, according to the relational data information of the user, each friendship circle obtained by dividing according to a preset division policy, so as to divide one friendship circle into a plurality of different social circles; and recommending, by using a preset recommendation policy, information in each of the social circles according to an acquired behavior record of each user on the second network platform. The embodiments of the present invention further provide an information recommendation apparatus. In the embodiments, information can be recommended by using an interface and user data that are open on a social website to increase accuracy of information recommendation.Type: ApplicationFiled: July 17, 2014Publication date: November 6, 2014Inventors: Zhihong Qiu, Quan Qi
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Patent number: 8839276Abstract: Embodiments of the present invention provide an open application programming interface selection method and device. The method includes: receiving an invocation request from a user, where the invocation request includes an OpenAPI function parameter; determining an OpenAPI equivalent set according to the OpenAPI function parameter; and selecting a target OpenAPI from multiple OpenAPIs according to a Qos attribute value that corresponds to each OpenAPI in the OpenAPI equivalent set. By adopting the embodiments of the present invention, an OpenAPI with better performance can be selected from numerous OpenAPIs with equivalent functions for a user, thereby improving the quality of service for the user.Type: GrantFiled: November 15, 2013Date of Patent: September 16, 2014Assignee: Huawei Technologies Co., Ltd.Inventors: Hongbo Jin, Youliang Yan, Quan Qi, Shizhan Chen
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Publication number: 20140075460Abstract: Embodiments of the present invention provide an open application programming interface selection method and device. The method includes: receiving an invocation request from a user, where the invocation request includes an OpenAPI function parameter; determining an OpenAPI equivalent set according to the OpenAPI function parameter; and selecting a target OpenAPI from multiple OpenAPIs according to a Qos attribute value that corresponds to each OpenAPI in the OpenAPI equivalent set. By adopting the embodiments of the present invention, an OpenAPI with better performance can be selected from numerous OpenAPIs with equivalent functions for a user, thereby improving the quality of service for the user.Type: ApplicationFiled: November 15, 2013Publication date: March 13, 2014Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Hongbo JIN, Youliang YAN, Quan QI, Shizhan CHEN