Patents by Inventor Quan Qi

Quan Qi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11502010
    Abstract: Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: November 15, 2022
    Assignee: Intel Corporation
    Inventors: Quan Qi, Carlton E. Hanna
  • Publication number: 20220104346
    Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.
    Type: Application
    Filed: April 21, 2021
    Publication date: March 31, 2022
    Inventors: Mark J. Beesley, Meng Chi Lee, Nima Shahidi, Hao Shi, Quan Qi
  • Patent number: 11119048
    Abstract: A highly integrated, fully automatic chemiluminescence detection equipment and its operation method are disclosed. The chemiluminescence detection equipment comprises a control module, a first electrical machine, a reagent wheel disc tank, a sampling module, a washing module, a second electrical machine and a detection module. Compared with the traditional large-scale chemiluminescence detection equipment, the chemiluminescence detection equipment of the present invention has the advantage of high integration, and greatly reduces the overall volume and weight of the chemiluminescence detection equipment.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: September 14, 2021
    Assignee: SHAOXING PUSHKANG BIOTECHNOLOGY CO., LTD.
    Inventors: Lin Cheng, Chun-Yan Liu, Ya-Xiong Zhang, Xi-Jiang Qian, Quan-Qi Yang, Xian-Hua Wang, Hui Xu, Bo Yu, Ye-Qi Jin
  • Publication number: 20210133817
    Abstract: An information recommendation method and apparatus are provided. The method includes: acquiring, by using an open interface of a first network platform, relational data information of a user associated with a user of a second network platform; dividing, according to the relational data information of the user, each friendship circle obtained by dividing according to a preset division policy, so as to divide one friendship circle into a plurality of different social circles; and recommending, by using a preset recommendation policy, information in each of the social circles according to an acquired behavior record of each user on the second network platform. The embodiments of the present invention further provide an information recommendation apparatus. In the embodiments, information can be recommended by using an interface and user data that are open on a social website to increase accuracy of information recommendation.
    Type: Application
    Filed: December 2, 2020
    Publication date: May 6, 2021
    Inventors: Zhihong Qiu, Quan Qi
  • Publication number: 20200349175
    Abstract: An address search method and device, includes acquiring address search request information, determining to-be-found destination address information included in the address search request information, splitting the destination address information into at least one piece of sub-address information, where the destination address information is formed by multiple pieces of sub-address information, and the multiple pieces of sub-address information respectively correspond to different address types, matching the at least one piece of sub-address information or the at least one piece of sub-address information and the destination address information with different address information included in an address database, where each piece of address information stored in the address database includes different sub-address information that forms the address information, and setting address information that is obtained by matching and whose match degree is greater than a set threshold as found destination address informati
    Type: Application
    Filed: July 15, 2020
    Publication date: November 5, 2020
    Inventors: Quan Qi, Jiulong Zhang, Hang Li
  • Patent number: 10783171
    Abstract: An address search method and device, includes acquiring address search request information, determining to-be-found destination address information included in the address search request information, splitting the destination address information into at least one piece of sub-address information, where the destination address information is formed by multiple pieces of sub-address information, and the multiple pieces of sub-address information respectively correspond to different address types, matching the at least one piece of sub-address information or the at least one piece of sub-address information and the destination address information with different address information included in an address database, where each piece of address information stored in the address database includes different sub-address information that forms the address information, and setting address information that is obtained by matching and whose match degree is greater than a set threshold as found destination address informati
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: September 22, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Quan Qi, Jiulong Zhang, Hang Li
  • Publication number: 20200096449
    Abstract: A highly integrated, fully automatic chemiluminescence detection equipment and its operation method are disclosed. The chemiluminescence detection equipment comprises a control module, a first electrical machine, a reagent wheel disc tank, a sampling module, a washing module, a second electrical machine and a detection module. Compared with the traditional large-scale chemiluminescence detection equipment, the chemiluminescence detection equipment of the present invention has the advantage of high integration, and greatly reduces the overall volume and weight of the chemiluminescence detection equipment.
    Type: Application
    Filed: December 7, 2018
    Publication date: March 26, 2020
    Inventors: LIN CHENG, CHUN-YAN LIU, YA-XIONG ZHANG, XI-JIANG QIAN, QUAN-QI YANG, XIAN-HUA WANG, HUI XU, BO YU, YE-QI JIN
  • Publication number: 20190221488
    Abstract: Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.
    Type: Application
    Filed: October 1, 2016
    Publication date: July 18, 2019
    Inventors: Quan QI, Carlton E. HANNA
  • Patent number: 10332821
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: June 25, 2019
    Assignee: Intel IP Corporation
    Inventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
  • Publication number: 20190067163
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 28, 2019
    Applicant: Intel IP Corporation
    Inventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
  • Patent number: 10103088
    Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a die disposed on a first substrate, at least one component adjacent the die on the first substrate, a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding material, a second substrate, wherein the first substrate is disposed on a top surface of the second substrate, and at least one communication structure disposed on a surface of the second substrate.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: October 16, 2018
    Assignee: Intel IP Corporation
    Inventors: Quan Qi, Brian R. Butcher, Carlton E. Hanna, Hong Wei Hu
  • Publication number: 20180286780
    Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a die disposed on a first substrate, at least one component adjacent the die on the first substrate, a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding material, a second substrate, wherein the first substrate is disposed on a top surface of the second substrate, and at least one communication structure disposed on a surface of the second substrate.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 4, 2018
    Applicant: Intel IP Corporation
    Inventors: Quan Qi, Brian R. Butcher, Carlton E. Hanna, Hong Wei Hu
  • Publication number: 20180286815
    Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a shielding structure disposed on a surface of a package structure, wherein the shielding structure comprises a film; a conductive material disposed on a surface of the film; and a plurality of conductive bars, wherein each individual conductive bar of the plurality of conductive bars is disposed through the film, and at least a portion of the plurality of conductive bars is physically coupled with grounding traces disposed on the surface of the package structure.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 4, 2018
    Applicant: Intel IP Corporation
    Inventors: Quan Qi, Carlton E. Hanna
  • Patent number: 10049961
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: August 14, 2018
    Assignee: Intel IP Corporation
    Inventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
  • Publication number: 20170116224
    Abstract: An address search method and device, includes acquiring address search request information, determining to-be-found destination address information included in the address search request information, splitting the destination address information into at least one piece of sub-address information, where the destination address information is formed by multiple pieces of sub-address information, and the multiple pieces of sub-address information respectively correspond to different address types, matching the at least one piece of sub-address information or the at least one piece of sub-address information and the destination address information with different address information included in an address database, where each piece of address information stored in the address database includes different sub-address information that forms the address information, and setting address information that is obtained by matching and whose match degree is greater than a set threshold as found destination address informati
    Type: Application
    Filed: January 4, 2017
    Publication date: April 27, 2017
    Inventors: Quan Qi, Jiulong Zhang, Hang Li
  • Publication number: 20150324448
    Abstract: An information recommendation processing method and apparatus, where the method includes: acquiring an information set, where the information set includes multiple pieces of to-be-recommended information, and the to-be-recommended information includes a time stamp that is used to identify generation time of the to-be-recommended information; dividing, according to information about an information recommendation time range and the time stamps corresponding to the multiple pieces of to-be-recommended information, the multiple pieces of to-be-recommended information in the information set into to-be-recommended information within the range and to-be-recommended information out of the range; and determining, among the to-be-recommended information within the range, to-be-recommended information used for recommendation. In this case, a time stamp of the information is taken into consideration for information recommended to the user, thereby achieving high timeliness of the information recommended to the user.
    Type: Application
    Filed: July 9, 2015
    Publication date: November 12, 2015
    Inventors: Zhihong Qiu, Quan Qi
  • Patent number: 9006877
    Abstract: A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: April 14, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Don Michael, Mari J. Rossman, Bradley Bower, Charles Craig Haluzak, John R. Sterner, Quan Qi, John Kane
  • Publication number: 20140330653
    Abstract: An information recommendation method and apparatus are provided. The method includes: acquiring, by using an open interface of a first network platform, relational data information of a user associated with a user of a second network platform; dividing, according to the relational data information of the user, each friendship circle obtained by dividing according to a preset division policy, so as to divide one friendship circle into a plurality of different social circles; and recommending, by using a preset recommendation policy, information in each of the social circles according to an acquired behavior record of each user on the second network platform. The embodiments of the present invention further provide an information recommendation apparatus. In the embodiments, information can be recommended by using an interface and user data that are open on a social website to increase accuracy of information recommendation.
    Type: Application
    Filed: July 17, 2014
    Publication date: November 6, 2014
    Inventors: Zhihong Qiu, Quan Qi
  • Patent number: 8839276
    Abstract: Embodiments of the present invention provide an open application programming interface selection method and device. The method includes: receiving an invocation request from a user, where the invocation request includes an OpenAPI function parameter; determining an OpenAPI equivalent set according to the OpenAPI function parameter; and selecting a target OpenAPI from multiple OpenAPIs according to a Qos attribute value that corresponds to each OpenAPI in the OpenAPI equivalent set. By adopting the embodiments of the present invention, an OpenAPI with better performance can be selected from numerous OpenAPIs with equivalent functions for a user, thereby improving the quality of service for the user.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: September 16, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Hongbo Jin, Youliang Yan, Quan Qi, Shizhan Chen
  • Publication number: 20140075460
    Abstract: Embodiments of the present invention provide an open application programming interface selection method and device. The method includes: receiving an invocation request from a user, where the invocation request includes an OpenAPI function parameter; determining an OpenAPI equivalent set according to the OpenAPI function parameter; and selecting a target OpenAPI from multiple OpenAPIs according to a Qos attribute value that corresponds to each OpenAPI in the OpenAPI equivalent set. By adopting the embodiments of the present invention, an OpenAPI with better performance can be selected from numerous OpenAPIs with equivalent functions for a user, thereby improving the quality of service for the user.
    Type: Application
    Filed: November 15, 2013
    Publication date: March 13, 2014
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hongbo JIN, Youliang YAN, Quan QI, Shizhan CHEN