Abstract: A manufacturing method for a vapor chamber, a vapor chamber and a middle frame vapor chamber are disclosed. The manufacturing method for a vapor chamber includes preparing different raw materials for various parts of the vapor chamber, and machining and molding the various parts according to predetermined shapes of the various parts by using corresponding raw materials, assembling the machined and molded various parts of the vapor chamber, and welding and sealing the assembled various parts of the vapor chamber, performing a surface heat treatment on the vapor chamber, performing a passivating treatment on the vapor chamber, assembling the vapor chamber, injecting water into the vapor chamber assembled with the liquid injection pipe, vacuumizing the vapor chamber injected with water, performing a sealing treatment on the vacuumized vapor chamber, and welding the vapor chamber with a reinforcing rib.

Abstract: The disclosure provides a method for preparing a porous wick, including the steps of: a) preparing an first electrolyte, which is an aqueous solution including 0.5-1.8 mol/L sulfuric acid and 0.1-0.5 mol/L copper sulfate; b) preparing a second electrodeposition electrolyte, which is an aqueous solution including 0.2-0.9 mol/L sulfuric acid and 0.4-0.9 mol/L copper sulfate; c) cleaning the surface of a metal substrate with a mixed solution of a surfactant and a basic compound, activating with dilute hydrochloric acid, and then rinsing; and d) carrying out a first elctrodeposition on the treated substrate in the first electrodeposition electrolyte, and then carrying out the second electrodeposition in the second electrodeposition electrolyte, wherein the second electrodeposition current density is smaller than the first electrodeposition current density.

Abstract: The disclosure provides a preparation method of a porous copper alloy wick, including the steps of: a) preparing an electrolyte, which is an aqueous solution including 0.5-1.8 mol/L sulfuric acid and 0.1-0.5 mol/L copper sulfate; b) cleaning with a mixed solution of a surfactant and a basic compound, activating with dilute hydrochloric acid and then cleaning the surface of a copper alloy substrate; c) forming a porous structure on the substrate by electrodeposition on the treated substrate in the electrolyte; and d) washing with water, drying and then sintering the product obtained in step c). By the method of the disclosure, the porous structure with the specific arrangement, excellent capillary force and permeability can be directly obtained on the surface of the substrate, which is good for the transmission of the working liquid.