Abstract: Automatic semiconductor part handler. In one aspect the handler includes a source of parts and a transfer mechanism for transferring a part from the source to a belt assembly. The belt assembly includes a belt, a belt displacement controller, and an image forming device for forming an image of the part with respect to a desired end point. The belt displacement controller is coupled to the belt to move the belt based upon the image of the part with respect to the desired end point, thereby positioning the part in a precise location with respect to the direction of motion of the input belt.

Abstract: Automatic seminconductor part handler. In one aspect the handler includes a source of parts and a transfer mechanism for transferring a part from the source to a belt assembly. The belt assembly includes a belt, a belt displacement controller, and an image forming device for forming an image of the part with respect to a desired end point. The belt displacement controller is coupled to the belt to move the belt based upon the image of the part with respect to the desired end point, thereby positioning the part in a precise location with respect to the direction of motion of the input belt.

Abstract: A station for testing electrical devices under elevated and depressed temperature conditions, said devices being transported through and tested in the station while held in coordinated planar sets. The planarly arranged sets of devices are sequentially placed upon a platen movable along three mutually orthogonal axes. A test head has a plurality of electrical device contactors in planar arrangement corresponding to the arrangement of the devices sets. At least one axis along which the platen moves is orthogonal to a general plane of the contactors for establishing parallel contact between the devices and the contactors. During testing each of the leads of the devices resting upon the platen are electrically contacted by a contactor. The leads of the full set of electrical devices can be contacted simultaneously, or the leads can be contacted in subsets depending upon the capacity of the test head.